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JPS59109347A - Laminated board - Google Patents

Laminated board

Info

Publication number
JPS59109347A
JPS59109347A JP22080882A JP22080882A JPS59109347A JP S59109347 A JPS59109347 A JP S59109347A JP 22080882 A JP22080882 A JP 22080882A JP 22080882 A JP22080882 A JP 22080882A JP S59109347 A JPS59109347 A JP S59109347A
Authority
JP
Japan
Prior art keywords
laminate
resin
threads
impregnated base
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22080882A
Other languages
Japanese (ja)
Other versions
JPH03226B2 (en
Inventor
英人 三澤
吉光 時夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP22080882A priority Critical patent/JPS59109347A/en
Publication of JPS59109347A publication Critical patent/JPS59109347A/en
Publication of JPH03226B2 publication Critical patent/JPH03226B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は、IC回路等に用いられる積層板に関する。[Detailed description of the invention] The present invention relates to a laminate used for IC circuits and the like.

従来、印刷配線板(PWB)として、紙フェノール積層
板9紙エポキシ積層板、ガラスエポキシ積層板、ガラス
ポリイミド積層板その他の積層板に銅箔等の金属箔が貼
着されてなるもの、あるいは、セラミック基板に銅箔等
の金属箔が貼着されてなるものが用いられている。しか
しながら、前記のような積層板を用いたのでは、印刷配
線板の高密度化や多層(多層配線)化を計ったり、演算
速度の高速化を計ったりすることが困難である。
Conventionally, printed wiring boards (PWB) include paper phenol laminates, paper epoxy laminates, glass epoxy laminates, glass polyimide laminates, and other laminates to which metal foil such as copper foil is attached, or A ceramic substrate with metal foil such as copper foil attached is used. However, by using the above-mentioned laminated board, it is difficult to increase the density of the printed wiring board, increase the number of layers (multilayer wiring), or increase the calculation speed.

他方、セラミック基板を用いたのでは、大寸法のものの
製造が難しいとかセラミック基板が割れ易いといったよ
うな理由で、印刷配線板の大きさが限定される。
On the other hand, if a ceramic substrate is used, the size of the printed wiring board is limited because it is difficult to manufacture a large-sized one and the ceramic substrate is easily broken.

発明者らは、大きさが限定される問題のない積層板に注
目し、積層板の熱膨張率を低下させる、特に熱時におけ
る寸法安定性を向上させることによって、印刷配線板の
高密度化および多層化を計ることができるようにし、積
層板の誘電率を低下させることによって演算速度の高速
化を計ることができるようにしようとして研究を重ねた
。その結果、基材に石英質成分を含ませればこれらの問
題が解決されるということを見出し、ここにこの発明を
完成した。
The inventors focused on laminates that do not have the problem of limited size, and aimed to increase the density of printed wiring boards by lowering the coefficient of thermal expansion of laminates and improving their dimensional stability, especially under heat. We conducted repeated research in an attempt to increase the calculation speed by increasing the number of layers and by lowering the dielectric constant of the laminate. As a result, it was discovered that these problems could be solved by including a quartz component in the base material, and the present invention was hereby completed.

すなわち、この発明は、樹脂含浸基材を所定枚   ゛
積層成形してなる積層板であって、樹脂含浸基材のうち
の少なくとも1枚の基材が石英繊維糸とガラス繊維糸と
を用いてMl織された複合布であることを特徴とする積
層板をその要旨としている。以下、この発明の詳細な説
明する。
That is, the present invention provides a laminate formed by laminating and molding a predetermined number of resin-impregnated base materials, wherein at least one of the resin-impregnated base materials is made of quartz fiber yarn and glass fiber yarn. The gist of this product is a laminate that is characterized by being made of Ml-woven composite fabric. The present invention will be explained in detail below.

積層板は、樹脂含浸基材(プリプレグ)を所定枚積層成
形することによってつくられるが、この発明にかかる積
層板は、樹脂含浸基材のうちの少なくとも1枚の基材が
、石英繊維糸とガラス繊維糸とを用いて製織された複合
布となっているところが従来のものと異なる。前記のよ
うな複合布が用いられているので、積層板の熱膨張率が
低くなり〔含浸用樹脂としてポリイミド樹脂(ケルイミ
ド601)を使用した場合は10−”n/朋℃程度〕、
特に熱時における寸法安定性が向上し、誘電率も低くな
る〔含浸用樹脂としてポリイミド樹脂(ケルイミド60
1)を使用した場合はほぼ4×10”Hz以下〕のであ
る。しかも、前記のような複合布を用いるようにすると
、石英繊維糸のみからなる石英繊維布を用いた場合に比
べ加工性がよい。たとえば、ポリイミド樹脂(ケルイミ
ド601)を前記複合布に含浸させてなる樹脂含浸基材
を用いてつくった積層板の加工においては、同じ樹脂を
石英繊維布に含浸させてなる樹脂含浸基材を用いてつく
った積層板の加工に比べ、加工用ドリル歯の寿命が1.
5倍になることがわかった。
A laminate is made by laminating and molding a predetermined number of resin-impregnated base materials (prepregs), and in the laminate according to the present invention, at least one of the resin-impregnated base materials is made of quartz fiber yarn. It differs from conventional products in that it is a composite fabric woven using glass fiber threads. Since the above-mentioned composite fabric is used, the coefficient of thermal expansion of the laminate is low [about 10-''n/°C when polyimide resin (Kelimide 601) is used as the impregnating resin];
In particular, the dimensional stability under heat is improved and the dielectric constant is lowered [polyimide resin (Kelimide 60
1) is approximately 4 x 10" Hz or less]. Furthermore, when using a composite fabric such as the one described above, processability is improved compared to when using a quartz fiber cloth made only of quartz fiber threads. For example, when processing a laminate made using a resin-impregnated base material made by impregnating the composite cloth with polyimide resin (Kelimide 601), use a resin-impregnated base material made by impregnating a quartz fiber cloth with the same resin. Compared to machining a laminate made using a laminate, the life of the machining drill teeth is 1.
It turned out to be 5 times more.

複合布は、石英繊維糸とガラス繊維糸とが適数本ずつ交
互に配置されるよう製織され、全体的にみて両者がかた
よることなく均等に配置されてもするものが好ましい。
The composite fabric is preferably woven so that an appropriate number of quartz fiber threads and glass fiber threads are alternately arranged, and the two are evenly arranged as a whole without shifting.

たとえば、第1図および第2図に示されているような複
合布である。第1図に示されている複合布は、縦糸とし
て石英繊維糸1とガラス繊維糸2とが2本ずつ交互に配
置され、横糸として両者が1本ずつ交互に配置されたも
のとなっている。第2図に示されている複合布は、縦糸
として石英繊維糸1が1本とガラス繊維糸2が5本交互
に配置され、横糸として両者が1本ずつ交互に配置され
たものとなっている。
For example, composite fabrics such as those shown in FIGS. 1 and 2. In the composite fabric shown in Fig. 1, two quartz fiber threads 1 and two glass fiber threads 2 are alternately arranged as warp threads, and one thread of both is arranged alternately as weft threads. . The composite fabric shown in Figure 2 has one quartz fiber yarn 1 and five glass fiber yarns 2 alternately arranged as warp threads, and one each of the two as weft threads. There is.

複合布に使用されている石英繊維糸は、二酸化ケイ素(
S i O2)の含有量(コンテント)が96〜99%
程度と高くなっているのがよい。しかし、この範囲に限
定されるものではない。ガラス繊維糸の種類は特に限定
されない。たとえば、E−ガラス(Owens −Co
rning  Fiber Glas社製)等が用いら
れる。複合布に含浸させる樹脂としては、従来一般に使
用されているものと同じものが使用されるが、ポリイミ
ド樹脂、エポキシ樹脂、ポリブタジェン樹脂が好ましく
用いられる。
The quartz fiber yarn used in composite fabrics contains silicon dioxide (
S i O2) content is 96-99%
It is better if the level is higher. However, it is not limited to this range. The type of glass fiber yarn is not particularly limited. For example, E-glass (Owens-Co
(manufactured by Fiber Glass), etc. are used. As the resin to be impregnated into the composite cloth, the same resins as those commonly used in the past are used, and polyimide resins, epoxy resins, and polybutadiene resins are preferably used.

前記複合布に樹脂を含浸させてなるもの以外の種類の樹
脂含浸基材が用いられる場合、その種類は特に限定され
ない。たとえば、ガラス布にエポキシ樹脂あるいはポリ
イミド樹脂を含浸させたもの、石英繊維布にポリイミド
樹脂を含浸させたもの等が用いられる。使用される樹脂
含浸基材の種類、その枚数および重ね合わせの位置は、
積層板の使用目的等に応じて適宜法められる必要がある
When a type of resin-impregnated base material other than the composite cloth impregnated with a resin is used, the type is not particularly limited. For example, glass cloth impregnated with epoxy resin or polyimide resin, quartz fiber cloth impregnated with polyimide resin, etc. are used. The type of resin-impregnated base material used, the number of sheets, and the position of overlapping are as follows:
Laws need to be established as appropriate depending on the purpose of use of the laminate.

なお、必要に応じて、積層板の一面あるいは両面に#i
箔等の金属箔が貼着された金属箔張積層板をつ(る場合
、樹脂含浸基材が所定枚積層されてなる積層体の一面あ
るいは両面に金属箔を合わせたあと成形するようにした
り、積層板をつくったあと、その−面あるいは両面に金
属箔を貼着するようにする。
In addition, if necessary, #i may be applied to one or both sides of the laminate.
When manufacturing a metal foil-clad laminate to which metal foil such as foil is attached, the laminate is formed by laminating a predetermined number of resin-impregnated base materials, and the metal foil is applied to one or both sides of the laminate and then molded. After the laminate is made, metal foil is attached to either or both sides of the laminate.

この発明にかかる積層板は、このように構成されるもの
であって、樹脂含浸基材のうちの少なくとも1枚の基材
が前記のような複合布となっているので、熱膨張率が低
く、特に、熱時での寸法安定性に優れている。したがっ
て、印刷配線板の高密度化や多層化を計ることが容易に
できるようになる。そして、この積層板を備えた印刷配
線板は、リードなしのIcチップ(セラミックタイプ、
プラスチックタイプ等)キャリア用として使用するのに
非常に適している。また、誘電率が低いので演算の高速
化を計ることも容易にできるようになる。そのうえ、加
工性も比較的よい。
The laminate according to the present invention is constructed as described above, and since at least one of the resin-impregnated base materials is a composite cloth as described above, the laminate has a low coefficient of thermal expansion. In particular, it has excellent dimensional stability under heat. Therefore, it becomes possible to easily increase the density and multilayer of printed wiring boards. A printed wiring board equipped with this laminate is a leadless IC chip (ceramic type,
It is very suitable for use as a carrier (plastic type, etc.). Furthermore, since the dielectric constant is low, calculation speed can be easily increased. Moreover, the workability is relatively good.

つぎに、実施例および比較例について説明する。Next, Examples and Comparative Examples will be described.

〔実施例〕〔Example〕

つぎのようにして、両面に銅箔が貼着された実施例の積
層板をつくった。
In the following manner, a laminated board of an example having copper foil adhered to both sides was produced.

基材となる複合布として、石英繊維糸とガラス   ゛
繊維糸とが1本ずつ交互に配置されるようにして平織さ
れ、厚みか0.18f1.組糸の配置が42本/251
m、横糸の配置が32本/ 25 mmとなったものを
用いた。前記のような複合布に、その樹脂量が50重量
%となるようポリイミドを含浸させて樹脂含浸基材をつ
(つた。この樹脂含浸基材6枚を重ね、さらにその上下
面に厚み35μmの銅箔を合わせたのち、165℃、 
 70 kg/crAの条件で90分間加熱、加圧する
ことによって積層成形し、積層板を得た。
The composite fabric serving as the base material is plain woven with one quartz fiber thread and one glass fiber thread arranged alternately, and has a thickness of 0.18 f1. The arrangement of braided threads is 42/251
m, the weft yarn arrangement was 32 threads/25 mm. The composite cloth as described above was impregnated with polyimide so that the resin amount was 50% by weight to form a resin-impregnated base material. Six sheets of this resin-impregnated base material were stacked, and a layer of 35 μm thick was added on the top and bottom surfaces. After combining the copper foil, heat to 165℃,
Laminate molding was performed by heating and pressurizing at 70 kg/crA for 90 minutes to obtain a laminate.

両面に銅箔が貼着された比較例の積層板を、厚み0.1
8tmのガラス布を基材として用いたほかは実施例と同
様にしてつくった。
A comparative laminate with copper foil attached on both sides was made with a thickness of 0.1
It was produced in the same manner as in the example except that 8 tm glass cloth was used as the base material.

実施例および比較例の積層板について、それぞれ熱膨張
率と誘電率とを測定した。測定結果を第1表に示す。
The thermal expansion coefficient and dielectric constant of the laminates of Examples and Comparative Examples were measured. The measurement results are shown in Table 1.

第1表 第1表より、実施例の積層板は比較例のもの番こ比べ熱
膨張率および誘電率が低いことがわかる。
Table 1 From Table 1, it can be seen that the laminates of the examples have lower coefficients of thermal expansion and dielectric constants than those of the comparative examples.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は、それぞれ、この発明υこかかる
積層板に用いられる複合布の1例の構造説明図である。 1・・・石英繊維糸 2・・・ガラス繊維糸代理人 弁
理士  松 本 武 彦
FIGS. 1 and 2 are structural explanatory diagrams of an example of a composite fabric used in a laminate according to the present invention. 1...Quartz fiber yarn 2...Glass fiber yarn Agent Patent attorney Takehiko Matsumoto

Claims (2)

【特許請求の範囲】[Claims] (1)樹脂含浸基材を所定枚積層成形してなる積層板で
あって、樹脂含浸基材のうちの少なくとも1枚の基材が
石英繊維糸とガラス繊維糸とを用いて製織された複合布
であることを特徴とする積層板。
(1) A laminate formed by laminating and molding a predetermined number of resin-impregnated base materials, in which at least one of the resin-impregnated base materials is a composite woven using quartz fiber yarn and glass fiber yarn. A laminate board characterized by being made of cloth.
(2)複合布が、石英繊維糸とガラス繊維糸とが適数本
ずつ交互に配置されるよう製織されたものである特許請
求の範囲第1項記載の積層板。
(2) The laminate according to claim 1, wherein the composite fabric is woven such that an appropriate number of quartz fiber threads and glass fiber threads are alternately arranged.
JP22080882A 1982-12-15 1982-12-15 Laminated board Granted JPS59109347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22080882A JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22080882A JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Publications (2)

Publication Number Publication Date
JPS59109347A true JPS59109347A (en) 1984-06-25
JPH03226B2 JPH03226B2 (en) 1991-01-07

Family

ID=16756880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22080882A Granted JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Country Status (1)

Country Link
JP (1) JPS59109347A (en)

Also Published As

Publication number Publication date
JPH03226B2 (en) 1991-01-07

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