JPS59159593A - Method of producing metal printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention The present invention provides a metal printed circuit board, such as an aluminum printed circuit board, in which an insulating film is provided on at least one side of a thin metal plate, wiring is formed on the second side of the insulating film, and a hole for a lead wire is formed. It's about how to do it.

FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG.

In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum back plate 10, the loop is a wiring made of copper formed on the insulating film 2, and 4 is a rectangular terminal made of copper connected to the wiring slot. Department.

Such aluminum printed circuit boards have good heat dissipation properties and can be easily deformed, so they have recently begun to be widely used.

FIG. 6 is a plan view showing a state in which electronic elements are attached to the aluminum printed circuit board shown in FIGS. 1 and 2, and FIG. 4 is a front sectional view of the same. In the figure, 5 is an electronic element, 6 is a plate-shaped terminal of the electronic element 5, and the plate-shaped terminal 6 is attached to the terminal portion 4 with solder.

As described above, in the conventional aluminum printed circuit board, several electronic elements 5 having plate-shaped terminals 6 can be attached, but electronic elements having lead wires cannot be attached thereto. Further, it is impossible to add electronic elements to the back 1 m of the aluminum printed circuit board, that is, the surface where the insulating film 2 is provided and which is not -C.

In order to solve this problem, the aluminum printed circuit board as shown in FIG. 5 is omitted. In the figure, 7 is wiring 3
8 is a water hole provided in the terminal portion 7, 9 is a resin filled in the water hole 8, and 10 is a lead wire hole provided in the center of the resin 9. It is.

In this aluminum printed circuit board, as shown in FIG. 6, if the lead wire 11 is inserted into the wire hole 1o and the lead wire 11 is connected to the terminal part 7 with a wire holder 12,
It is possible to add more electronic elements 1 with lead wires 11, and it is also possible to insert the lead wires 11 into the lead wire holes 10 from the direction opposite to that shown in the figure, so it is possible to insert the electronic elements 13 on both sides. I can give you several examples.

An object of the present invention is to provide a method for manufacturing a metal printed circuit board that can easily and accurately manufacture a metal printed circuit board having holes for lead wires.

In order to achieve this object, in the present invention, a means for indicating the center position of the hole for the beam tong wire is made, a press die is made using the center position indicating means, and a thin metal plate is pressed using the press die. By doing so, a water hole is provided, the water hole is filled with resin, and a hole is made in the resin with a hole-drilling device using the center position indicating means, thereby forming a hole for the lead wire.

Finally, the method for manufacturing an aluminum printed circuit board according to the present invention will be explained in detail with reference to FIG. First, a substrate as shown in FIG. 7(a) is prepared, in which an insulating film 2 is provided on both sides of an aluminum thin plate 1, and a copper foil 14 is formed on the insulating film 2-1. Next, NC (nurserical control)
ol) Hole 10 for lead wire in drawing or film original
Create an NC tape with data on the center position. That N
By making a press mold using C tape and using the press mold to press a thin aluminum plate 1 having an insulating film 2 and a copper foil 14 provided on both sides, as shown in FIG. 7(b).
A water hole 8 is provided as shown in FIG. Next, Figure 7 (C)
As shown in FIG. 2, the water hole 8 is filled with resin 9 using a silk screen or a roller, and the resin 9 is cured by heat drying or ultraviolet rays. Next, attach the try film to the copper foil 14 soil,
After exposure and development, the copper foil 14 is etched to form the seventh layer.
As shown in Figure (d), wiring 6 and terminal portion 7 are formed.

Next, fix the board shown in FIG. 7(d) to a predetermined position on an NC drilling machine that will drill holes according to the instructions on the NC tag marked ``2'', and attach a trill with a diameter smaller than the diameter of the water hole 8 to the drilling machine. After drilling the hole, use the above drilling machine to drill a hole using the Kitaki NC tape as shown in Figure 7 (e).
), a lead wire hole 10 is provided in the center of the resin 9. Finally, the external shape is processed.

In this manufacturing method, focusing on the fact that the center line of the water hole 8 and the center line of the lead wire hole 10 match, a press mold is made using NC tape, and the press mold is used to form the water hole 8. Since the hole 10 for the lead wire is formed using the same NC tape and a drilling machine, the hole 10 for the lead wire can be formed in the center of the water hole 8 with high accuracy and very easily. Because the water holes 8 are created using a press mold, all the water holes 8 can be created at once.
It is possible to provide the water hole 8 in a short time.

In the above embodiment, the method for manufacturing an aluminum printed circuit board, that is, a printed circuit board in which the metal thin plate is the aluminum thin plate 1, has been described, but the metal thin plate may be iron, iron,
Copper or the like may also be used; if iron is used, a metal printed circuit board can be manufactured at low cost, and if copper is used, a metal printed circuit board with very good heat dissipation properties can be obtained. It is possible. - In the above-mentioned example, the wiring grooves were formed on both sides of the aluminum thin plate 10 using double-sided irrigation in which copper foil 14 was provided on both sides, or the wiring groove was formed on both sides of the aluminum thin plate 10, or the copper foil 14 was provided on one side. Wiring only on one side using water 6
may be formed. Further, in the above-described embodiment, an NC tape is used as a means for indicating the center position of the lead wire hole 10, but other means for indicating the center position may be used. In the double embodiment, a drilling machine was used as the drilling device, but other drilling devices may be used. Furthermore, in the above-mentioned embodiment, the lead 1/wire hole 10 was formed after the wiring groove and the terminal portion 7 were formed, but the wiring groove and the terminal portion 7 were formed after the lead wire hole 10 was formed. You may.

Further, in the above-described embodiment, a tri-film was used to form the wiring grooves and the terminal portion 7, but etching may be performed after full printing.

As explained above, in the method for manufacturing a metal printed circuit board according to the present invention, since the water hole and the lead wire hole are provided using the same center position indicating means, the lead wire hole is formed in the center of the water hole. can be provided accurately and very easily. Unfortunately, all the water holes can be installed at once, so it is possible to install the water holes in a short time. As described above, the effects of this invention are remarkable.

[Brief explanation of drawings]

Figure 1 is a plan view showing a part of a conventional aluminum bullet board, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 5 shows the aluminum printed circuit board shown in Figures 1 and 2. 4 is a front sectional view, FIG. 5 is a plan view showing an aluminum printed circuit board manufactured by the manufacturing method according to the present invention, and FIG. FIG. 5 is a front sectional view showing a state in which electronic elements are attached to an aluminum printed circuit board, and FIG. 7 is an explanatory view of the method for manufacturing a metal printed circuit board according to the present invention. 1 Aluminum thin plate 2 - Insulating film 6 - Wiring 8 - Water hole 9 - Resin 10 - Hole for Riet wire 14 - Copper foil agent Patent attorney Naka Iki Book October 13, 1981 1! Indication of the case of Mr. J. Patent Application No. 33829 filed in 1980. Relationship with the case of the person amending the manufacturing method of a metal printed circuit board. Contents of the amendment (7) by the patent applicant's representative. The entire specification is attached in the appendix. Correct it as follows. Description 1, Name of the invention Method for manufacturing a metal printed circuit board 2, Claims An insulating film is provided on at least one side of a thin metal plate, a wiring layer is formed on the insulating film, and a hole for a lead wire is provided. In the method of manufacturing a metal printed circuit board, a center position indicating means for the lead wire hole is created, a press mold is made using the center position indicating means, and a thin metal plate is pressed using the press mold. By making a through hole,
A method for producing a metal printed circuit board, characterized in that the hole for the lead wire is provided by filling the through hole with resin and drilling a hole in the resin with a hole punching device using the center position indicating means. 3. Detailed Description of the Invention This invention provides a metal printed circuit board, such as an aluminum printed circuit board, in which an insulating film is provided on at least one side of a thin metal plate, a wiring layer is formed on the insulating film, and a hole for a lead wire is provided. The present invention relates to a method of manufacturing a substrate. FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG. In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum thin plate 1, 6 is a wiring layer made of copper formed on the insulating film 2, and 4 is a button part of the wiring j so 3. Such aluminum grid substrates have good heat dissipation properties and can be easily deformed, so they have recently begun to be used extensively. FIG. 6 is a plan view showing a state in which electronic elements are attached to the aluminum printed circuit board shown in FIGS. 1 and 2, and FIG. 4 is a front sectional view of the same. In the figure, 5 is an electronic element, 6 is a plate-shaped terminal of the electronic element 5, and the plate-shaped terminal 6 is attached to the button part 4 with solder. As described above, in the conventional aluminum printed circuit board, an electronic element 5 having a plate-shaped terminal 6 can be attached, but an electronic element having a lead wire cannot be attached thereto. Furthermore, it is impossible to attach electronic elements to the back surface of the aluminum printed silver plate, that is, the surface on which the insulating film 2 is not provided. In order to solve this problem, an aluminum printed circuit board as shown in FIG. 5 has been considered. In the figure, 7 is the button part of the wiring layer filter, 8il-1 is the through hole provided in the button part 7, 9 is the resin filled in the through hole 8, and 10 is for the lead wire provided in the center of the resin 9. It's a hole. In this aluminum printed circuit board, as shown in FIG. 6, electronic elements 15 having lead wires 11 are attached by inserting them into the lead wire holes 10 and connecting the lead wires 11 to the button part 7 with solder 12. Since it is also possible to insert the lead wire 11 into the lead wire hole 1o from the direction opposite to that shown in the figure, the electronic element 1 can be attached to both sides. An object of the present invention is to provide a method for manufacturing a metal printed circuit board that can easily and accurately manufacture a metal printed circuit board having holes for lead wires. In order to achieve this object, in this invention, a means for indicating the center position of the lead wire hole is made, a press die is made using the center position one line indicating means, and a thin metal plate is pressed using the press die. A through hole is formed by machining, the through hole is filled with resin, and a hole is made in the resin by a hole punching device using the center position indicating means to form a hole for a two-way wire. Next, the method for manufacturing an aluminum printed circuit board according to the present invention will be described in detail with reference to FIG. First, a substrate as shown in FIG. 7(a) is prepared, in which an insulating film 2 is provided on both sides of an aluminum thin plate 1, and a copper foil 14 is formed on the insulating film 2. Next, N C (numerical co+
trot) Create an NC tape with data on the center position of the lead wire hole 10 using the film original that has been edited. Next, a press mold was made using the NC tape 9, and an insulating film 2 was formed on both sides using the press mold. By pressing the thin aluminum plate 1 provided with the copper foil 14, a through hole 8 is provided as shown in FIG. 7(b). Next, as shown in FIG. 7(C), the through hole 8 is filled with resin 9 using printing or a roller, and the resin 9 is cured by heat drying or ultraviolet rays. Next, a dry film is pasted on the copper foil 14, exposed and developed, and then the copper foil i4 is etched to form a wiring layer as shown in No. 71ffl(d)K. Next, follow the instructions on the NC tape and place the holes in the predetermined position of the NC drilling machine as shown in Figure 7(d).
After fixing the board shown in and attaching a drill with a diameter smaller than the diameter of the through hole 8 to the hole board,
If you make holes using the above hole board using C tape, 1. As shown in FIG. 7(e), a lead wire hole 10 is provided in the center of the resin 9. Finally, the external shape is processed. In this manufacturing method, focusing on the fact that the center line of the through hole 8 and the center line of the lead wire hole 10 match, a press mold is made using NC tape, and the press mold is Since the through hole 8 is provided and the lead wire hole 10 is formed by a drilling machine using the same NC tape, the lead wire hole 10 can be formed in the center of the through hole 8 with high accuracy and very easily. Since the through holes 8 are formed using a press mold, all the through holes 8 can be formed at once, so the through holes 8 can be formed in a short time. In the above embodiment, the method for manufacturing an aluminum printed circuit board, that is, a printed circuit board in which the metal thin plate is the aluminum thin plate 1, has been described, but the metal thin plate may be iron, iron,
Copper or the like may also be used; if iron is used, a metal printed circuit board can be manufactured at low cost, and if copper is used, a metal printed circuit board with very good heat dissipation properties can be obtained. be. However, in the above-mentioned embodiment, the aluminum thin plate 1 is formed using a double-sided aqueous phase with copper foil 14 provided on both sides.
Although the wiring layer 6 is formed on both sides of the wiring layer 3, the wiring layer 3 may be formed only on one side by using a method in which the copper foil 14 is provided on both sides or one side. Further, in the above embodiment, an NC tape is used as the center position indicating means of the lead wire hole 10, but other center position indicating means may be used. Also,
In the dual embodiment, a drill press is used as the drilling device, although other drilling devices may be used. Furthermore, in the above embodiment, the lead wire holes 10 are formed after the wiring layer 3 is formed, but the wiring layer grooves may be formed after the lead wire holes 10 are formed. In the above-described embodiment, a dry film was used to form the wiring layer, but etching may be performed after printing the ink. As explained above, in the method for manufacturing a metal printed circuit board according to the present invention, the through hole and the lead wire hole are provided using the same center position indicating means, so the lead wire hole is formed in the center of the through hole. It can be installed accurately and very easily. be able to. Since all the through holes can be provided at once, it is possible to provide the through holes in a short time. As described above, the effects of this invention are remarkable. 4. Brief explanation of the drawings Figure 1 is a plan view showing a part of a conventional aluminum printed circuit board, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 3 is similar to Figures 1 and 2. FIG. 4 is a front sectional view, FIG. 5 is a plan view showing an aluminum printed circuit board manufactured by the manufacturing method according to the present invention, and FIG. The figure is a front cross-sectional view showing the state in which electronic elements are attached to the aluminum printed circuit board shown in FIG. 5, and FIG. 7 is an explanatory diagram of the method for manufacturing the metal printed circuit board according to the present invention. 1. Thin aluminum plate 2. Insulating film Wiring layer 8. Through hole 9. Resin 10. Hole for lead wire 14. Copper foil patent attorney Junnosuke Nakatoshi

Claims (1)

[Claims] In a method for manufacturing a metal printed circuit board in which an insulating film is provided on at least one side of a thin metal plate, wiring is formed on the insulating film, and a hole for a lead wire is provided, the center position indicating means for the lead wire hole is provided. A press mold is made using the center position indicating means, a base hole is created by pressing a thin metal plate using the press mold, and the base hole is filled with resin. - A metal pre-printer characterized in that the hole for the lead wire is provided by drilling a hole in the resin with a hole-drilling device using a position indicating means.
1. Method of manufacturing the board.