JPS59152656A - Semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate a bonding without shortcircuit and a standardization of a semiconductor device by forming the device of a film carrier having a plurality of wiring leads on both side surfaces of a film and a semiconductor chip in which wiring leads and electrodes are connected. CONSTITUTION:Wiring lead 2, 2' and bonding pads 3, 3' connected to one ends of the leads are provided on both side surfaces of a film 1. A resin film having 100mum of thickness is cut in width of 30mm., sprocket holes 7 and pellet holes 4 are punched at the film, and copper foils 8 are thermally press-bonded to both side surfaces of the film. Then, photoresists are coated on both side entire surfaces of the foils 8, and exposed via a pattern mask simultaneously on both side surfaces at every one frame. Unecessary copper is removed by etching to form a wiring pattern. Then, a gold plating is formed on the surface of the copper. Eventually, a wiring portion shortcircuited for plating is punched to obtain a film carrier.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and particularly to a semiconductor device using a film carrier.

Traditionally, as a method for mounting semiconductor chips on packages,
A wire bonding method uses aluminum or gold wire to bond directly to the case or Habase ribbon, and a method involves bonding to a film carrier with a patterned metal wiring pattern on a resin film and then mounting it on the package again. is used. Method using a film carrier - 1 This method is often applied to the bonding of semiconductor chips in multiple bins, which is inefficient in production, or when a number of semiconductor chips are mounted on one substrate to achieve high integration.

In the case of the film carrier method, electrical screening is usually performed after the tick is bonded to the film carrier and before mounting on the coupe, so the pad that makes contact with the electrical test wiring bin on the tester side or patterned on the film is used. .

These pads are arranged around the semiconductor chip in all directions or in a radial pattern, but as the number of terminals on the chip increases, the distances between pads and between the leads are shortened, and even more The required film area also increases. Therefore, in the past, failure modes such as short circuits or opens due to contact failures are likely to occur during the sorting process, and the film area for one frame varies depending on the number of pins used, making it impossible to standardize the film size.

FIG. 1 is a top view of the main part of a semiconductor chip connected to a conventional film carrier.

A plurality of wiring leads 2 are provided on the film 1, and a bonding pad 3 is provided at one end of each wiring lead 2. A bullet hole 4 is provided in the film 1. A semiconductor chip 5 is placed in this bullet hole 4, and the electrodes 6.5 of the semiconductor chip and the wiring 2 are connected.

In such a film carrier, as the number of electrodes 6 on the semiconductor chip increases, the distance between the pads 3 becomes narrower, and the band area also becomes smaller. This has the disadvantage that it is easy to short-circuit to some other pads.

The present invention eliminates the above-mentioned drawbacks, and provides a semiconductor device using a film carrier that prevents short circuits by widening the spacing between wiring leads and the spacing between bonding pads, and does not reduce the number of pins used.

The semiconductor device of the present invention includes a film carrier having a plurality of wiring leads on both sides of the film, and a semiconductor chip to which the wiring leads and electrodes are connected.

Next, embodiments of the present invention will be described using the drawings.

FIG. 2 is a top view of the main parts of an embodiment of the present invention.

Wiring leads 2, 2' and bonding pads 3, 3' connected to one end of the wiring leads 2, 2' are provided on both sides of the film 1. Number 2.3 is provided on the surface of the film, number 2'
, 3' indicate those provided on the back side of the film. By providing distribution leads and bonding pads on both sides in this way, the number of pads on one side can be halved, so the pad area can be increased, and the distance between pads can also be increased, making bonding work easier and preventing short circuits. . Furthermore,
Please select the pad area appropriately.
-It is also possible to standardize the size of the rear piece.

Next, a method for manufacturing the film and carrier used in the present invention will be explained.

FIG. 3(a), 0)) is a plan view and a cross-sectional view of the film carrier used in the present invention during the manufacturing process.
It is a front view.

First, a resin film with a thickness of 100 μm is cut out to a width of 35 rrm, sprocket holes 7 and pellet holes 4 are punched out, and then copper foils 8 are thermocompression bonded to both sides of the film.

Next, photoresist is applied to the entire surface of the copper foil on both sides, and each frame is exposed to light using each pattern mask at the same time on both sides.

Unnecessary copper is removed by etching to form a wiring pattern. After that, gold plating is applied to the copper surface. Finally, the wiring portion that was short-circuited for plating is punched out to obtain a film carrier.

As described above in detail, according to the present invention, bonding is easy, there is no short circuit, and standardization is easy. The effect is great because a semiconductor device using a film carrier can be obtained.

[Brief explanation of the drawing]

Fig. 1 is a top view of a conventional film carrier and a semiconductor chip connected thereto, Fig. 2 is a plan view of a main part of an embodiment of the present invention, and Figs. FIG. 2 is a plan view and a cross-sectional view of a film carrier used in the invention during a manufacturing process. 1...Film, 2.2'...Wiring lead, 3゜3'...Ponding pad, 4.
... Pellet hole, 5 ... Semiconductor chip, 6 ... Electrode, 7 ... Sprocket hole, 8 ... Copper foil. 1st Ward Figure 2 ((2) 3rd flash

Claims (1)

[Claims] A semiconductor device comprising: a film carrier having a plurality of wiring leads on both sides of the film; and a semiconductor chip to which the wiring leads and electrodes are connected.