JPS59136348A - Thermosetting resin composition for lining material - Google Patents
Thermosetting resin composition for lining materialInfo
- Publication number
- JPS59136348A JPS59136348A JP58012007A JP1200783A JPS59136348A JP S59136348 A JPS59136348 A JP S59136348A JP 58012007 A JP58012007 A JP 58012007A JP 1200783 A JP1200783 A JP 1200783A JP S59136348 A JPS59136348 A JP S59136348A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin
- microcapsules
- resin composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 19
- 239000011342 resin composition Substances 0.000 title claims description 9
- 239000000463 material Substances 0.000 title description 4
- 239000003094 microcapsule Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 229920002050 silicone resin Polymers 0.000 claims abstract description 6
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims abstract description 5
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 4
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 238000005299 abrasion Methods 0.000 abstract description 7
- 239000004519 grease Substances 0.000 abstract description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 2
- 229910052731 fluorine Inorganic materials 0.000 abstract 2
- 239000011737 fluorine Substances 0.000 abstract 2
- 239000004814 polyurethane Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- -1 polydimethylsiloxane Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000003871 white petrolatum Substances 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、耐摩耗性に優れた熱硬化性樹脂組成物に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermosetting resin composition having excellent wear resistance.
ポリウレタン系樹脂、エポキシ系樹脂等の熱硬化性樹脂
は、その優れた物性から、工場、事務所等の床材、歩車
道等の路面用材料、砕石プラント等の保護ライニング材
等に使用されているが、これ等の用途において再施工が
必要となる要因は、摩耗による損傷である場合が圧倒的
に多く、従って耐摩耗性を向上せしめ、できる限り長期
間にわたって性能を発揮し続けることが望ましい。Due to their excellent physical properties, thermosetting resins such as polyurethane resins and epoxy resins are used for flooring materials in factories, offices, etc., road surface materials for pedestrian walkways, etc., and protective lining materials for stone crushing plants, etc. However, in most cases, the reason for the need for reinstallation in these applications is damage due to wear, so it is desirable to improve the wear resistance and continue to demonstrate performance for as long as possible. .
本発明者らは、熱硬化性樹脂の耐摩耗性を同上せしめる
べく鋭意検討の結果、本発明を完成するに至った。The present inventors have completed the present invention as a result of intensive studies to improve the abrasion resistance of thermosetting resins.
即ち、本発明は、（イ）熱硬化性樹脂および（ロ）フッ
素樹脂、シリコーン樹脂および脂肪族炭化水素化合物か
らなる群より選ばれる少なくとも１種を内包してなるマ
イクロカプセルを含有する組成物にして該マイクロカプ
セルの含有量が１乃至６０重！１％である熱硬化性樹脂
組成物を提供するものである。That is, the present invention provides a composition containing microcapsules encapsulating at least one member selected from the group consisting of (a) a thermosetting resin and (b) a fluororesin, a silicone resin, and an aliphatic hydrocarbon compound. The content of the microcapsules is 1 to 60 weight! 1% of the thermosetting resin composition.
本発明の組成物によれば熱硬化性樹脂硬化物の耐摩耗性
が著しく改良され、加えて上記した用途における作業性
も改善される。According to the composition of the present invention, the abrasion resistance of the cured thermosetting resin is significantly improved, and in addition, the workability in the above-mentioned applications is also improved.
本発明において、熱硬化性樹脂としては、公知の熱硬化
性樹脂が使用し得るが、常温硬化性のポリウレタン系樹
脂もしくはエポキシ系樹肥が施工の迅速性および物性上
好ましい。In the present invention, any known thermosetting resin may be used as the thermosetting resin, but polyurethane resins or epoxy tree fertilizers that harden at room temperature are preferred from the viewpoint of speed of construction and physical properties.
マイクロカプセルに内包されるフッ巣位１脂、シリコー
ン樹脂としても公知のものが、また１３ハ肪族炭化水累
化合物としても例えば白色ワセリン、グリース、ワック
スなど公知のものが使用されるが、常温で液状もしくは
グリース状であることが好ましい。これらのマイクロカ
プセル化は公知のいずれの方法によってもよい。The fluorocarbons contained in the microcapsules are also known as silicone resins, and the 13-alphaliphatic hydrocarbon complexes are also known, such as white petrolatum, grease, wax, etc., but at room temperature. It is preferably in liquid or grease form. These microencapsulations may be carried out by any known method.
本発明の熱硬化性樹脂組成物は、上記した熱硬化性樹脂
およびマイクロカプセルを十分混合することにより得ら
れるが、組成物中のマイクロカプセルの含有量はｌ乃至
６０重量％である。この場合含有されるマイクロカプセ
ルの量が１車量％より少い場合には、十分な耐摩耗性が
得られず、又、６０重量％を越える場合には、硬化物の
引張り、引裂き強さ等の物性が低下するので好ましくな
い。The thermosetting resin composition of the present invention can be obtained by sufficiently mixing the above-mentioned thermosetting resin and microcapsules, and the content of microcapsules in the composition is 1 to 60% by weight. In this case, if the amount of microcapsules contained is less than 1% by weight, sufficient wear resistance will not be obtained, and if it exceeds 60% by weight, the tensile and tear strength of the cured product will be reduced. It is not preferable because the physical properties such as
本発明の熱硬化性樹脂組成物には、必要（こ応じて、酸
化チタン等の顔料、クレー等のフィラー、消泡剤、酸化
防止剤、分散安定剤、ダレ止め剤等の添加剤を添加する
ことができる。The thermosetting resin composition of the present invention may optionally contain additives such as pigments such as titanium oxide, fillers such as clay, antifoaming agents, antioxidants, dispersion stabilizers, anti-sagging agents, etc. can do.
以下、本発明を実施例により説明する。例中部は重量部
を表わす。The present invention will be explained below using examples. The middle part of the example represents parts by weight.
実施例１
スミカダインＦ８１０（硬化剤含有ポリウレタン樹脂系
組成物、住友化学社品）ｌＯＯ重景部に常温での動粘度
が５０ｃｓｔ（センチストークス）のポリジメチルシロ
キサンを内包するマイクロカプセル（松本油脂社品）２
０重量部を添加し、充分に撹拌棒で混合し組成物を得、
これを離型剤を予め塗布したガラス板上に流し込み、厚
さ２ｆｌのシート状に注型した。７日曲室温にて養生し
た後、荷重ｔ＃、ｔｏｏｏ回転の条件下で、テーパ一式
耐摩耗性試験を行った。その結果摩耗輪１４２２での重
！を損失は４０１１ＩＩであった。Example 1 Sumikadyne F810 (curing agent-containing polyurethane resin composition, manufactured by Sumitomo Chemical Co., Ltd.) Microcapsules containing polydimethylsiloxane with a kinematic viscosity of 50 cst (centistokes) at room temperature in the lOO heavy area (produced by Matsumoto Yushi Co., Ltd.) )2
Add 0 parts by weight and thoroughly mix with a stirring bar to obtain a composition,
This was poured onto a glass plate coated with a mold release agent in advance, and cast into a sheet having a thickness of 2 fl. After curing at room temperature for 7 days, a wear resistance test of the taper set was conducted under the conditions of load t# and too many rotations. As a result, the weight on the wear wheel 1422! The loss was 4011 II.
比較例１
マイクロカプセルを添加せずに実施例１と同様に行った
実験では、重蝋損矢は１１０■であった。Comparative Example 1 In an experiment conducted in the same manner as in Example 1 without adding microcapsules, the heavy wax loss was 110 ■.
実施例２
トーコー（’Ｉ’ｏＫｏ ）エスエポ＃５００ （硬化
剤含有エポキシ系樹脂組成物、東興アスファルト社品）
１００重量部に、常温でｔｏ、ｏｏ。Example 2 'I'oKo S-Epo #500 (epoxy resin composition containing curing agent, manufactured by Toko Asphalt Co., Ltd.)
To 100 parts by weight, to and oo at room temperature.
Ｃ３ｔのポリジメチルシロキサンを内包したマイクロカ
プセル（松本油脂社品）４０重量部を加え、撹拌棒で充
分混合を行い組成物を得、これを予め、ｌｉ！＃型剤を
塗布したガラス板上督こ流し込み、厚さ２ｆｉのシート
状に注型した。３日間放置後得られたシートを、実施例
１と同様にして摩耗試験を行つ５−
たところ、摩耗による重量損失は３０■であった。40 parts by weight of microcapsules encapsulating C3t polydimethylsiloxane (manufactured by Matsumoto Yushi Co., Ltd.) were added and thoroughly mixed with a stirring rod to obtain a composition, which was prepared in advance using li! # It was poured onto a glass plate coated with a molding agent and cast into a sheet with a thickness of 2fi. The sheet obtained after being left for 3 days was subjected to an abrasion test in the same manner as in Example 1, and the weight loss due to abrasion was 30 cm.
比較例２
実施例２に於て、マイクロカプセルを添加せずに摩耗試
験を行った結果、摩耗による重量損失はｔａｏｑであっ
た。Comparative Example 2 In Example 2, an abrasion test was conducted without adding microcapsules, and as a result, the weight loss due to abrasion was taoq.
以上 一６完− 大阪市天王寺区空清町６番地２０ −４０５−that's all 16 complete 6-20 Kuseicho, Tennoji-ku, Osaka City -405-
Claims (1)
コーン樹脂および脂肪族炭化水素化合物からなる群より
選ばれる少なくとも１種を内包してなるマイクロカプセ
ルを含有する組成物にして該マイクロカプセルの含有量
が１乃至６０重檄％である熱硬化性樹脂組成物。 （２）熱硬化性樹脂が常温硬化性のポリウレタン系樹脂
もしくは、エポキシ系樹脂である特許請求の範囲第（１
）項記載の熱硬化性樹脂組成物。 （８）フッ素樹脂、シリコーン樹脂および脂肪族系炭化
水素化合物が常温で液状もしくはグリース状である特許
請求の範囲第（２）項記載の熱硬化性樹脂組成物。[Scope of Claims] (1) A composition containing microcapsules containing at least one member selected from the group consisting of (a) a thermosetting resin and a fluororesin, a silicone resin, and an aliphatic hydrocarbon compound. A thermosetting resin composition in which the content of the microcapsules is 1 to 60% by weight. (2) Claim No. 1 in which the thermosetting resin is a polyurethane resin or an epoxy resin that hardens at room temperature.
Thermosetting resin composition according to item ). (8) The thermosetting resin composition according to claim (2), wherein the fluororesin, silicone resin, and aliphatic hydrocarbon compound are liquid or grease-like at room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012007A JPS59136348A (en) | 1983-01-26 | 1983-01-26 | Thermosetting resin composition for lining material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012007A JPS59136348A (en) | 1983-01-26 | 1983-01-26 | Thermosetting resin composition for lining material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136348A true JPS59136348A (en) | 1984-08-04 |
| JPH0472859B2 JPH0472859B2 (en) | 1992-11-19 |
Family
ID=11793526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58012007A Granted JPS59136348A (en) | 1983-01-26 | 1983-01-26 | Thermosetting resin composition for lining material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136348A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1168372A1 (en) * | 2000-06-20 | 2002-01-02 | Abb Research Ltd. | Resin for electrical insulation |
| JP2008063466A (en) * | 2006-09-08 | 2008-03-21 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
| WO2009055772A1 (en) * | 2007-10-26 | 2009-04-30 | The Board Of Trustees Of The University Of Illinois | Solvent-promoted self-healing materials |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843374A (en) * | 1971-10-02 | 1973-06-22 | ||
| JPS51107341A (en) * | 1975-03-18 | 1976-09-22 | Sumitomo Electric Industries | GANYUPURA SUCHITSUKUSOSEIBUTSU |
-
1983
- 1983-01-26 JP JP58012007A patent/JPS59136348A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843374A (en) * | 1971-10-02 | 1973-06-22 | ||
| JPS51107341A (en) * | 1975-03-18 | 1976-09-22 | Sumitomo Electric Industries | GANYUPURA SUCHITSUKUSOSEIBUTSU |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1168372A1 (en) * | 2000-06-20 | 2002-01-02 | Abb Research Ltd. | Resin for electrical insulation |
| US6548763B2 (en) | 2000-06-20 | 2003-04-15 | Abb Research Ltd | Casting compositions for producing electrical insulators |
| JP2008063466A (en) * | 2006-09-08 | 2008-03-21 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
| WO2009055772A1 (en) * | 2007-10-26 | 2009-04-30 | The Board Of Trustees Of The University Of Illinois | Solvent-promoted self-healing materials |
| US9108364B2 (en) | 2007-10-26 | 2015-08-18 | Board Of Trustees Of The University Of Illinois | Solvent-promoted self-healing materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472859B2 (en) | 1992-11-19 |
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