JPS59126793A - Radial cell type plating device - Google Patents

Abstract

PURPOSE:To form surely the counter current flow of a plating soln. and to stabilize a high current density operation by providing a bottom nozzle having a separator underneath a conductor roll which bisects the electricity conducting gap of a radial cell type plating device. CONSTITUTION:A bottom nozzle 9 having a separator 12 is provided right under a conductor roll 3 which bisects an electricity conducting gap to a down pass Pd on an inlet side and an up pass Pu on an outlet side in a radial cell type plating device which conducts electricity, through a plating soln., between a strip 6 and an anode 4 spaced therefrom at the conducting gap. The discharging flow rate or sucking flow rate of the plating soln. is adjusted by the nozzle 9 so that the counter current is surely formed in the up pass Pu and the changeover of the passes is made easy. A top nozzle 10 which opens in the liquid level in the electricity conducting gap of the pass Pu is provided so as to face downward whereby the formation of the countercurrent flow of the plating soln. in the pass Pu is assisted.

Description

[Detailed Description of the Invention] The present invention relates to a radial cell type plating device, and particularly to a radial cell type plating device, which can easily perform single- or double-sided plating processing at high current density regardless of the passing speed of the metal strip. Suggest devices that can do this.

Electroplating is divided into vertical type (e, (1, ferrostane type for tin plating) and horizontal type (e, q, Hanson type for galvanizing) depending on the type of movement of the strip during plating, but in recent years radial type Cellular systems have also come into practical use.

The radial cell type plating device immerses a large diameter rotating drum (conductor roll 3) in the plating solution to a degree b.
While the gold strip (hereinafter simply referred to as the strip) is brought into contact with the outer periphery of the conductor roll and is run in synchronization with the rotation of the conductor roll, the gold is heated between the anode and the anode installed across a radial conductive gap from the strip. This is a type in which plating is performed by applying electricity through a plating solution, and FIG. 1 is a general example of this device. ] Kemetsuki cypress, 2 is plating liquid, 8 is conductor roll, 4.4' is anode, 5.
5' is a deflector roll, 6 is a strip, 7 is a pump, and 8 is an overflow weir.

This plating equipment has the following configuration: 1. Only one side of the upper side is plated.・
In addition, since the energization gap, that is, the distance between the passing strip and the anode surface can be reduced, wasteful consumption of plating power can be reduced, and high-speed plating with a large current is possible.

In the radial cell type electroplating using this soluble anode, a continuous renewal flow of the plating solution to the strip is cited as an important factor for effective electrolytic treatment at high current density.

This is because if the plating solution is not updated properly, the allowable current density tends to decrease, and if you try to operate at a current density that is too high beyond the allowable limit, a plating defect called burnout will occur, which will harm the quality of the product. It is.

For this reason, conventionally, the plating solution was renewed by introducing the plating solution into the current supply gap at high speed from the supply port 9 provided at the bottom of the plating tank.

That is, the plating solution was spouted from the supply port 5 shown in the drawing and flowed along the outer periphery of the conductor roll 6 as indicated by the single arrow in the drawing, thereby renewing the flow of the plating solution.

By the way, the direction of the flow of the plating solution in the energizing gear g is different between the inlet down bus Pd and the outlet up bus Pu of the strip 6 with respect to the running direction of the strip 6, and the direction of the flow of the plating solution in the energizing gear g is different between the inlet down bus Pd and the outlet up bus Pu with respect to the running direction of the strip 6. At g'', there is a reverse flow, and the exit gap is the current-carrying gap glJ on the Pu side.
Then it will be a normal flow. Therefore, in the stool down bath Pd, the relative speed between the strip and the plating solution is high, so the plating solution is updated well, but the outlet up bath puI11
In this case, the relative speed between the strip and the plating solution is small, so if there is no difference in the moving speed between the two, sufficient renewal of the plating solution cannot be expected, so the plating process is carried out at a high current density. Ta. In addition, in alloy plating in which an alloy of these metals is precipitated from a plating solution containing two or more types of gold ions, the relative speed of the liquid flow may affect the component ratio of the alloy.

In this way, in conventional radial cells, when performing plating processing at a high current density, (i) the passing speed of the IJ tube was constrained by the flow rate of the plating solution on the exit side up bath side. It is. Moreover, this method is based on single-sided plating, and in order to apply it to double-sided plating as shown in Figure 2-(b), the traveling direction of the strip 6 is reversed in the A1 cell and the 27th cell. , it becomes even more difficult to adjust the liquid flow on the inlet and outlet sides of the energized gear g.

The present invention advantageously solves the above-mentioned problems by effectively improving the renewal flow of the plating solution to the strip, and thereby consistently providing a stable high current density at any IJ tube threading speed. The present invention proposes a radial cell type plating device that enables electrolytic treatment and allows easy switching between single-sided and double-sided plating. The details of the configuration will be specifically explained below based on the drawings showing preferred examples.

FIG. 3 shows a preferred example of the apparatus of the present invention, which has the same main parts as the conventional example shown in FIG. 1 above, except for the plating solution circulation system, so it is shown with the same @@. In addition to this configuration, the present invention provides the current carrying gap gP strip 6
Immediately below the conductor roll 3, which is divided into an inlet down bus Pd and an outlet up bus Pd, the discharge flow rate or the suction liquid flow rate is adjusted on each side of the discharge side and suction side. By providing a bottom nozzle 9 having a separator] 2 used for this purpose, formation of countercurrents in the up bath can be reliably achieved, and at the same time, bath switching can be easily performed. In addition, the top nozzle 10, which opens facing the liquid level of the energizing gear g in the up-bath on the exit side, is provided downward, so as to help generate the plating solution sealing counterflow in the up-bath.

The bottom nozzle 9 has an opening q facing the energization gap g.
At parts a and 9b, a separator 12 whose surface approaching the strip 6 has an arc shape is oscillated to be discharged and sucked 1.
It is provided in such a manner that liquid flow rate regulation is achieved. That is, by swinging the separator 12, the opening areas of the openings 9a and 9b facing the bottom path Pu and the down bus Pd can be changed.
It is possible to adjust the amount of plating liquid injected into the up-pass Pu-side current-carrying gap g and the amount of plating liquid sucked into the down-path Pd-side current-carrying gap g.

In order to meet these demands, each of the openings 9a, 9bv
The left and right headers 18.14 that connect to each other are provided separately, and a flow path switching device]1 is connected to the extension of the right header 18.14. There are two pumps 7a and 7b, which circulate the overflowing plating liquid from the overflow weir 8 and supply the plating liquid to the top nozzle 10.

The up-bath pump 7b sucks the plating solution in the current-carrying gap g' of the up-bath side Pu through the left header 13, and then pumps the plating solution from the top nozzle]0 again into the up-bath Pu.
Circulation is caused to be discharged to the upper part of the side energizing gap g''. Therefore, a liquid flow from the upper part to the lower part is formed in the up bus Pu side energizing gap g', and Circulation will occur.

On the other hand, on the down bus Pd side, the right header 14 is pumped from the pump 7a so that the light dripping liquid is not energized on the down bus Pd side, is discharged into the gap g, and returns from the overflow weir 8. Produces a countercurrent to the advancing flow.

The separator 12 is used to prevent mixing interference between the plating liquid on the suction side and the discharge side.The separator 12 prevents the plating liquid from mixing on the suction side and the discharge side. It has a structure that ensures liquid separation and prevents accidents due to contact with the strip 6.On the other hand, as shown in Figure 2-(b), the traveling direction of the strip 6 has changed due to double-sided plating. In case, top nozzle 10
It is necessary to move the bottom nozzle openings 9a and 9b from the left side to the right side of the energizing gap 6, by switching the switching device 1 to open the left header 13 and the pump 7a and the right header 14. It is only necessary to connect the pump 7b and move the separator 12 to the position shown by the chain line in FIG. 4.

In this case, the separator is newly opened at the left side opening 9 which becomes the discharge side.
A is made narrower to increase the discharge pressure, making it easier to generate a high-speed upward counterflow, and widening the right side opening 9b to make it easier to draw. Therefore, the structure is such that it is locked at a desired position on either the left or right side so that it does not easily move due to liquid flow or the like. Of course, it is desirable that this switching can be operated from the top of the plating bath or from the outside.

8 and 4 are one embodiment of the present invention, and the present invention is not limited thereto, and a wider range of embodiments are possible. For convenience of explanation, we have shown an example in which @poles 4 and 4' are placed inside the plating tank l, but for insoluble anodes, a structure in which the plating cypress and the anode are integrated is also possible. It is. Although the separator 12 also has an example of having a rotating shaft, it is possible to change the design to have the same effect, such as a structure that slides left and right.

As explained above, in radial cell type electroplating, the apparatus of the present invention can reliably form a counterflow from the top to the bottom on the upbath side, allowing high current density operation and stable operation of alloy plating. It has become possible. Also,
The work of switching plating from one side to both sides, which involves changing the root direction, can be done easily by using both the bottom nozzle and the switching device, improving the efficiency of plating work.

[Brief explanation of the drawing]

Figure 1 is a route diagram of a conventional radial cell type plating equipment, Figure 2 (a) is a route diagram showing single-sided plating, and Figure 2 (b) is a route diagram showing the mechanism for double-sided plating, and Figure 8. FIG. 4 is a route diagram of the radial cell type plating apparatus of the present invention, and FIG. 4 is an enlarged sectional view of the bottom nozzle portion. ]...Plating tank 2...Plating solution 3...
Conductive crawl 4...@Pole 5...Deflation crawl 6...Strips 7a, 7b...Pump
8... Overflow weir 9... Bottom nozzle 10... Top nozzle]]... Switching section
]2... Separators 13, 14... Header 15... Next! @ Member g...Electricity gap. Figure 1 Figure 2

Claims (1)

[Claims] 1. A strip that is in contact with the outer periphery of a conductor roll and runs in synchronization with its rotation is placed between the strip and an anode that separates a radial current-carrying gap, through a tamping liquid introduced into the gap. In a radial cell type plating device that conducts plating by applying electricity, a conductor is installed directly under the fundactor four, which divides the above-mentioned current-carrying gap into two parts, the inlet doubt bus and the outlet up pass, on each side of the two halves. The present invention is characterized in that a bottom nozzle is provided with a separator L/-2 that can adjust the flow rate of the liquid to be discharged or sucked, and a top nozzle that opens facing the liquid level is provided in the up-pass side energization gap. Radial cell type plating equipment. 2. A strip that is in contact with the outer periphery of the conductor roll and runs in synchronization with its rotation is electrically applied between the strip and an anode that separates a radial current-carrying gap through a staining liquid introduced into the gap to perform plating processing. In the radial cell type plating equipment that performs the plating process, the conductor roll that divides the above-mentioned current-carrying gap into the inlet side down bus and the outlet side up bus is provided directly below the conductor roll, and on each side divided into two from each header, which is provided independently. A bottom nozzle with seven nozzles that can adjust the flow rate of liquid to be discharged or sucked is provided, and a top nozzle opened facing the liquid level is provided in the up-pass side energization gap, and each of the above headers, A radial cell type plating apparatus, characterized in that a switching device and a pump are installed for a pipe line connecting a flow weir or a top nozzle.