JPS59173357U

JPS59173357U - Printed board

Info

Publication number: JPS59173357U
Application number: JP6687183U
Authority: JP
Inventors: 哲朗後藤; 浩輔増田
Original assignee: 株式会社ニコン
Priority date: 1983-05-06
Filing date: 1983-05-06
Publication date: 1984-11-19
Also published as: JPH0223007Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図〜第３図は従来例を示し、第１′図ａはフレキシ
ブルプリント基板の表面図、同すは裏面図、第２図は第
１図におけぬ■−■断面図、第３図は第１図における正
面図である。第４図及び第５図は本考案の第１実施例を
示し、第４図ａはフレキシブルプリント基板の表面図、
同すは裏面図、第５図は第４図における正面図である。第６図及び、第７図は本考案の第２実施例を赤し、第６
図ａはフキシブルプリント基板の表面図、同すは裏面図
、第７図は第６図における正面図である。〔主要部分の符号の説明〕、１０・・・フレキシブルプ
リント基板、１２・・・ベースフィルム、１４゜１６・
・・リード線、１８．　２０−・・カバーフィルム、２
６．２８・・・端子用パターン、４０，４２．５０ａ〜
５０ｅ、５２ａ〜５２ｅ・・・めっき用リードパターン
。1 to 3 show a conventional example, FIG. The figure is a front view in FIG. 1. 4 and 5 show the first embodiment of the present invention, FIG. 4a is a surface view of the flexible printed circuit board,
5 is a back view, and FIG. 5 is a front view of FIG. 4. Figures 6 and 7 show the second embodiment of the present invention in red;
Figure a is a front view of the flexible printed circuit board, the same is a back view, and Figure 7 is a front view of Figure 6. [Explanation of symbols of main parts], 10...Flexible printed circuit board, 12...Base film, 14°16.
...Lead wire, 18. 20-...Cover film, 2
6.28...Terminal pattern, 40, 42.50a~
50e, 52a to 52e... Lead patterns for plating.

Claims

[Claims for Utility Model Registration] 1. Lead wires are wired on both the front and back sides of the base board, and a portion of the lead wires on the front and back sides are used as a terminal pattern, and the terminal pattern is plated. is provided with a lead pattern for plating exposed on the edge of the base substrate, and the lead pattern for plating on the front side of the base substrate and the lead pattern for plating on the back side of the base substrate are prevented from overlapping on the front and back sides. A printed circuit board characterized by: , 2. The printed circuit board according to claim 1, wherein the plating lead pattern is formed to have the narrowest width among the wiring patterns of the printed circuit board! 3. The printed circuit board according to claim 2, wherein the plating lead patterns are bent in opposite directions on the front and back sides of the base board so that they do not overlap on the front and back sides of the base board.