JPS59135628U - Blocked chip parts for electrical circuits - Google Patents
Blocked chip parts for electrical circuitsInfo
- Publication number
- JPS59135628U JPS59135628U JP2837283U JP2837283U JPS59135628U JP S59135628 U JPS59135628 U JP S59135628U JP 2837283 U JP2837283 U JP 2837283U JP 2837283 U JP2837283 U JP 2837283U JP S59135628 U JPS59135628 U JP S59135628U
- Authority
- JP
- Japan
- Prior art keywords
- electrical circuits
- chip parts
- chip components
- blocked chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はチップ部品を平面的に実装した従来のプリント
基板の一例を示す要部の斜視図、第２図は同じ〈従来の
、チップ部品を貼着体で一体的にブロック化してプリン
ト基板に実装した状態を示す斜視図、第３図は本考案の
ブロック化した電気回路用チップ部品の第１実施例を示
す部分断面斜視図、第４図は本考案の第２実施例を示す
斜視図、第５図はブロック化した電気回路用チップ部品
をプリント基板に実装した状態を示す平面図、第６図は
第５図に示したチップ部品の配置における回路図である
。
１はプリント基板、２は導体、３はチップ部品、５は電
極、６は接着剤、７はスペーサである。Figure 1 is a perspective view of the main parts of an example of a conventional printed circuit board with chip components mounted on a flat surface, and Figure 2 is the same. FIG. 3 is a partial cross-sectional perspective view showing a first embodiment of the block-formed electric circuit chip component of the present invention, and FIG. 4 is a perspective view showing a second embodiment of the present invention. 5 is a plan view showing a state in which block-shaped chip components for electric circuits are mounted on a printed circuit board, and FIG. 6 is a circuit diagram of the arrangement of the chip components shown in FIG. 5. 1 is a printed circuit board, 2 is a conductor, 3 is a chip component, 5 is an electrode, 6 is an adhesive, and 7 is a spacer.
Claims (1)
品相互が所要間隔を置いて一体的に積層するようブロン
−り化してプリント基板に実装するようにしたことを特
徴とするブロック化した電気回路用チップ部品。A block electric circuit characterized in that a plurality of chip components are mounted on a printed circuit board by blowing and mounting a plurality of chip components on a printed circuit board so that the chip components are integrally stacked at a required distance from each other using spacers. chip parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2837283U JPS59135628U (en) | 1983-02-28 | 1983-02-28 | Blocked chip parts for electrical circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2837283U JPS59135628U (en) | 1983-02-28 | 1983-02-28 | Blocked chip parts for electrical circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59135628U true JPS59135628U (en) | 1984-09-10 |
Family
ID=30159260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2837283U Pending JPS59135628U (en) | 1983-02-28 | 1983-02-28 | Blocked chip parts for electrical circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018067687A (en) * | 2016-10-21 | 2018-04-26 | 株式会社村田製作所 | Composite type electronic component and method of manufacturing the same |
-
1983
- 1983-02-28 JP JP2837283U patent/JPS59135628U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018067687A (en) * | 2016-10-21 | 2018-04-26 | 株式会社村田製作所 | Composite type electronic component and method of manufacturing the same |
| CN107978420A (en) * | 2016-10-21 | 2018-05-01 | 株式会社村田制作所 | Composite electronic component and its manufacture method |
| CN107978420B (en) * | 2016-10-21 | 2020-05-12 | 株式会社村田制作所 | Composite electronic component and method for manufacturing same |
| US10763036B2 (en) | 2016-10-21 | 2020-09-01 | Murata Manufacturing Co., Ltd. | Composite electronic component and manufacturing method for same |
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