JPS5889702A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPS5889702A JPS5889702A JP18758881A JP18758881A JPS5889702A JP S5889702 A JPS5889702 A JP S5889702A JP 18758881 A JP18758881 A JP 18758881A JP 18758881 A JP18758881 A JP 18758881A JP S5889702 A JPS5889702 A JP S5889702A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive
- conductive paste
- paste
- muq
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims description 54
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910000417 bismuth pentoxide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は導電性ペーストに関し、安価で導電性、耐食性
のすぐれた導電性ペーストの提供を目的とするものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive paste, and an object of the present invention is to provide a conductive paste that is inexpensive and has excellent conductivity and corrosion resistance.
従来、この種の導電性ペーストには、導電用粉体として
Ａｕ 、 Ａｇ 、 Ｐｄなどの貴金属が用いられてき
た。一般的には導電用粉体にムｑを用い、ｐｂｏ 。Conventionally, noble metals such as Au, Ag, and Pd have been used as conductive powder in this type of conductive paste. Generally, muq is used as the conductive powder, and pbo is used.
Ｂｉ２Ｏ５、ＺｎＯを主成分とし、他にＢ２Ｏ３，５ｉ
ｏ２゜ムＱ２０３などを加えたガラスフリットとともに
、ビヒクル中に分散したペーストをセラミック等の基板
にスクリーン印刷等の方法で塗布した後、高温で焼成し
て、セラミックコンデンサ、圧電体素子。The main components are Bi2O5 and ZnO, and also B2O3,5i
A paste dispersed in a vehicle together with a glass frit containing O2゜Q203 and the like is applied to a ceramic substrate by a method such as screen printing, and then fired at a high temperature to produce ceramic capacitors and piezoelectric elements.
半導体セラミックなどの電極あるいは電子回路用の配線
導体として使用されて来た。It has been used as an electrode for semiconductor ceramics and as a wiring conductor for electronic circuits.
しかしながら、近年、貴金属類、特にＡｑ価格の高騰の
ために、導電性勾ペーストの代替として、安価な導電性
粉体を用いた導電性ペーストとか、セラミックの焼付用
電極として、Ｃｕ、Ｎｉのメッキ電極など、多くの提案
がなされている。たとえばＡｇ粉体の代用として、安価
なＮｉ 、 Ｃｕなどの卑金属粉体あるいはＴｉＮ 、
ＳｎＯ２などの導電性金属化合物粉体等を用いた導電
性６−ストが開発され、一部に市販されるようになって
来た。However, in recent years, due to the rise in the price of precious metals, especially Aq, as an alternative to conductive paste, conductive paste using inexpensive conductive powder, and Cu and Ni plating are used as electrodes for ceramic baking. Many proposals have been made, including electrodes. For example, as a substitute for Ag powder, inexpensive base metal powder such as Ni or Cu, or TiN,
Conductive 6-strokes using conductive metal compound powder such as SnO2 have been developed and are now commercially available in some cases.
しかしながら、ＴＩＮ 、 ５ｎ０２ などの導電性
ペーストは粉体自体が比較的高抵抗の材料であるために
低抵抗の導電性ペーストは得られにくく、さらに、Ｔｉ
Ｎは高温焼付型の導電性ペーストに対しては、大気中の
焼成では酸化してしまうため、使用できない欠点がある
。また、酸化物粉体を利用したものとしては、ムＱ２０
５粉体にムクコートした導電性粉体を用いた導電性ペー
ストもあるが、この種の導電ペーストは焼成後の導電膜
にはんだ付は性がないという弱点がある。他方、Ｎｉ、
Ｃｕなどの卑金属粉体を利用した導電性ペーストは大気
中での焼成が困難なこと、またＣｕ系は耐食性に難点が
見られる。However, since the powder itself of conductive pastes such as TIN and 5n02 is a material with relatively high resistance, it is difficult to obtain conductive pastes with low resistance.
N has the disadvantage that it cannot be used in high-temperature baking type conductive pastes because it oxidizes when baked in the atmosphere. In addition, as a product using oxide powder, MuQ20
There is also a conductive paste using a conductive powder coated with 5 powder, but this type of conductive paste has the disadvantage that the conductive film after firing has no solderability. On the other hand, Ni,
Conductive pastes using base metal powders such as Cu are difficult to sinter in the atmosphere, and Cu-based pastes have drawbacks in corrosion resistance.
一方、Ｎｉの高温大気中における酸化を改良する方法と
して、ＮｉにＢを添加することが知られている。Ｎ１−
Ｂ合金は酸化性雰囲気において加熱しても酸化スケール
の生成する割合が少ない。On the other hand, as a method for improving the oxidation of Ni in high-temperature atmosphere, it is known to add B to Ni. N1-
Alloy B generates less oxide scale even when heated in an oxidizing atmosphere.
これは、表面にＢ２０．の薄い層が発生し、合金の酸化
進行を防いでいるものと考えられる。しかしながら、導
電性ペーストとして十分な酸化性を得るまでに至らない
。このため、耐酸化性のより改良したものとして、Ｓｉ
を添加し、Ｎｉ−８ｔ −Ｂ合金粉を導電粉としたペー
ストの提案が見られる。This is B20 on the surface. It is thought that a thin layer of oxidation is generated to prevent the progress of oxidation of the alloy. However, it does not reach the point where sufficient oxidizing properties are obtained as a conductive paste. Therefore, as a material with improved oxidation resistance, Si
There are proposals for pastes in which conductive powder is made of Ni-8t-B alloy powder.
この方法は抵抗値の面において改良効果が認められるが
、はんだ付は性が失なわれる欠点がある。Although this method is effective in improving the resistance value, it has the disadvantage that soldering properties are lost.
以上のように、ムｑ代替として各種導電性ペーストが提
案さ庇ているが、いずれも、導電性、耐食性あるいはは
んだ付は性のいずれかに不満足な面があり、これら諸特
性のすぐれた安価な高温焼付型導電ペーストの出現が望
まれている。As mentioned above, various conductive pastes have been proposed as substitutes for muq, but all of them are unsatisfactory in terms of conductivity, corrosion resistance, or solderability. The emergence of a high-temperature baking type conductive paste is desired.
本発明者等は、上記したような導電性、耐食性、はんだ
付は性、さらには経済性をも満足できるべく、卑金属を
主成分とする合金粉体について調査検討した結果、基本
的にはＮｉを主成分とし、これにＢおよびａｎを添加し
た合金が、上記諸特性をかなりのレベルで満足すること
を見い出した。As a result of research and study on alloy powders mainly composed of base metals, the inventors of the present invention have found that Ni It has been found that an alloy containing B as the main component and to which B and an are added satisfies the above properties to a considerable degree.
以下、本発明について詳述する。The present invention will be explained in detail below.
本発明に係る導電性ペーストにおいて、その導電用粉体
はＮｉ −Ｂ−８ｎの合金粉体である。その組成比は８
３〜１０重駄％、 Ｓｎ ３〜１５重叶％。In the conductive paste according to the present invention, the conductive powder is a Ni-B-8n alloy powder. Its composition ratio is 8
3-10% Sn, 3-15% Sn.
残部Ｎｉがら成る。The remainder consists of Ni.
推察するに、この種導電性ペースト、特に高温焼付型導
電ペースト用導電媒体となる粉体において望まれる条件
は、
（、） 導電性があること、
■）耐熱酸化性があること、
（Ｃ） はんだ付けが可能であること、などがあげら
れる。Presumably, the desired conditions for this type of conductive paste, especially the powder that serves as the conductive medium for high-temperature baking type conductive paste, are: (,) conductivity, ■) thermal oxidation resistance, (C) For example, it must be possible to solder.
本発明における導電性粉体の主成分であるＮｉは導電性
の優れた金属であるが、耐食性、耐熱酸化性は良いとは
言えない。特に、高温焼付型のペースト用導電媒体とし
ては、その表面に多量の酸化スケールが発生し、導電性
が得られず不適当であるが、本発明に従えば、Ｎｉのこ
の弱点を先に記したＢおよびＳｎの添加により、改善さ
れることが見い出される９本発明において示すＮｉ −
Ｂ −８ｎ合金粉を導電粉体としたペーストはＢと相ま
ってＳｎＯ薄層酸化物が耐酸化性を強化し、他方、導電
性の面においては、８ｎ酸化物が半導体であるところか
ら、実用上許容し得る範囲に抑制される。一方、はんだ
付は性について言えば、Ｂの添加によってＢ２Ｏ５の被
膜が生成するため、焼成膜そのままの状態では良好なも
のと言えないが、スコッチブライトなどにより研摩すれ
ば、Ｓｎの添加効果によシ著しく改良され、実用上何等
問題はない。Ni, which is the main component of the conductive powder in the present invention, is a metal with excellent conductivity, but it cannot be said to have good corrosion resistance and thermal oxidation resistance. In particular, it is unsuitable as a conductive medium for high-temperature baking pastes because a large amount of oxide scale is generated on its surface, making it impossible to obtain conductivity. It has been found that the addition of B and Sn improves the Ni −
In the paste using B-8n alloy powder as conductive powder, the SnO thin layer oxide combined with B strengthens the oxidation resistance, and on the other hand, in terms of conductivity, since 8n oxide is a semiconductor, it is not practical. suppressed to an acceptable range. On the other hand, regarding soldering properties, the addition of B produces a B2O5 film, so the fired film cannot be said to be good as it is, but if it is polished with Scotchbrite etc., the effect of the addition of Sn can be improved. This has been significantly improved and there is no problem in practical use.
本発明において、Ｈｉ［ＢおよびＳｎを添加した効果を
見い出し得る組成比は、８３〜１０重量％。In the present invention, the composition ratio at which the effect of adding Hi[B and Sn can be found is 83 to 10% by weight.
Ｓｎ ３〜１６重量％、残部Ｎｉである。添加量の下限
は前述の効果を見い出し得る最少量である。上限は合金
粉の作成のしやすさにより主に制約され、またＳｎ量が
過多になるとＳｎ酸化膜が肥厚化し、抵抗値の上昇を招
来する。Sn is 3 to 16% by weight, and the balance is Ni. The lower limit of the amount added is the minimum amount at which the above-mentioned effect can be found. The upper limit is mainly limited by the ease of producing alloy powder, and if the amount of Sn is excessive, the Sn oxide film will become thick, leading to an increase in resistance value.
次に、本発明において、Ｎｉ −Ｂ−８ｎ合金粉体のみ
を導電媒体とした場合には、そのペースト焼成膜の特性
上、導電性においてなお不十分の而が多く、その用途に
制約が生じゃすいために、この点を補うものとしてＮ１
−Ｂ−８ｎ合金粉体にムｑ粉体を加え、これらの混合粉
体を導電硬体とすることを提案する。ムｑ粉体の添加に
よって、導電性ペースト焼成膜の導電性およびはんだ付
は性が更に改良される。Next, in the present invention, when only the Ni-B-8n alloy powder is used as a conductive medium, the conductivity is often insufficient due to the characteristics of the fired paste film, and there are restrictions on its use. In order to compensate for this point, N1
- It is proposed to add Muq powder to B-8n alloy powder and use the mixed powder as a conductive hard body. The addition of muq powder further improves the conductivity and solderability of the fired conductive paste film.
Ｎ１−Ｂ−８ｎ合金粉体とムｑ粉体との混合割合につい
て説萌すると、導電媒体としてＮｉ −Ｓｎ −Ｂ合金
粉体に加えてムｑ粉体を併せて用いることは、導電性、
はんだ付は性を改良することを可能とする。導電媒体に
占めるｌｉｉ −Ｂ−ａｎ合金粉体の占める割合が８０
体積％を越えるとムｑ粉体の添加の効果が小さく、また
２０体積％未満になると安価な導電性ペーストの提供と
いう本発明の目的にそぐわなくなるので、合金粉体とム
ｑ粉体との混合割合はＮｉ −Ｂ−ａｎ合金粉体量が２
０〜８０体積俗の範囲が望ましい。Explaining the mixing ratio of N1-B-8n alloy powder and Mq powder, using Mq powder in addition to Ni-Sn-B alloy powder as a conductive medium improves conductivity,
Soldering makes it possible to improve the properties. The proportion of lii-B-an alloy powder in the conductive medium is 80%.
If the amount exceeds 20% by volume, the effect of adding the muq powder will be small, and if it becomes less than 20% by volume, the purpose of the present invention, which is to provide an inexpensive conductive paste, will not be met. The mixing ratio is Ni-B-an alloy powder amount 2
A range of 0 to 80 volumes is desirable.
本発明に従えば、Ｎｉ −Ｂ−Ｓｎ合金粉体あるいはこ
の粉体とムｑ粉体の混合粉体が導電性ペーストの導電媒
体として供されるが、一般的には、上記粉体をＰｂＯ、
Ｂｉ２Ｏ５，Ｂ２Ｏ５、５ｔ０２ 、ムＱ２０５などか
ら成るガラスフリットとビヒクル中に分散して導電性ペ
ーストとなす。このペーストは通常のムｑ粉体を用いた
ペーストと同様に、セラミックなどの基板にスクリーン
印刷等の方法で塗布した後、高温で焼成し、電極、導電
路として利用される。According to the present invention, a Ni-B-Sn alloy powder or a mixed powder of this powder and Muq powder is used as a conductive medium of a conductive paste, but generally the powder is mixed with PbO. ,
It is dispersed in a vehicle and a glass frit consisting of Bi2O5, B2O5, 5t02, MuQ205, etc. to form a conductive paste. This paste is applied to a ceramic substrate by a method such as screen printing in the same way as a paste using ordinary muq powder, and then fired at a high temperature and used as an electrode or a conductive path.
粉体の粒径は０．０６〜１０μの範囲、好ましくはＯ，
Ｓ〜６μ程度が良い。１０μ以上になるとスクリーン印
刷時の印刷性が悪化し、最終焼成後の面抵恢が大きくな
る。The particle size of the powder is in the range of 0.06 to 10μ, preferably O,
Approximately S~6μ is good. When the thickness exceeds 10μ, printability during screen printing deteriorates, and surface resistance after final firing increases.
次に、本発明をより具体化するために実施例について詳
述する。Next, examples will be described in detail in order to make the present invention more concrete.
本発明に用いるＮｉ −Ｂ−Ｓｎ合金粉体は次のよ−う
にして作製した。本発明に従う組成に合わせて）ｉｔ−
Ｂ母合金、 ｌｉｔ 、 Ｓｎの各素材を秤量し、全量
を１９とした。これをアルゴンガス中で溶解し、さらに
、溶湯噴霧法によって粉体化した。噴霧媒としては窒素
ガスを利用し、水中投入冷却した。The Ni-B-Sn alloy powder used in the present invention was produced as follows. according to the composition according to the invention) it-
Each material of B master alloy, LIT, and Sn was weighed, and the total amount was set to 19. This was dissolved in argon gas and further pulverized by a molten metal spray method. Nitrogen gas was used as the spray medium and cooled by cooling it in water.
得られた粉体の粒径は６〜１００μ程度のものであるが
、これを機械式粉砕機にて再度粉体化し、平均粒径約２
μとした・
上記の方法によって得られたＮｉ −Ｂ−Ｓｎ合金粉体
は全量３ｑに秤量された。また、この合金粉体にムｑ粉
体を混合する場合には、ムｑ粉体（平掬粒径約２μ）を
も合わせて所定の混合割合になるように秤量し、全量を
３９とした。これをエチルセルロース（１ｏｏｃｐｓ）
とテレピネオールから成るビヒクルと、Ｇム−６（日本
電気硝子製、ホウケイ酸鉛系ガラスフリット）とともに
、フーバーマーラを用いて混練した。なお、金属粉体は
全量の８０重量％とし、フーノく−マーテによる混練は
、荷重１ｏｏポ／ド、４０回転を４回繰り返して行なっ
た。The particle size of the obtained powder is about 6 to 100μ, but this is re-pulverized using a mechanical crusher, and the average particle size is about 2.
The Ni-B-Sn alloy powder obtained by the above method was weighed to a total amount of 3q. In addition, when mixing muq powder with this alloy powder, weigh the muq powder (flat particle size approximately 2μ) so that the predetermined mixing ratio is obtained, and the total amount is 39. . This is ethyl cellulose (1oocps)
and terpineol were kneaded together with Gmu-6 (manufactured by Nippon Electric Glass Co., Ltd., lead borosilicate glass frit) using a Hubermala. The amount of metal powder was 80% by weight of the total amount, and kneading using a Funoku-Mate was repeated 4 times at a load of 10 mm and 40 revolutions.
上記作製したペーストはスクリーン印刷法を用いて、ア
ルミナ基板上に所定の形状に印刷されたのち、１２０Ｃ
で１０分間乾燥され、さらに、大気中８５０℃で１０分
間、その前後の温度上昇、温度下降を含めて１時間サイ
クルの条件で焼成された。The paste prepared above was printed in a predetermined shape on an alumina substrate using a screen printing method, and then 120C
The film was dried at 850° C. for 10 minutes in the air, and then fired under the conditions of a 1-hour cycle including temperature increases and decreases before and after that for 10 minutes.
上記焼成パターンの両端間の抵抗値を測定した結果、次
表に示す値を得た。なお表には、参考までに、同方法で
作成したムｑ粉体、Ｎｉ粉体、Ｎｉ粉体とムｑ粉体との
混合粉体にてペース）１−作製し、その焼成膜の特性も
同様に示す。As a result of measuring the resistance value between both ends of the above firing pattern, the values shown in the following table were obtained. For reference, the table shows the properties of the fired films prepared using Muq powder, Ni powder, and mixed powder of Ni powder and Muq powder prepared by the same method. is also shown in the same way.
また、焼成された膜面のはんだ付は性については、スコ
ッチブライドロールにて研摩したのち、２３０℃５０１
５０ ａｎ −Ｐｂ浴に松ヤニフラックスを塗布して３
秒間浸せきし、ノ；ターン面に対するはんだの付着割合
を、○、△、×の三段階で評価した。Regarding solderability of the fired film surface, after polishing with a Scotch Bride roll, 230℃ 501
50 an - Apply pine tar flux to the Pb bath 3
The solder was immersed for seconds, and the adhesion ratio of the solder to the turn surface was evaluated in three grades: ◯, △, and ×.
（以下余白）
上記表から明らかなように、本発明に係る導電性ゝ−ス
トは、ムｑ粉体を利用した従来のペーストに匹敵する値
を示す。他方、Ｎｉ粉を利用したペーストは全く満足で
きるものでない。(The following is a blank space) As is clear from the above table, the conductive paste according to the present invention exhibits values comparable to the conventional paste using muq powder. On the other hand, pastes using Ni powder are not completely satisfactory.
以上説明したように、本発明に係る導電性ペーストは、
十分に実用に供し得る性能を持ち、かつ経済的には、ム
ｑの削減により安価に作製し得ることから、その工業的
価値は犬なるものがある。As explained above, the conductive paste according to the present invention is
Since it has sufficient performance for practical use and can be produced economically by reducing muq, its industrial value is considerable.
Claims (1)
の組成より成る合金の粉体を、ガラスフリットとともに
ビヒクル中に分散させたことを特徴とする導電性ペース
ト。 （２） Ｂ３〜１０重量％、 Ｓｎ ３〜１５重量％
、残部Ｎｉの組成より成る合金の粉体２ｏ〜８０体積％
と、ムク粉体８０〜２０体積％の混合粉体を、ガラスフ
リットとともにビヒクル中に分散させたことを特徴とす
る導電性ペースト。[Claims] 0) 83-10% by weight, Sn 3-15% by weight, balance Ni
A conductive paste characterized by dispersing an alloy powder having the composition of the following in a vehicle together with a glass frit. (2) B3-10% by weight, Sn 3-15% by weight
, balance 20 to 80% by volume of alloy powder with a composition of Ni
A conductive paste characterized in that a mixed powder containing 80 to 20% by volume of solid powder is dispersed in a vehicle together with glass frit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18758881A JPS5889702A (en) | 1981-11-20 | 1981-11-20 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18758881A JPS5889702A (en) | 1981-11-20 | 1981-11-20 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5889702A true JPS5889702A (en) | 1983-05-28 |
| JPS6341166B2 JPS6341166B2 (en) | 1988-08-16 |
Family
ID=16208730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18758881A Granted JPS5889702A (en) | 1981-11-20 | 1981-11-20 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5889702A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7468514B1 (en) | 2007-06-15 | 2008-12-23 | Hamamatsu Photonics K.K. | Radiation image conversion panel, scintillator panel, and radiation image sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2962776B2 (en) * | 1989-08-31 | 1999-10-12 | 大日本印刷株式会社 | Composition for forming conductive pattern and method for forming conductive pattern |
-
1981
- 1981-11-20 JP JP18758881A patent/JPS5889702A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7468514B1 (en) | 2007-06-15 | 2008-12-23 | Hamamatsu Photonics K.K. | Radiation image conversion panel, scintillator panel, and radiation image sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6341166B2 (en) | 1988-08-16 |
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