JPS5915503Y2 - lead bonder - Google Patents
lead bonderInfo
- Publication number
- JPS5915503Y2 JPS5915503Y2 JP1978160517U JP16051778U JPS5915503Y2 JP S5915503 Y2 JPS5915503 Y2 JP S5915503Y2 JP 1978160517 U JP1978160517 U JP 1978160517U JP 16051778 U JP16051778 U JP 16051778U JP S5915503 Y2 JPS5915503 Y2 JP S5915503Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- thermocompression
- bonder
- water conduit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
本考案は回路基板の電極バットに外部引出し用リード端
子を熱圧着でボンディングしてなるり−ドボンダーの改
良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a bonder in which an external lead terminal is bonded to an electrode butt of a circuit board by thermocompression bonding.
回路部品例えばハイブリッドＩＣにおいては第１図に示
す如く、回路基板１の両側面に電極パッド２，２′を形
成し、該パッド２，２′より夫々リード端子３，３′を
熱圧着して外部に引出すタイプのものがある。In a circuit component such as a hybrid IC, as shown in FIG. 1, electrode pads 2 and 2' are formed on both sides of a circuit board 1, and lead terminals 3 and 3' are thermocompressed from the pads 2 and 2', respectively. There is a type that pulls out outside.
このような場合、リード３，３′はその取扱い性を良く
するため連結片４，４′により連結されたリードフレー
ムパターンとして一枚板から打抜き形成される。In such a case, the leads 3, 3' are punched out from a single plate as a lead frame pattern connected by connecting pieces 4, 4' to improve their handling properties.
５は位置出し用の穴である。5 is a hole for positioning.
第１図の如き回路部品においてバット２，２′の夫々に
リード端子３，３′を熱圧着する場合、従来は第２図に
概略側する如く、基板支持用ピン６上に支持された回路
基板１のバット面に片側のリード端子３を重ね熱圧着子
７でボンディングした後、キャリア８で平行移動させて
今度はもう片側のリード端子３′を対応バット上に重ね
た上で再度熱圧着子７でポンチ゛イングしていた。When thermocompression bonding the lead terminals 3, 3' to the butts 2, 2' in a circuit component as shown in FIG. After stacking the lead terminals 3 on one side on the butt surface of the board 1 and bonding them with the thermocompression tool 7, move them in parallel with the carrier 8, and then stack the lead terminals 3' on the other side on the corresponding butt and bond them again with thermocompression. I was punching with a child of 7.
このように従来のリードボンダーはリード端子３．３′
を片側ずつポンチ゛イングする構成であった。In this way, the conventional lead bonder has a lead terminal of 3.3'
The configuration was such that punching was performed on one side at a time.
リード端子３，３′を同時ボンディングするには熱圧着
子７を三叉形状にし、回路基板１上の実装、部品を跨い
で両側のパッド２，２′に対応するようにすれば良いが
、これによると該熱圧着子の輻射熱により実装部品が故
障する危険が大であり、特に小形な回路基板の場合には
使用することが困難であった。In order to bond the lead terminals 3 and 3' at the same time, it is possible to make the thermocompression joint 7 into a three-pronged shape so that it can span the mounting and components on the circuit board 1 and correspond to the pads 2 and 2' on both sides. According to the publication, there is a high risk that mounted components will break down due to the radiant heat of the thermocompression bonder, and it is difficult to use it particularly in the case of small circuit boards.
本考案は上記従来の欠点を解決するもので、この目的は
前記熱圧着子の二叉部分の空間に導水管が位置し、該導
水管により前記実装部品を冷却する構成としたリードボ
ンダーにより遠戚できる。The present invention is intended to solve the above-mentioned conventional drawbacks, and its purpose is to provide a lead bonder with a structure in which a water conduit is located in the space between the forked parts of the thermocompression bonder, and the mounted component is cooled by the water conduit. I can relate.
以下本考案の一実施例を第３図〜第５図を参照しながら
詳述する。An embodiment of the present invention will be described in detail below with reference to FIGS. 3 to 5.
第３図と第４図は本考案に係るリードボンダーを示す正
面図と側面図である。3 and 4 are a front view and a side view of the lead bonder according to the present invention.
図において、１０は二叉形状の圧着部１１を有する熱圧
着子、１２は導水管、１３は基板平行出し装置、１４は
基台である。In the figure, 10 is a thermocompression bonder having a fork-shaped crimping part 11, 12 is a water conduit, 13 is a substrate parallelization device, and 14 is a base.
熱圧着子１０は図示を省略したが支持部１５に上下動自
在に装着され、導水管１２は支持部材１６を介して部品
搭載用の基板部１７に固定されている。Although not shown, the thermocompression bonder 10 is attached to a support member 15 so as to be movable up and down, and the water conduit 12 is fixed via a support member 16 to a base plate 17 for mounting components.
又、導水管には図示の如く圧着部１１の二叉空間内を通
っており、その周囲には熱伝導性が良い三角断面の金属
部材１８が接合し、且つその両端には冷水を流出させる
ための図示せぬホースが接続する。In addition, as shown in the figure, the water conduit passes through the forked space of the crimp part 11, and a metal member 18 having a triangular cross section with good thermal conductivity is joined around the conduit, and cold water flows out from both ends of the conduit. A hose (not shown) is connected.
基板部１７には対の支持部材１９が固定され、その間に
部品保持部材を送る回転ローラ２０が設けである。A pair of support members 19 are fixed to the substrate portion 17, and a rotating roller 20 for feeding the component holding member is provided between them.
部品保持部材は第５図Ａ。Ｂに一部分を拡大示す如く、
回路基板１の支持板２１（太い実線で示す）とリード端
子３，３′の抑え板２２（細い一点鎖線で示す）からな
る。The component holding member is shown in FIG. 5A. As shown in part B,
It consists of a support plate 21 for the circuit board 1 (indicated by a thick solid line) and a holding plate 22 for the lead terminals 3 and 3' (indicated by a thin dashed line).
支持板２１は第１図の如きリード端子３，３′のリード
パターンが複数連なった状態の帯状リードパターン２３
（細い実線で概略量する）を装着する枠部材として形成
されている。The support plate 21 has a strip-shaped lead pattern 23 in which a plurality of lead patterns of lead terminals 3, 3' are connected as shown in FIG.
(approximately indicated by the thin solid line).
すなわち、両側の連結片２４．２５と複数の仕切り片２
６が一体となって複数の枠が形成されている。That is, the connecting pieces 24 and 25 on both sides and the plurality of partition pieces 2
6 are integrated to form a plurality of frames.
各枠内には連結片２４．２５から延出した基板支持部２
７を有し、その自由端部に部品を実装した状態の回路基
板１（細い点線で示す）の位置出し用凹部２８を備えて
いる。Inside each frame is a board support part 2 extending from a connecting piece 24, 25.
7, and its free end is provided with a recess 28 for positioning the circuit board 1 (indicated by a thin dotted line) on which components are mounted.
又、基板支持部２７の平面部分には穴５（第１図参照）
が嵌入する突起２９を有する。In addition, a hole 5 (see Fig. 1) is provided in the planar part of the board support part 27.
It has a protrusion 29 into which it fits.
そして、凹部２８内に回路基板１の両端を位置させて基
板支持部２７により保持し、この上に穴５と突起２９を
嵌合させて帯状リードパターン２３を覆せ、回路基板１
のバットの夫々に対応するリード端子３，３′が重なる
ように取付ける。Then, both ends of the circuit board 1 are positioned in the recess 28 and held by the board support part 27, and the hole 5 and the protrusion 29 are fitted thereon to cover the strip lead pattern 23, and the circuit board 1
The lead terminals 3 and 3' corresponding to each bat are attached so as to overlap.
この状態で抑え板２２の突起２９に対応する穴（図示せ
ぬ）を通して帯状リードパターン２３を支持板２１に押
付ける。In this state, the strip-shaped lead pattern 23 is pressed against the support plate 21 through a hole (not shown) corresponding to the protrusion 29 of the holding plate 22.
このようにして複数枚の回路基板１と帯状リードパター
ン２３を部品保持部材に取付け、これを何枚も用意して
おく。In this way, a plurality of circuit boards 1 and strip-shaped lead patterns 23 are attached to the component holding member, and a number of these are prepared.
そして、該部品保持部材をローラ２０により一定ピッチ
で順次送り熱圧着子１０でボンディングする。Then, the component holding member is sequentially fed by a roller 20 at a constant pitch and bonded by a thermocompression bonder 10.
このボンディングの際、回路基板１は基板平行出し装置
１３のピン３０により各ボンディング個所が支持された
状態で行なわれる。During this bonding, the circuit board 1 is supported at each bonding location by the pins 30 of the board parallelization device 13.
ピンは上下に摺動自在となっており、ボンディング圧が
一定値以上になるとへつこむようになっている。The pin is able to slide up and down, and is recessed when the bonding pressure exceeds a certain value.
以上の如く、本考案のり一ドボンダーによれば導水管に
よりボンディングの際の輻射熱を弱めることができ、実
装部品の熱故障を防ぐことができ、良好な２列同時ボン
ディングが可能となる。As described above, according to the adhesive bonder of the present invention, the radiant heat during bonding can be weakened by the water conduit, thermal failure of mounted components can be prevented, and good simultaneous bonding of two rows can be performed.
第１図は回路基板にリード端子を熱圧着ボンディングし
た状態を示す斜視図、第２図は従来のリードボンダーの
概略図、第３図と第４図は本考案に係るリードボンダー
を一部省略して示す正面図と側面図、第５図は本考案に
係る部品保持部材の一部分を示すもので、Ａは平面図、
ＢはＡ図の破断線ｂ・・・・・・ｂ′の矢示方向に見た
断面図である。
符号の説明 １・・・・・・回路基板、２．２′・・・
・・・電極パッド、３，３′・・・・・・リード端子、
１０・・・・・・熱圧着子、１２・・・・・・導水管。Fig. 1 is a perspective view showing a state in which lead terminals are thermocompression bonded to a circuit board, Fig. 2 is a schematic diagram of a conventional lead bonder, and Figs. 3 and 4 partially omit the lead bonder according to the present invention. A is a front view and a side view, and FIG. 5 shows a part of the component holding member according to the present invention, A is a plan view,
B is a sectional view taken in the direction of the arrows along the breaking line b...b' in figure A. Explanation of symbols 1...Circuit board, 2.2'...
...electrode pad, 3,3'...lead terminal,
10...Thermocompression bonder, 12... Water conduit pipe.
Claims (1)
極バットに対し外部引出し用リード端子を同時ポンチ゛
イングしてなるリードホンダ−で゛あって、前記熱圧着
子の三叉部分の空間に導水管が位置し、該導水管により
前記電極バット間の前記回路基板上に実装された回路部
分を冷却する構成としたことを特徴とするリードボンダ
ーA lead honda is formed by simultaneously punching lead terminals for external extraction against electrode butts formed on both sides of a rotating board using a two-pronged thermocompression connector, and the lead terminal is punched into the space of the three-pronged portion of the thermocompression connector. A lead bonder characterized in that a water conduit is located, and the circuit part mounted on the circuit board between the electrode butts is cooled by the water conduit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978160517U JPS5915503Y2 (en) | 1978-11-21 | 1978-11-21 | lead bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978160517U JPS5915503Y2 (en) | 1978-11-21 | 1978-11-21 | lead bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5577851U JPS5577851U (en) | 1980-05-29 |
| JPS5915503Y2 true JPS5915503Y2 (en) | 1984-05-08 |
Family
ID=29154362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978160517U Expired JPS5915503Y2 (en) | 1978-11-21 | 1978-11-21 | lead bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5915503Y2 (en) |
-
1978
- 1978-11-21 JP JP1978160517U patent/JPS5915503Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5577851U (en) | 1980-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5915503Y2 (en) | lead bonder | |
| TWI237372B (en) | Leadframe for multi-chip package and method for manufacturing the same | |
| TWM252154U (en) | Electrical connector having pick up cap | |
| JP2641912B2 (en) | Lattice array type semiconductor device package | |
| CN219534522U (en) | Package structure, circuit structure and frame structure for manufacturing package structure | |
| JP3800889B2 (en) | Semiconductor device manufacturing method and semiconductor device | |
| JP2588956B2 (en) | Zigzag in-line type module and method of manufacturing zig-zag in-line type module | |
| JPH04266036A (en) | Semiconductor device in plastic package | |
| JP3036597B1 (en) | Lead frame for semiconductor device | |
| JPS6120526Y2 (en) | ||
| JPS6020947Y2 (en) | Hybrid IC | |
| JPS5844593Y2 (en) | Beam lead type semiconductor device | |
| JPH0537410Y2 (en) | ||
| JPH0735404Y2 (en) | Semiconductor device | |
| JPS5889953U (en) | hybrid circuit | |
| JPS6131625B2 (en) | ||
| JP2004193383A (en) | Soldered terminal and manufacturing method thereof | |
| JPS6322680Y2 (en) | ||
| JPS59158545A (en) | Lead frame | |
| KR970005128Y1 (en) | Surface Mount Memory Modules | |
| JPS6130748B2 (en) | ||
| JPH0557847U (en) | Thin film integrated circuit | |
| JP2003124651A (en) | Mounting structure of circuit substrate | |
| WO2017185344A1 (en) | Circuit board of wearable device, preparation method therefor, and wearable device | |
| JPS625652A (en) | Tape for mounting tape carrier semiconductor |