JPS589330A - Bonding method - Google Patents

Abstract

PURPOSE:To improve workability, by detecting a metal fine-wire end drawing out of a capillary end after cutoff, vibrating the fine-wire by a detecting signal, and drawing out to form a ball. CONSTITUTION:A capillary 4 and a clamp 5 are drawn up to a designated position after connecting a wire 6 to the second junction region 7a. Junction regions 7a, 3a and a semiconductor chip 3 are electrified through the wire 6. The wire 6 further than the junction is checked for cracks. When there is a defect and the wire 6 is cut off at the next process, the wire end goes into the capillary and no ball is formed at the end. In such a condition, the clamp 5 is given ultrasonic vibration, and the wire 6 contained between the clamp 5 and capillary 4 is drawn out to a designated length. A ball 6a is made at its end by hydrogen burner 8. This constitution enhances the workability, becuase the ball is formed rapidly to transfer to the next process even if there is a defect at the wire at locations further than the junction.

Description

[Detailed description of the invention] This work E14 relates to improvement of the -/Dinda method.

Conventionally, wires are installed between a semiconductor chip and inner leads constituting a semiconductor device.
4) to the same figure (q), this is done by automatic heating.
A semiconductor chip f placed on top via a lead frame 2
8c) Four carrier tools are arranged above the &I[]l#P endinder region 1a formed of an aluminum electrode or the like.

By adjusting the gripping force of the ramp 5 above the capillary tool 4, it is possible to
t 1st # ntinda area J & 0 then -1 runndinda is applied.

As shown in the same figure (B), the capillary tool 4 is pushed out from the tip of the cavity tree tool 4 in the second indinder region 1a'I), i1
The capillary tool 4 is transferred to the upper space between the inner leads on the heating table 1. When the capillary tool 4 reaches the inner lead area 1a, the capillary tool 4 is pushed down to heat a predetermined part of the inner lead wire 6. After crimping, the suditte performs the winding process. Then, the capillary tool 4 and the winding wire 6t are pulled up to 10,000 degrees, and the end wire 6t from the second N winding area 7a is cut, and the end of the capillary tool 4 is cut. Gending IIi introduced to the department!
Part 6 is hydrogen/! 1. Heat with Nina 8 and goal 6b'f
:Form. Capillary tool 4t-semiconductor chip again,
Move the conductor to the new lead II binding area of the lead S, and then repeat the same operation to install the lead I between the cow conductor CH, the lead S and the inner lead 7.
− is being constructed.

However, the second
As shown in FIG.
m6FX is in a slack state between the clang 5 and the capillary tool 4, and its tip is inserted into the capillary tool 4 and stored. In this way, since the Endinda II 6 is inside the capillary tool 4, it is not possible to form a hole at its tip with the hydrogen burner 8.
Result 1 Manually clamp 5 and capillary tool 4
However, it was necessary to push out the loose binding 6 from the cavity tool 4 to form the I-rule 6a, which caused the problem of extremely poor workability.

The present invention has been made in view of this point.

Even if there is a defect such as a crack in the one-in-board wire after the one-in-ring part where the stay or chiging is done, immediately inspect it.
- We have discovered a one-round inder method that can improve the workability of bonding by forming a hole.

An embodiment of the present invention will be described below.

First, as shown in FIG. 1 (4), the capillary tool 4 is
Adjust the gripping force of the lamp 5 to push out the cavity tree tool 4, +>-, onto the heating table 1 via the lead frame 1. The semiconductor chip 3 placed on the semiconductor chip 3 is placed on the leading edge area S island.

Next, as shown in FIG. Next, after pulling up the cavity tool 4 and clamp 5 to the specified position,
' is used to energize the second gendering area r1, first gendering area Ja, and semiconductor chip 7''J, and is there a defect such as a crack in the gendering line 6 after the stitch-goned area? If there is a defect such as a hole or a crack in the binding wire eK, the electrical resistance is large in that part and the required test current will not flow.As a result, in the next process, the binding wire 6 When cutting t-, the tip of the cutting wire C is cut with the cavity free tool 4.
It is in a state of being stuck inside. This ninth ga ndinda #e
It can be seen that it is not possible to form a loop at the tip.

In addition, from the tip of capillary tool 4 ms? Ending! If I4 is not derived, it will not be possible to form a groove in □, so it may be determined whether or not the binding line σ cannot be derived from the cavity 2 Lee tool 4 by conducting an energization test as described above, or After stitching, cut the I binding wire II, and then use an electric torch to generate a discharge between the cut end of the binding wire 6 that protrudes from the capillary tool 4, and ensure that the line is aligned. It may also be determined whether or not the endinder III# is derived from the library tool 4. In this case, if one binding wire C is led out from the capillary tool 4, discharge will occur and the wire 6a can be formed.

Furthermore, if the gun and the cylinder M# are not derived from the cavity 2 Lee tool 4, no discharge will occur, and of course one loop # will not occur.
The formation of lu also does not take place.

After that, after one energization test, the specified current is applied to the inverter! I
If the flow does not flow into the capillary tool 4, cut the first binding line #1 from the 2-nding area 7a onward. Although it was cut, the tip of the binding line 6 has entered the capillary tool 4 as shown in FIG. state. A similar situation occurs when no discharge occurs in the electric torch.

Next, as shown in FIG.
Gives vibration of about Hz. When the capillary 4 vibrates, the capillary 1716, which is stored in a loose state between the shoe 7 and the cavity 2 tool 4 and whose tip has entered the capillary tool 4, gradually moves into the capillary tool 4.
Derive its tip from .

Next, when the tip of the binding wire C is led out from the capillary tool 4 by the length of the arm due to the vibration of the flang 5, as shown in FIG.
And at the tip? - forming a rule 6a;

After that, the capillary tool 4f: the new first semiconductor chip f3 is moved to the running area Ja, -1 runding is performed, and then the new first one of the semiconductor chips f3 is moved to the 2dl ending area 11. Then, by repeating the same operations as described above, the wire between the semiconductor chip 7'J and the inner lead 7 achieves undinning.

In this way, the stiffener detects whether or not the tip of the cut S- binding has been led out from the capillary tool 4 after seven days, and if it has not been led out, it is fixed by vibrating the capillary 4. , since the tip of the gendering @g is reliably led out from the capillary tool 4 to form the I-rule, the primary binding operation is started, so manual extrusion of the gendering line I is not necessary. It is possible to do the same as above for better workability.

As explained above, according to the binder method according to the present invention, even if a defect such as a crack occurs in the part of the binding line after the binder part where the stiffener is bonded, the l-ru can be formed immediately. Since the next process can be carried out in one run, the work efficiency can be greatly improved.

[Brief explanation of the drawing]

Figure 1 (Q) is an explanatory diagram showing the process order of the binding operation from -1 runding to stiffener binding. FIG. 3 is an explanatory diagram showing a state in which the clamp f is vibrated to push out a binding wire, and FIG. It is an explanatory diagram showing a state in which a line is formed at the tip of the wire. 1... Heating table, 2... Lead frame, 3... Cattle conductor Chi, !, Ja" 1st - Ndeinda area, 4...
Capillary tool, J-...Flang, #...-Ending wire, Ca...-Rule, r...Inner lead, 1a...Second-end 43/da region, 8... Mizutake If-su. (A) Figure 'ii' (B) j! Figure 3
4th v4

Claims (1)

[Scope of Claims] A step of supplying a binding line from a cavity tree tool to the binding body 0IIl/landing area heated to a predetermined temperature, and applying a binding line to the binding area of the capillary tool tjl12I. and a predetermined portion of the Dinda wire to be heat-pressed and bonded;
a step of applying a binder; and a step of cutting at the binder after the @2-endinder region. a step of detecting whether or not the tip of the cut I-dinning wire is guided from the capillary tool; and based on the detection signal, one vibrates the ending wire to lead it out from the cavity-tree tool. and forming an I-rule in the lead-out portion.
landing method.