JPS59172288A - Printed board unit - Google Patents
Printed board unitInfo
- Publication number
- JPS59172288A JPS59172288A JP4627883A JP4627883A JPS59172288A JP S59172288 A JPS59172288 A JP S59172288A JP 4627883 A JP4627883 A JP 4627883A JP 4627883 A JP4627883 A JP 4627883A JP S59172288 A JPS59172288 A JP S59172288A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- spring
- module component
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野 ゛
本発明はモジュール部品とマザープリント基板とからな
るプリント基板装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board device comprising a module component and a mother printed circuit board.
従来例の構成とその問題点
第１図は従来のプリント基板装置の構成部品を示す斜視
図、第２図はその要部断面図である。Structure of a conventional example and its problems FIG. 1 is a perspective view showing the components of a conventional printed circuit board device, and FIG. 2 is a sectional view of the main part thereof.
以下にこの従来例の構成について図面とともに説明する
。モジュール部品１のプリント板端子２をマザープリン
ト基板３の上に設けである挿入穴４に挿入し、その状態
で導体２′、６を半田ディツプなどで半田付け６し一体
化する。この際プリント板端子２と挿入穴４は互いにリ
ジッドな材料であるから、嵌合部に間隙７が生じ、しっ
くりとした挿入状態が得られず−モジュール部品とマザ
ープリント基板との間で外部からの衝撃、撮動等により
がたつきが生じる。このがたつきが半田付は時に溶けた
半田が再び固まる直前に起きると、半田のルーズ不良や
イモ付は不良につながるという欠点があった。The configuration of this conventional example will be explained below with reference to the drawings. The printed board terminal 2 of the module component 1 is inserted into the insertion hole 4 provided on the mother printed board 3, and in this state, the conductors 2' and 6 are soldered 6 using a solder dip or the like to be integrated. At this time, since the printed circuit board terminal 2 and the insertion hole 4 are made of rigid materials, a gap 7 is created at the mating part, making it difficult to achieve a secure insertion condition. Shakiness may occur due to impact, photography, etc. When this wobbling occurs during soldering, sometimes just before the melted solder solidifies again, there is a drawback that it can lead to loose solder defects and failures in the soldering process.
発明の目的
本発明はこの様な欠点を除去するもので一半田付は時の
構成部品相互のがたつきを無くし、良好な半田付部をも
つプリント基板装置を提供することを目的とする。OBJECTS OF THE INVENTION It is an object of the present invention to eliminate such drawbacks, and to provide a printed circuit board device which eliminates rattling between component parts during soldering and has good soldered parts.
発明の構成
本発明は以上に述べた目的を達成するために、モジュー
ル部品の端子をマザープリント基板の挿入穴に挿入する
に際し、バネ部材を介して挿入するもので、このバネ部
材の弾性によりモジュール部品の端子と挿入穴とが機械
的に固定され、その結果、溶融半田が固まる時にも、構
成部品相互のがたつきが起らず、良好な半田付は部が得
られるものである。SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention is such that when a terminal of a module component is inserted into an insertion hole of a mother printed circuit board, the terminal is inserted through a spring member, and the elasticity of this spring member causes the module to The terminal of the component and the insertion hole are mechanically fixed, and as a result, even when the molten solder hardens, the component parts do not wobble with each other, and good soldering can be achieved.
実施例の説明
以下に本発明の実施例について１図面とともに説明する
。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to one drawing.
第３図において８はモジュール部品１のプリント板端子
の導体部２′を覆う形で形成されたバネで−これがマザ
ープリント基板３の挿入穴４に挿入され、バネ圧で機械
的に固定される。第４図はその要部断面図である。この
場合、バネ８の一部を導体部２′に半田等であらかじめ
電気接続しておくことにより、マザープリント基板３に
対しモジュール部品１の抜きさしが容易となる。In Fig. 3, 8 is a spring formed to cover the conductor portion 2' of the printed board terminal of the module component 1 - this is inserted into the insertion hole 4 of the mother printed board 3, and is mechanically fixed by the spring pressure. . FIG. 4 is a sectional view of the main part. In this case, by electrically connecting a portion of the spring 8 to the conductor portion 2' by soldering or the like in advance, the module component 1 can be easily inserted into and removed from the mother printed circuit board 3.
第５図は本発明の他の実施例の斜視図であり。FIG. 5 is a perspective view of another embodiment of the invention.
マザープリント基板３の挿入穴４の周縁に沿ってバネ９
を予じめ装着し、その後モジュール部品１を挿入し、バ
ネ圧で機械的に固定するもので、第６図はモジー−ル挿
入後の要部の断面図である。A spring 9 is attached along the periphery of the insertion hole 4 of the mother printed circuit board 3.
is installed in advance, and then the module component 1 is inserted and fixed mechanically by spring pressure. FIG. 6 is a sectional view of the main part after the module is inserted.
上記したように本発明のプリント基板装置は一リジッド
な材料で構成されたプリント板端子２と挿入穴４との間
に生ずるがたつきをバネ８又はバネ９で規制しようとす
るもので、これにより半田付時の振動、衝撃等によるが
たつきが無くなり。As described above, the printed circuit board device of the present invention is intended to suppress rattling occurring between the printed circuit board terminal 2 made of a rigid material and the insertion hole 4 using the spring 8 or the spring 9. This eliminates rattling caused by vibration and impact during soldering.
その結果半田付のルーズ不良、イモ付不良が発生しなく
なる。As a result, loose soldering and soldering defects will no longer occur.
な瓦・上記二つの実施例におけるバネの構造は導体部２
′あるいは導体部６毎に独立して設けられているが一第
７図、第８図のように、プラスチック６７−・
等の非導電性材料１０．１２で、バネ１１．１３を連結
した構造でもよい。・The structure of the spring in the above two embodiments is the conductor part 2.
'Or, although each conductor part 6 is provided independently, as shown in Figs. But that's fine.
発明の効果
本発明は以上のような構成であり、モジュール部品とマ
ザープリント基板との嵌合時のがたつきをバネの圧力で
抑制するので、半田付時に溶融した半田が接合部の間隙
に侵入し、充填され１次いで半田が固化する間、がたつ
きが発生せず、半田付のルーズ不良、イモ付は不良のな
い良好な半田接合部が得られる。Effects of the Invention The present invention has the above-described configuration, and since the looseness when the module component and the mother printed circuit board are fitted is suppressed by the pressure of the spring, the molten solder during soldering is prevented from entering the gap between the joints. While the solder penetrates, fills, and then solidifies, no rattling occurs, and a good solder joint is obtained without loose solder defects or solder sticking defects.
第１図は従来のプリント基板装置の構成部品を示す斜視
図、第２図はその要部断面図、第３図は本発明の一実施
例におけるプリント基板装置の斜視図、第４図はその要
部断面図、第５図は本発明の第２の実施例の斜視図、第
６図はその要部断面図、第７図、第８図は本発明の他の
実施例に用いる構成部品の斜視図である。
２・・・・・・プリント板端子、４・・・・・・挿入穴
、８・・・・・・バネ、９・・・・・・バネ−１０、１
２・−・・・・非導電性材料。
υページ
１１．１３・・・・・・バネ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第２
図
１
第３図
第６図
第４図
第８図FIG. 1 is a perspective view showing the components of a conventional printed circuit board device, FIG. 2 is a sectional view of its main parts, FIG. 3 is a perspective view of a printed circuit board device according to an embodiment of the present invention, and FIG. 5 is a perspective view of the second embodiment of the present invention, FIG. 6 is a sectional view of the main part, and FIGS. 7 and 8 are components used in other embodiments of the present invention. FIG. 2... Printed board terminal, 4... Insertion hole, 8... Spring, 9... Spring-10, 1
2.--Non-conductive material. υPage 11.13... Spring. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 1 Figure 3 Figure 6 Figure 4 Figure 8
Claims (1)
けられた上記モジュール部品の端子に対応する挿入穴と
の間隙に、バネ部材を配してなるプリント基板装置。 ＠）バネ部材をモジュール部品の端子を覆う形で形成し
てなる特許請求の範囲第１項記載のプリント基板装置。 （３）ハネ部材をマザープリント基板の挿入穴ノ周縁に
嵌合してなる特許請求の範囲第１項記載のプリント基板
装置。 （４）バネ部材は非導電性材料で連結されている特許請
求の範囲第１項記載のプリント基板装置。 （５）バネ部材の一部をモジュール部品あるいはマザー
プリント基板の導電部にあらかじめ電気接続してなる特
許請求の範囲第１項記載のプリント基板装置。 ２ 、。 ペー〕／[Scope of Claims] (1) A printed circuit board device in which a spring member is disposed in a gap between a terminal of a module component and an insertion hole provided in a mother printed circuit board that corresponds to the terminal of the module component. @) The printed circuit board device according to claim 1, wherein the spring member is formed to cover the terminal of the module component. (3) The printed circuit board device according to claim 1, wherein the spring member is fitted to the periphery of the insertion hole of the mother printed circuit board. (4) The printed circuit board device according to claim 1, wherein the spring members are connected using a non-conductive material. (5) The printed circuit board device according to claim 1, wherein a part of the spring member is electrically connected in advance to a conductive part of a module component or a mother printed circuit board. 2. page] /
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4627883A JPS59172288A (en) | 1983-03-18 | 1983-03-18 | Printed board unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4627883A JPS59172288A (en) | 1983-03-18 | 1983-03-18 | Printed board unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59172288A true JPS59172288A (en) | 1984-09-28 |
Family
ID=12742759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4627883A Pending JPS59172288A (en) | 1983-03-18 | 1983-03-18 | Printed board unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172288A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61108193A (en) * | 1984-11-01 | 1986-05-26 | 松下電器産業株式会社 | Flexible wiring board and manufacture thereof |
| JPH0818188A (en) * | 1994-06-29 | 1996-01-19 | Nec Niigata Ltd | Connectorless printed board connection mechanism |
| JP2010027412A (en) * | 2008-07-22 | 2010-02-04 | Hitachi Ltd | Connection structure between printed wiring boards |
| AT504960B1 (en) * | 2007-01-31 | 2012-11-15 | Siemens Ag | ARRANGEMENT OF A FIRST CIRCUIT ON A SECONDARY CIRCUIT |
| WO2017002720A1 (en) * | 2015-06-29 | 2017-01-05 | 三菱電機株式会社 | Electronic device |
| CN109196961A (en) * | 2016-06-08 | 2019-01-11 | 三菱电机株式会社 | The connection structure of printed base plate |
-
1983
- 1983-03-18 JP JP4627883A patent/JPS59172288A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61108193A (en) * | 1984-11-01 | 1986-05-26 | 松下電器産業株式会社 | Flexible wiring board and manufacture thereof |
| JPH0363831B2 (en) * | 1984-11-01 | 1991-10-02 | Matsushita Electric Ind Co Ltd | |
| JPH0818188A (en) * | 1994-06-29 | 1996-01-19 | Nec Niigata Ltd | Connectorless printed board connection mechanism |
| AT504960B1 (en) * | 2007-01-31 | 2012-11-15 | Siemens Ag | ARRANGEMENT OF A FIRST CIRCUIT ON A SECONDARY CIRCUIT |
| JP2010027412A (en) * | 2008-07-22 | 2010-02-04 | Hitachi Ltd | Connection structure between printed wiring boards |
| WO2017002720A1 (en) * | 2015-06-29 | 2017-01-05 | 三菱電機株式会社 | Electronic device |
| CN109196961A (en) * | 2016-06-08 | 2019-01-11 | 三菱电机株式会社 | The connection structure of printed base plate |
| CN109196961B (en) * | 2016-06-08 | 2021-03-16 | 三菱电机株式会社 | Connection structure of printed substrate |
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