JPS59145594A - Method of forming printed circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a print 1 to a wiring forming method for forming printed wiring on an arbitrary substrate.

[Prior art]

As methods for forming wiring, the foil etching method, additive method, die stamp method, Taston method, etc. are commonly used. ) was formed on top.

Therefore, it is necessary to process the conductor pattern in one direction with the base (substrate)! (a) The materials that can be used as the base (substrate) are very limited in terms of shape, material, and other aspects.

(b) In the case of small quantity production, the cost becomes extremely high.

There were other drawbacks.

(Purpose of the Invention) The present invention has been made to overcome the above-mentioned conventional drawbacks, and it is possible to select from a wide range of materials as a substrate to which a conductive pattern is bonded, and it also enables high-mix, low-volume production. It is an object of the present invention to provide a printed wiring forming method that makes it possible to reduce the manufacturing cost of printed wiring.

[Structure of the invention]

In the printed wiring forming method according to the present invention, after tacking one side of the conductor pattern to the sheet, the other side of the conductor pattern is specifically adhered, and then the conductor pattern is attached to the base while the conductor pattern is being attached to the base. The present invention is characterized in that wiring is formed on the base body to the printer 1 by removing the plate-attached sheet from the pattern.

[Example] Fig. 1 shows an example of a wiring forming method for a printer according to the present invention.

In the same figure (a), 1 is a transparent tacking sheet (J sheet) made of synthetic resin, etc., and 2 is a tacking set on one side of sheet 1 ().
The adhesive layer 3 is made of a foil-like conductor, one side of which is temporarily printed on the sheet 1 by the adhesive layer 2, and the conductor pattern 4 is a release sheet that determines the releasability. It is i. Reference numeral 5 denotes an adhesive layer provided on one surface of the release sheet 4, and the other surface of the conductor pattern 3 is adhered to the release sheet 4 by this adhesive layer 5.

The tacking sheet 1, the adhesive layer 2.5, the conductor pattern 3, and the stiffening sheet 4 as shown in FIG. can do.

In this method, first, a combination U as shown in FIG. 1(a) is prepared, and then a release sheet 4 is peeled off from the conductor pattern 3 as shown in FIG. 1(b). Then, the adhesive layer 5 remains on one side of the conductive pattern 3 and on the releasable part of the release sheet 4. Further, the conductive pattern 3 is still attached to the temporary clearance sheet 1 by the adhesive layer 2.

Next, as shown in the same figure (C), the conductor pattern 3 is adhered onto the desired base 6 using the adhesive layer 5, and then the conductor pattern 3 is left on the base 6 as shown in the same figure ((1)). Temporary wires 1 to 1 are removed from the conductor pattern 3 while the conductor pattern 3 remains in place.As a result, prints 1 to wiring are formed on the base 6.

In this example, since the temporary sheet 1 is transparent, when the conductor pattern 3 is attached to the base 6, the temporary sheet 1 is transparent.
= Looking at C conductor pattern 3 through J sheet 1 is C
Therefore, the positioning of the conductive pattern 3 with respect to the base 6 can be easily performed as i':J.

In this method, unlike the conventional method, the conductor pattern 3 is formed on the substrate 6 from the beginning. Since the wiring is formed to the print 1 by avoiding the transition to the substrate 6, there is no need to perform the 98 processes of the conductor pattern 3 integrally with the substrate 6, so it is possible to select from a wide range of materials as the substrate 6. .

Specifically, for example, the base 6 can be curved, and the conductor pattern 3 can be bonded to the case of an electronic device (that is, the case is referred to as the base 6). It becomes possible to form printed wiring on the case.

Further, by bonding the conductor pattern 3 to the substrate of the wiring to the print 1 formed by the conventional printed wiring forming method, it becomes possible to add desired wiring to the substrate. Figures 2 and 3 do not show one example of this type of application.

To explain this, in Fig. 2, the conductor pattern 3
is the structure shown in Fig. 1 above, and the tack is attached to the sea 1 to 1 (=
I'm being criticized. However, in this case, the adhesive layer 5 is imparted with electrical conductivity.

On the other hand, in FIG. 3, reference numerals 7 and 8 indicate printed wirings provided on one substrate 9 by the conventional wiring forming method, and these printed wirings 7 and 8 are connected to each other. If the connection mode is changed in various ways, each connection mode will have some holes or failures.

Note that 10 and 11 are conductor patterns constituting the printed wirings 7 and 8, respectively (only some of these conductor patterns are shown, and other parts are omitted).

In this application example, the conductor pattern 3 shown in FIG.
．． Glue it to a part of 11. Thereby, the print l-wirings 7 and 8 are electrically connected to each other via the conductor pattern 3J-3 and the adhesive layer 5.

Therefore, if a plurality of types of conductor patterns 3 are prepared according to various planned connection modes between the printed wirings 7 and 8, it is possible to connect the printed wirings 7 and 8 and the board 9 to the same scale type. A plurality of types of wiring can be created using a printed wiring board. As a result, it becomes possible to produce the pudding 1 to the wiring in a large quantity and in small quantities, and also to reduce the manufacturing cost.

In this printed wiring formation method, the printed wiring is formed by transferring the conductive pattern 3 from the temporary 1 to the base 6 as described above, so in addition to the above-mentioned advantages,
Furthermore, the following advantages can be obtained:

Figures 4 to 7 show other application examples of the present printer 1 to wiring forming method. To explain this, from Figures 4 to 6, a3 U, 3a to 3C, Each of them is a standardized conductor pattern, and is temporarily printed on separate temporary sheets 18 to 1C in the structure shown in FIG. gender (=l
In this application example 83, the conductor patterns 38 to 3C are glued into one body 6 as shown in FIG. 7 by the process shown in FIG. at the same time,
By overlapping predetermined portions of the conductor patterns 3a to 30 with each other, the conductor patterns 3a to 30 are electrically connected to each other via the adhesive layer 5.

By combining multiple standardized conductor patterns to form 414 printed wirings, it is possible to reduce the cost of printed wiring in small quantities to 1 = 1.
Wear.

Next, as shown in FIG.
An example of a method for manufacturing the conductive pattern 3 temporarily attached to the wafer will be explained.

Figure 8 is an example of this, and as shown in Figure 8 (a), an adhesive layer 5 is placed on one side of a metal tube 12 made of copper foil or the like.
With this adhesive layer 5, a release sheet [4] which is waterproof and has good releasability is adhered to the metal cylinder 1°2.

Next, as shown in FIG. 3(Ll), the metal R"+ 12 and the other parts 1j are covered with a photocurable resist layer 13.

Next, by exposing the resist layer 13 to light using a photographic method, necessary portions of the resist layer 13 are cured by light, and as shown in <C> of the same figure, only the hardened portions of the resist layer 13 are exposed to the metal foil 13. shall be covered.

Next, as shown in FIG. 3(d), the L91 small pattern 3 is formed by performing ``tzing'' and removing the portion of the metal foil 12 that is not covered with the hardened 1c resist layer 13. . In the figure, the adhesive layer 5 is shown to remain on the entire surface of the release sheets 1 to 1 even after the above-mentioned etching process is completed, but the adhesive layer 5 is shown to remain on the entire surface of the peeling sheets 1 to 1, but it is shown that the adhesive layer 5 remains in contact with the conductor pattern 3 on the back side of the adhesive layer 5. For the short part, do the above mentioned one ■
Jj-C may be removed from the culm.

Next, as shown in (0) in the same figure, after removing the hardened resist layer 13, as shown in (f) in the same figure, transfer 1 to a transparent temporary sheet 1 made of synthetic resin or the like. The adhesive layer 2 is provided on one side of the sheet 1-1 and is temporarily attached to the opposite side of the release sheet 4 of the conductor pattern 3.

As a result, as shown in FIG.
One combination of four is protected.

FIG. 9 shows another example of the method of manufacturing the conductor pattern 3 temporarily attached to the sheet 1 as shown in FIG. 1.

In this case, as shown in the same figure (a), in the case of method 1-5 in Fig. A metal resist layer 15 is provided in the same manner as in the case of the resist layer 133.

Next, the mesh resist layer 15 is provided as described in -.
Electroplating is performed on the pulled current-carrying plate 14 as shown in FIG. 1 (1). Then, a conductor pattern 3 is formed on the foil-like dirt formed by electroplating.

Next, as shown in the figure (C), after removing the mesh resist layer 15, as shown in the figure (d), the adhesive layer 2 is provided on one side of the temporary adhesive layer 1. In order to adhere the C1 conductive pattern 3 to the conductive pattern J3 using the adhesive layer 2 and peel it off from the conductive plate 17'I, the conductive pattern 3 is attached to the conductive pattern J3. move it towards the

Next, as shown in FIG. Glue to. As a result, the temporary f=I of the structure shown in FIG.
4J sea 1-1, adhesive layers 2 and 5, conductor pattern 53,
Also, the release sheet 4 can be mixed with a deep blue color.

Note that although electroplating is used in the method shown in FIG. 9 just described, it is also possible to form the conductor pattern 3 using electroless plating instead of electroplating.

FIG. 10 shows another embodiment of the combination of the temporary electrode and the conductor pattern used in the present invention. In the same figure, the conductor pattern 3 is
6 J3J: Consists of a portion consisting of a double layer of aluminum layer 17 and a portion consisting only of copper layer 16. Also, 1 is temporary A] ['J C1~. 2.5 is an adhesive layer, 4 is a release sheet, and these are the same as in the case of Fig. i'11.

In this example, the electrical resistance values of each part of the conductor pattern 3 are set on the right front side of the aluminum layer 17, iI! It is possible to obtain effects such as being able to make adjustments.

41J3, the conductive pattern 3 as shown in FIG. 10 can be obtained by etching, for example, using the etching method shown in FIG. It can be easily obtained by carrying out two steps (the step of etching up to the copper layer 1G and the step of etching only the aluminum layer 17).

Alternatively, it can be easily obtained by using a method using plating as shown in FIG. 9, by plating the copper layer 16 and then plating the -1 aluminum layer 17.

〔Effect of the invention〕

As described above, the pudding 1 to wiring forming method according to the present invention allows a very wide range of materials to be selected as a single unit to which a conductor pattern is bonded, and is suitable for high-volume, low-hanging production. This makes it possible to reduce the manufacturing cost of wiring to the printed circuit board 1, thereby achieving excellent effects such as reducing the production cost.

[Brief explanation of the drawing]

Fig. 1 is a process diagram of an embodiment of the printed wiring forming method according to the present invention, and Fig. 2 is a process diagram used in the present invention.
1 is a plan view showing an example of a conductor pattern temporarily placed on a temporary E sheet; FIG. Figures 4 to 6 are plan views showing the formed wiring 1 to 6.
The figures up to the figure are plan views showing other examples of the body pattern used in the present invention. (Figure 5 J:C No. 9
FIG. 8 is a plan view showing a pudding mill wiring formed using a conductor pattern using a conductor pattern, which is used in the present invention. A process diagram showing an example, FIG. 9 is a process diagram showing another example of a method for manufacturing a 1.:49 body pattern, which is used in the present invention. Figure 10 is a sectional view showing another embodiment of the conductor pattern used in the present invention. 1. Temporary installation sheet, 2. Adhesive layer, 3, 3a.
~3C...Conductor pattern, 7...Base, 9...Substrate. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure I Official 6 Figure 7 Figure 814 2 Figure 9 ;i+or4

Claims (1)

[Claims] After gluing the other side of the conductor pattern (which has been temporarily attached to the popper 1) on one side to the base, the conductor pattern is attached to the base while the conductor pattern remains on the base. A method for forming printed wiring, which comprises forming and covering the printed wiring on the substrate by removing a temporary blanking sheet.