JPS59146981U - small circuit module - Google Patents
small circuit moduleInfo
- Publication number
- JPS59146981U JPS59146981U JP4095583U JP4095583U JPS59146981U JP S59146981 U JPS59146981 U JP S59146981U JP 4095583 U JP4095583 U JP 4095583U JP 4095583 U JP4095583 U JP 4095583U JP S59146981 U JPS59146981 U JP S59146981U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- circuit module
- small circuit
- generate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
、 第１図は本考案の二実施例を示す回路モジュール
構成図、第２図は本考案の一実施例を示す回路モジュー
ルの構成斜視図である。
１・・・・・・発熱量が小さい半導体部品や回路部品、
２・・・・・・第１の配線基板、３・・・・・・発熱量
が大きい半導体部品や回路部品、４・・・・・・第２の
配線基板、８・・・・・・金属端子。1 is a configuration diagram of a circuit module showing two embodiments of the present invention, and FIG. 2 is a perspective view of the configuration of a circuit module showing one embodiment of the present invention. 1... Semiconductor parts and circuit parts with low heat generation,
2...First wiring board, 3...Semiconductor components or circuit components that generate a large amount of heat, 4...Second wiring board, 8... metal terminal.
Claims (1)
い第１の配線基板に、発熱量が大きい半導体部品や回路
部品を熱伝導率が大きく保護ケースを兼ねた第２の配線
基板にそれぞれ実装し、第２の配線基板上に第１の配線
基板を弾力性を有する金属端子を介して設置し、かつ該
端子をもって面配線基板を接続したことを特徴とする小
形回路モジュールSemiconductor components and circuit components that generate a small amount of heat are mounted on a first wiring board that has a low thermal conductivity, and semiconductor components and circuit components that generate a large amount of heat are mounted on a second wiring board that has a high thermal conductivity and also serves as a protective case. A small circuit module, characterized in that a first wiring board is installed on a second wiring board via an elastic metal terminal, and a surface wiring board is connected with the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4095583U JPS59146981U (en) | 1983-03-22 | 1983-03-22 | small circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4095583U JPS59146981U (en) | 1983-03-22 | 1983-03-22 | small circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59146981U true JPS59146981U (en) | 1984-10-01 |
Family
ID=30171555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4095583U Pending JPS59146981U (en) | 1983-03-22 | 1983-03-22 | small circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180690A (en) * | 1990-11-15 | 1992-06-26 | Matsushita Electric Works Ltd | Mounting board of power device |
-
1983
- 1983-03-22 JP JP4095583U patent/JPS59146981U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180690A (en) * | 1990-11-15 | 1992-06-26 | Matsushita Electric Works Ltd | Mounting board of power device |
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