JPS5896494A - Assembling method for speaker - Google Patents
Assembling method for speakerInfo
- Publication number
- JPS5896494A JPS5896494A JP19586181A JP19586181A JPS5896494A JP S5896494 A JPS5896494 A JP S5896494A JP 19586181 A JP19586181 A JP 19586181A JP 19586181 A JP19586181 A JP 19586181A JP S5896494 A JPS5896494 A JP S5896494A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- speaker
- synthetic resin
- resin film
- magnetic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 7
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 29
- 239000000057 synthetic resin Substances 0.000 claims abstract description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 16
- 238000007664 blowing Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 206010028347 Muscle twitching Diseases 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
- H04R2209/024—Manufacturing aspects of the magnetic circuit of loudspeaker or microphone transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はスピーカーの組立て方法に関する。[Detailed description of the invention] The present invention relates to a method of assembling a speaker.
従来、スピーカーの組立て、４！に磁気回路組立て体と
スピーカーフレームとは磁気回路組立て体ｆ）ＩＶ−）
の表面側周縁とスピーカーフレームとの間に紙を介挿す
るか、接着剤を線状に介在させてプレートとスピーカー
フレームとを熔接或いはビス止めして結合していた。Conventional speaker assembly, 4! What is the magnetic circuit assembly and the speaker frame?
The plate and the speaker frame are connected by welding or screwing, either by inserting paper or by interposing a line of adhesive between the front side periphery of the plate and the speaker frame.
仁の紙又は接着剤は、プレートとスピーカー７レームと
の間隙な単に充填する作用があるのみでプレートとスピ
ーカーフレームとの結合作業は、プレートのギャップ部
が開口された状態で行われるので溶接待のスパークに依
って生じる鉄粉或いはビス止めの際にねじ孔から毀れる
鉄粉等がプレートのギャップ部から磁気回路組立て体の
内１１に侵入したり、プレートとスピーカーフレームと
の関に侵入し、このように磁気回路組立て体内に侵入し
た鉄粉等は除去が困難で大部分その１１放置された状態
で組立てが行われていた。その為、組立【られたスピー
カーの使用時にその振動によつ【磁気回路組立【体内に
侵入した鉄粉等が飛び出し【ボイスフィルとプレートの
ギャップ部との間で擦れてビリツキ、ギャップレス不良
を発生する原因となり、また、プレートとスピーカー７
レームとの関には部分的に紙または接着剤が介在される
だけであるため、プレー、トとスピーカー７レームとの
関に共振が発生しスピーカーの音響効果に悪影響を及ぼ
す欠点がある。The paper or adhesive only has the effect of filling the gap between the plate and the speaker frame, and the work of joining the plate and speaker frame is done with the gap between the plates open, so there is no need to wait for welding. Iron particles generated by sparks or broken from screw holes during screw tightening may enter the inside of the magnetic circuit assembly through the gap in the plate or enter the connection between the plate and the speaker frame. It is difficult to remove the iron powder and the like that have entered the magnetic circuit assembly in this way, so that most of the assembly is left unattended. Therefore, when using the assembled speaker, the vibration may cause iron particles that have entered the magnetic circuit assembly to fly out, causing chafing between the voice fill and the gap between the plate and a gapless failure. This may cause the plate and speaker 7 to
Since paper or adhesive is only partially interposed between the plate and the frame, there is a disadvantage that resonance occurs between the plate and the speaker frame, which adversely affects the acoustic effect of the speaker.
そこで、本発明は従来の欠点を解消するためになされた
もので、磁気回路組立て体とスピーカー７レームを結合
する際、磁気回路組立て体のプレートとスピーカー７レ
ームとの間に全ｗに渡って合成樹脂フィルムを介在し、
スピーカー７レームの固定後、合成樹脂フィルムのプレ
ートのギャップに対応する部分を切除するようＫしたも
のである。Therefore, the present invention has been made to solve the conventional drawbacks, and when connecting the magnetic circuit assembly and the speaker 7 frame, there is a gap between the plate of the magnetic circuit assembly and the speaker 7 frame over the entire w. A synthetic resin film is interposed,
After fixing the speaker 7 frame, a portion of the synthetic resin film plate corresponding to the gap was cut out.
以下、図面につい【本発明の詳細な説明する。Hereinafter, the present invention will be described in detail with reference to the drawings.
壕ず、磁気回路組立て体（１）をリング状マグネット（
２）、ギャップｍｓ（す）を形成したプレート（３）及
びボール（４）を有するヨーク（５）より組立てる。こ
の磁気回路組立て体（１）の組立【工程は、通常行われ
る組立て方法と同様であるからその説明は省略する。Without a trench, attach the magnetic circuit assembly (1) to a ring-shaped magnet (
2) Assemble from a plate (3) with a gap ms and a yoke (5) having a ball (4). The assembly process of this magnetic circuit assembly (1) is the same as a normally performed assembly method, so a description thereof will be omitted.
この磁気回路組立【体（１）の表面側、即ち、プレー）
（３）の表面にポリエチレンフィルム又は熱収縮性合成
樹脂フィルム等の厚さｌＯ〜２００ ｓｍの合成樹脂フ
ィルム（６）を重合する。こり合成樹脂フィルム（６）
は、プレート（３）の表面積と略々等しいかやや広く形
成され、中央部にはプレート（３）のギャップ部（３ａ
）と略々同形上Ｋｔシン目（６ｍ）が形成されており、
その周縁部にはプレー） （３１Ｋ穿設されたネジ孔（
３ｂ） Ｋ対応して透孔（６ｂ）が穿設されている。こ
の合成樹脂フィルム（６）をプレー、） （３）の表面
に重合し熱接着又は接着テープで止着した状態でプレー
） （３） Ｋ合成樹脂フィルム（６）を介してスピー
カーフレーム（７）の開口（７ｍ）を有する底面を接合
し、スピーカー７レーム（７）の透孔（７ｂ）からビス
（８）を合成樹脂フィルム（６）の透孔（６ｂ）を通し
て、プレート（３）のネジ孔（３ｂ） Ｋ螺合し、締め
つけてスピーカー７レーム（７）を磁気回路組立て体（
１）＆Ｃ結合する。この作業中に生じた鉄粉等は合成樹
脂フィルム（６）上に落され、この鉄粉勢なエアーガン
等で吹き飛し除去する。しかる後、合成樹脂フィルム（
６）の中央部をミシン目（６ｍ） Ｋ沿つ【切除し、プ
レート（３）のギャップ部（３ｍ）をスピーカー７レー
ム（７）の開口（７１） Ｋ導通させる。このようＫし
て磁気回路組立て体（１）とスピーカー７レーム（７）
とを結合した後、スピーカーコーン（９）、ボイスフィ
ル（ｌ・を巻着したボビンａυから成る振動組立て体Ｈ
を組付ける。なお、この振動組立て体Ｑ３の組付は方法
は、通常、行なわれている方法と同様であるからその説
明は省略する。 。This magnetic circuit assembly [the surface side of the body (1), that is, the plate]
A synthetic resin film (6) having a thickness of 10 to 200 sm, such as a polyethylene film or a heat-shrinkable synthetic resin film, is polymerized on the surface of (3). Stiff synthetic resin film (6)
is formed to be approximately equal to or slightly wider than the surface area of the plate (3), and a gap portion (3a) of the plate (3) is formed in the center.
), a Kt synthel (6m) is formed on the isomorphism,
There is a play on the periphery (31K screw hole drilled)
3b) A through hole (6b) is bored corresponding to K. This synthetic resin film (6) is then polymerized onto the surface of (3) and fixed with thermal adhesive or adhesive tape. Connect the bottom surfaces with an opening (7 m), and pass the screws (8) through the holes (7b) of the speaker 7 frame (7) through the holes (6b) of the synthetic resin film (6), and insert the screws of the plate (3). Hole (3b) K screw together and tighten to attach the speaker 7 frame (7) to the magnetic circuit assembly (
1) Combine &C. Iron powder and the like generated during this work are dropped onto the synthetic resin film (6), and are blown away with an air gun or the like that produces iron powder. After that, synthetic resin film (
Cut out the central part of 6) along the perforation (6 m) K, and connect the gap part (3 m) of the plate (3) to the opening (71) K of the speaker 7 frame (7). In this way, the magnetic circuit assembly (1) and the speaker 7 frame (7) are assembled.
After combining, a vibration assembly H consisting of a speaker cone (9) and a bobbin aυ wound with a voice fill (L) is assembled.
Assemble. The method for assembling this vibration assembly Q3 is the same as the method normally used, so a description thereof will be omitted. .
以上のようにして第１図に示す如くスピーカー８Ｐが組
立てられる。また、磁気回路組立て体（１）とスピーカ
ー７レーＡ（７）との結合ビス（８）の締め付けに依ら
ない時は、スピーカー７レーム（７）の下面にスポット
溶接用の突起を突設してお館、との突起を合成樹脂フィ
ルム（６）の透孔（６ｂ）を通してプレー） （３１Ｋ
ｍ接し、スポット爆接を行なう。In the manner described above, the speaker 8P is assembled as shown in FIG. In addition, when the coupling screw (8) between the magnetic circuit assembly (1) and the speaker 7 ray A (7) is not tightened, a protrusion for spot welding is provided on the bottom surface of the speaker 7 ray (7). (31K
m contact and perform spot explosion welding.
第３図は、他の実施例を示し、本例に於いてはスピーカ
ーフレームの底面開口（７りを磁気回路組立て体（１）
のプレー）（３）のギャップ部（ｓｌ）と略々同形に形
成し、この開口（７りの後面側周縁部に先端尖鋭なリン
グ状縁（７Ｃ）を形成しである。FIG. 3 shows another embodiment, in which the bottom opening (7) of the speaker frame is connected to the magnetic circuit assembly (1).
It is formed in approximately the same shape as the gap part (sl) of (3), and a ring-shaped edge (7C) with a sharp tip is formed at the rear peripheral edge of this opening (7).
一方、合成樹脂フィルム（６）Ｋは前例の如きンシン目
は設けず偏平状の１１に１．ておく。On the other hand, the synthetic resin film (6) K does not have the holes like the previous example, but has flat 11 and 1. I'll keep it.
そこで、この合成樹脂フィルム（６）を磁気回路組立（
体（１）のプレート（３）の表面側に重合して接着し、
この状態でスピーカー７レーム（７）を接合して前例と
同様にビスにより又は溶接によりプレー） （３） Ｋ
対し【固着するとスピーカー７レーム（７）は、プレー
） （３）側に強く押し付けられ、そのため開口（７
ｍ）の周縁のリング状縁（７Ｃ）が合成樹脂フィルム（
６）にプレート（３）のギャップ部（３ａ）Ｋ？６つ【
食い込み、切取線が形成される。そこでスピーカー７レ
ーム（７）が完全に固着された状態でこの作業中に合成
樹脂フィルム（６）上に落ちた鉄粉等を吹き飛す勢して
除去した後、合成樹脂フィルム（６）のプレート（３）
のギャップ部（３りに対応する部分、即ち切取線が形成
された部分をスピーカー７レーム（７）のリング状縁（
７ｃ）Ｋ＆つ【切除する。そこでこの合成＠にフィルム
（６）の中央切断片を除去すればプレーＨ３）のギャッ
プ部＜３！Ｉ）はスピーカー７レーム（７）の開口（１
りと導通される。Therefore, this synthetic resin film (6) was used for magnetic circuit assembly (
polymerizes and adheres to the surface side of the plate (3) of the body (1),
In this state, connect the speaker 7 frame (7) and screw or weld as in the previous example)
On the other hand, when the speaker 7 frame (7) is stuck, it is pressed strongly against the play side (3), and therefore the opening (7)
The ring-shaped edge (7C) on the periphery of the synthetic resin film (
6) Gap part (3a) of plate (3) K? 6 [
It digs in and a perforation line is formed. Therefore, with the speaker 7 frame (7) completely fixed, iron powder, etc. that fell on the synthetic resin film (6) during this work was blown away, and then the synthetic resin film (6) was removed. Plate (3)
The gap part (the part corresponding to 3, that is, the part where the cutout line is formed) is connected to the ring-shaped edge (of the speaker 7 frame (7)).
7c) K&tsu [remove. Therefore, if we remove the central cut piece of film (6) in this composite @, the gap part of play H3) <3! I) is the aperture (1) of the speaker 7 frame (7)
fully conductive.
肖、本例においてスピーカーフレーム（７）の開口部（
７りの縁部（７Ｃ）は連続上に眠ることなく、適宜、間
隔で突設しても嵐い、この場合は、合成樹脂フィルム（
６）Ｋはプレート（３）のギャップ１ｓ（３すに沿５連
続的な切取線は形成されないが、前例と同様Ｋ（シン目
が施された状態となる。特にスピーカフレーム（７）を
プレー） （３１Ｋ対し【スポット爆接等に依り、爆接
・溶接固定する場合はこのように縁部（７Ｃ）を隔設す
ることが望ましい、即ち、縁部（７Ｃ）を連続上に形成
した場合は、溶接待にスピーカーフレームをプレート（
３）Ｋ対して強く圧接すると合成樹脂フィルム（６）が
その場で切断されズしまい、溶接割にプレート（３）の
ギャップ部（３−）が開口された状態となるおそれがあ
るが縁部（７Ｃ）を隔設した場合は上述の如く、合成樹
脂フィルム（６）は建シン目状に切断されるだけである
から、プレート（３）のギャップ部（３１） Ｋ対して
閉口状態を持続し、溶接作業中に生じる鉄粉等を確実に
受けることができる。In this example, the opening of the speaker frame (7) (
The edge (7C) of the 7th line is not continuous, but can be protruded at appropriate intervals.In this case, the synthetic resin film (7C)
6) K is the gap 1s of the plate (3) (5 continuous cutting lines are not formed along the 3rd edge, but the same K as in the previous example (thin lines are applied. Especially play the speaker frame (7)) (For 31K [When fixing by explosion welding or welding by spot explosion welding, etc., it is desirable to space the edges (7C) like this. In other words, if the edges (7C) are formed continuously, , wait for welding the speaker frame to the plate (
3) If the synthetic resin film (6) is strongly pressed against the K, the synthetic resin film (6) may be cut and torn on the spot, and the gap (3-) of the plate (3) may be left open during welding. (7C), as mentioned above, the synthetic resin film (6) is simply cut in the form of a vertical line, so the gap part (31) of the plate (3) remains closed to the K. It can reliably catch iron powder, etc. generated during welding work.
以上の各実施例に於いて合成樹脂フィルム（６）をプレ
ー） （３１Ｋ対し【加熱接着させて、仮固定した状態
でスピーカーフレーム（７）の固定を行なうよ５にすれ
ば、その作業は一層容易となる。In each of the above embodiments, the synthetic resin film (6) is applied) (31K).If the speaker frame (7) is fixed by heat bonding and temporarily fixed, the work becomes even easier. It becomes easier.
以上のように本発＃４によれば、磁気回路組立て体とス
ピーカーフレームとの結合は、磁気回路組立て体のプレ
ートのギャップ部を合成樹脂フィルムで閉口した状態で
行なうのでスピーカーフレームの固定作業中に生じる鉄
粉等の磁気回路組立て体内への侵入は防止され、また、
プレートとスピーカー７ル−ムとの間には合成樹脂フィ
ルムが介在されて、その間に生じる間隙は完全に１がれ
るので、この間への鉄粉等の侵入も防止される。またプ
レートとスピーカーフレームとの関には合成樹脂フィル
ムが介在されることに依り、両者間には、金属間接触も
生じない、従って、スピーカーの使用時にその振動によ
って鉄粉等が磁気回路組立て体ｔはプレートとスピーカ
ー７レームとの間から飛び出して、ボイスコイルとギャ
ップ壁の間で擦れてビリツキ、ギャツ゛プレス不嵐等を
発生するおそれがなく、またプレートとスピーカー７レ
ームとの共振も防止できてスピーカーの音質、音響の向
上を図ることができる等の効果を有する。As described above, according to the present invention #4, the magnetic circuit assembly and the speaker frame are connected while the gap between the plates of the magnetic circuit assembly is closed with a synthetic resin film, so that during the fixing work of the speaker frame. The intrusion of iron powder, etc., generated during operation into the magnetic circuit assembly is prevented, and
A synthetic resin film is interposed between the plate and the speaker room 7, and the gap created therebetween is completely closed, so that iron powder and the like can be prevented from entering the gap. In addition, since a synthetic resin film is interposed between the plate and the speaker frame, there is no metal-to-metal contact between the two. Therefore, when the speaker is used, the vibrations may cause iron particles to damage the magnetic circuit assembly. There is no risk that the t protrudes from between the plate and the speaker 7 frame and rubs between the voice coil and the gap wall, causing twitching, press failure, etc., and also prevents resonance between the plate and the speaker 7 frame. This has effects such as being able to improve the sound quality and acoustics of the speaker.
第１ｖ！Ｊは、本発明によるスピーカーの縦断面図、第
２図は本発明の組立て方法を説明する要部の分解斜視図
、第３図は本発明の他例の組立て状態を示す要部の分解
断面図である。
図中（１）は磁気回路組立て体、（３）はプレート、（
３１）はギャップ部、（６）は合成樹脂フィルム、（６
ｍ）は開口部となるｉシン目、（７）はスピーカーフレ
ーム、（７ａ）は底面側開口部、ａ２は振動部組立て体
である。1st v! J is a vertical cross-sectional view of a speaker according to the present invention, FIG. 2 is an exploded perspective view of the main parts explaining the assembly method of the invention, and FIG. 3 is an exploded cross-section of the main parts showing the assembled state of another example of the invention. It is a diagram. In the figure, (1) is the magnetic circuit assembly, (3) is the plate, (
31) is the gap part, (6) is the synthetic resin film, (6
m) is the i-th opening, (7) is the speaker frame, (7a) is the bottom side opening, and a2 is the vibrating unit assembly.
Claims (1)
回路組立て体のプレートの表面に１合成樹脂フィルムを
重合し、核合成樹脂フィルムを介してスピーカー７レー
ムを上記プレート側に固定した後、上記合成樹脂フィル
ムを上記プレートのギャップ部に対応する部分を切除し
、上記プレートのギャップ部を上記スピーカーフレーム
側に開口するようｋしたことを４！微とするスピーカー
の組立て方法。A synthetic resin film is polymerized on the surface of the plate of a magnetic circuit assembly consisting of an i-net, a plate, a ball, and a yota, and after fixing seven speaker frames to the plate side via the nuclear synthetic resin film, the synthetic resin film is 4! The part corresponding to the gap part of the plate was cut out, and the gap part of the plate was opened toward the speaker frame side. How to assemble a small speaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19586181A JPS5896494A (en) | 1981-12-04 | 1981-12-04 | Assembling method for speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19586181A JPS5896494A (en) | 1981-12-04 | 1981-12-04 | Assembling method for speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5896494A true JPS5896494A (en) | 1983-06-08 |
Family
ID=16348201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19586181A Pending JPS5896494A (en) | 1981-12-04 | 1981-12-04 | Assembling method for speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113398A (en) * | 1984-11-08 | 1986-05-31 | Matsushita Electric Ind Co Ltd | Manufacture of speaker |
-
1981
- 1981-12-04 JP JP19586181A patent/JPS5896494A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113398A (en) * | 1984-11-08 | 1986-05-31 | Matsushita Electric Ind Co Ltd | Manufacture of speaker |
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