JPS59171131A - Method for testing semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To increase the efficiency of measurement of the titled integrated circuit by a method wherein a plurality of probing needles, which can be selectively moved in vertical direction, are provided on a substrate in matrix form, said substrate is placed on the semiconductor wafer whereon a plurality of ICs are formed, and electric characteristics are tested by moving the desired probe needle using a control system and have the probe needle to come in contact with the IC chip. CONSTITUTION:The lower substrate 2-1, whereon a number of probe needles 3 which can be telescopically moved facing downward are provided in matrix form, is placed on the semiconductor wafer 1 whose electric characteristics are going to be tested. Then, the upper substrate 2-2 having a number of vertically movable press pins 4, to be used to push out the desired probe 3, is provided on the lower substrate 2-1, and the probe 3 is pushed out and brought to come in contact with the measuring point of the wafer 1 using a probe needle driving control system 5 through the intermediary of an air cylinder 7 and a pipe 8. Subsequently, the electric characteristics of the measuring point is measured using the measuring system 6 which is connected to the substrate 2-1.

Description

[Detailed Description of the Invention] (a) Field of Totally Closed Techniques The present invention relates to a test method for semiconductor integrated circuits, and particularly relates to a test method for inspecting the electrical characteristics of semiconductors. It is.

(b) The backbone of the technology is generally] B1, which manufactures semiconductor devices such as J9T and ST.
In one culm, a large number of semiconductor devices -f (chips) are manufactured on -1 sheets of semiconductor turmeric, and then these are cut into chips. 1) 7L pieces/! Ll'
,) Whether the chip is good or defective f, -1-
,, :l-Tuxuruwehachi” Nick] There are two culms.

(C) Prior Art and Problems The above-mentioned knee hachi-1 technology is equipped with a device called I-Fupa Rover (IY followed by Zorob force-F-18:
1' Search for rope car I [1 fl J body tip prescribed? &
[(Pad) 'td (ki*lI) when in contact with the
′! jt+ check is performed, and the following) 1) Primary index, transfer 11111I, 'C1) p is set, and measurements are made for all chips in line 7tI-) and -C.

However, with the diversification of semiconductor devices, the pattern of the "-1" conductor element and the 1,000-inch method also tend to become diversified. Therefore, correspondingly, measurement C (= used 7)'
The number of types of Robe Carts has also increased, resulting in an increase in the number of Robe Carts (1'v1-1'v1-Pu Cart Yellow) and the problem that it takes time and effort to replace cards during measurement. At the same time, Nuteshi (
Since it is necessary to move the table on which the wafer is placed by at least the number of chips/ζ on the semiconductor wafer, there is a problem in that it is time consuming and has a poor rate of work.

(・t) Purpose of the Invention The purpose of the present invention is to solve these problems,
Bu1 by variety. There is no need to replace the J-bar, and all chips can be efficiently measured at once without the corresponding index movement of the chips on the 7'vl-bar. Different varieties with different values can be measured at the same time. The purpose is to provide test documentation methods for semiconductor integrated circuits.

(0) Structure of the Invention To achieve the object f/C, the test writing method for semiconductor integrated circuits of the present invention is to selectively press a plurality of 10-buttons in a 17-tricks shape [11L ! The prepared substrate is placed on a semiconductor wafer+ on which a plurality of semiconductor integrated circuits are formed, and desired probe needles are selectively moved upward by a control system.
It is characterized by testing the electrical characteristics of the conductive integrated circuit by moving the conductive integrated circuit in contact with the pads of each semiconductor integrated circuit.

(f') Embodiment 1 of the invention - Regarding the test writing method for semiconductor integrated circuits of the sewage invention -C
Figure 1 is a schematic exploded perspective view for explaining a one-test method for a semiconductor integrated circuit according to an embodiment of the present invention. ] is a semiconductor wafer, 2-1 is a semiconductor wafer, 2-2 is a 1-part substrate, and 3 is a lower substrate, which are arranged in a 71-round shape.
1-immovable probe needle, 1 is arranged on the lower board corresponding to the probe tip [-: '-1;-i+J
A dynamic presser pin, 5 is a thread in the 10-bar device, and 6 is a Y↓1 thread in the prober device.
Temperature characteristics γ11: ] Fixed thread, 7 is air cylinder system, 8
Figure A shows the pipe. tlI/i is made as above/
This substrate 2 is used to measure the electrical characteristics of a semiconductor wafer. The substrate 2 is set at a predetermined position of -f= (conductor wafer placed on the conductor wafer). P'C
i Durham force -1-' is applied to the semiconductor wafers l-, l- through the air cylinder, tar thread 7 and vibrator 8 by the heavy paper signal command of the nH1 program card attached to the probe ♀1 drive control system hK. The desired lower substrate 2-2 corresponding to the rose i11 of each chip (FIG. 3)
The presser pin 4 is moved to the top by an air drive, and as shown in FIG. It contacts the pad 11 of each chip. Each chip is then measured by the electrical property measuring thread 6 without moving the mesh 10.

The electrical characteristics of each chip were measured 111μ times, and the characteristics of each chip were all checked at once. Once the electrical characteristics of each chip have been checked, the drive control system 5 moves the presser pin 4 to one side, and
ll-G 3 is attached to B+12-C semiconductor tool-H1
It is detached from above. Furthermore, when measuring the 1/1 unit of the ``ITF'' characteristic of the ζ21' conductor, the corresponding controller and card are connected to the drive control system 5.
By replacing the probe needles with 1 and 1, the desired probe needles are brought into contact with each pad of the 10 conductors in exactly the same way.
It is possible to measure by Note that the substrate 2 described below may be manufactured as a single unit 17 without being divided into two parts.

(／υ 41・、Effectiveness of the Ming Dynasty since the Sung dynasty. This saves the cost of the lobe car 1-, and there is no need to move the index to each J-g, and the measurement t1. ．． The shortening between li is the river “1
In addition, it is possible to measure different types of products at the same time by placing one on top of the J-Ha, which improves efficiency.
It is something to do. The Naoki embodiment is an example.
This does not limit the scope of the present invention (・:1).

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram for explaining the test method for semiconductor hT times 1 according to an embodiment of the present invention, approximately 9 pl, perspective view 1 nu 1
, Figure 2 shows the result of mounting board 2 on a prober.
A partially sectional perspective view for clarity, and Fig. 3 shows a part 1υi i', Ni
It's a diagonal congratulations l. In the figure, 1 is a semiconductor wafer, 2←1, nail plate, :3
tma probe movement control system, 6 (bow-'; 43: air characteristic measurement system, 7 one L cylinder thread, 8 vibe, 9 id so °l'-
Bar,] 0 is Nudage, Jl is Butt, 1.2fd,
Show the wings.

Claims (1)

[Claims] A plurality of semiconductor integrated circuits are formed on a substrate on which a plurality of Brozots having l+J motion are selectively arranged in a matrix in 11-! Place it on a semiconductor unihat, and connect it to the control system.
1] Testing the electrical characteristics of the 1-conductor integrated circuit by selectively moving a desired 10-pocket up and bringing it into contact with a pad of each semiconductor integrated circuit. Test method.