JPS5867018A - Electrolytic capacitor - Google Patents
Electrolytic capacitorInfo
- Publication number
- JPS5867018A JPS5867018A JP56166654A JP16665481A JPS5867018A JP S5867018 A JPS5867018 A JP S5867018A JP 56166654 A JP56166654 A JP 56166654A JP 16665481 A JP16665481 A JP 16665481A JP S5867018 A JPS5867018 A JP S5867018A
- Authority
- JP
- Japan
- Prior art keywords
- exterior body
- electrolytic capacitor
- synthetic resin
- capacitor element
- storage space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 35
- 229920003002 synthetic resin Polymers 0.000 claims description 30
- 239000000057 synthetic resin Substances 0.000 claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 description 10
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000007977 PBT buffer Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electrophonic Musical Instruments (AREA)
- Primary Cells (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は電解コンデンサに係り、特に合成樹脂で外装
を施して形成されるチップ型電解コンデンサの改良に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electrolytic capacitors, and more particularly to improvements in chip-type electrolytic capacitors formed with a synthetic resin exterior.
電子回路のIC化等、電子部品の小型化に伴つて電解コ
ンデンサ素子が極めて小さく例えば数顛輻の電極箔で直
径5鶴以下に巻回される場合、素子の外装にはアルミニ
ウムケース等に代えて素子自体を合成樹脂でモールドす
る方法が採用されている。しかしながら、電解コンデン
サ素子は有極性構造で内部に電解液を含浸していること
から、他の電子部品と異なり静電容量等電気的特性を一
定に維持する上で、外装には十分な気密性が要求される
。即ち、電解コンデンサ素子は電流の通流で電解液の電
気分解により水素ガスを発生することから、電解液の蒸
発防止や不純物の吸入防止は勿論のこと、発生ガスによ
る内部圧力の上昇に耐え得るに十分な気密性の保持が必
要である。With the miniaturization of electronic components, such as the use of ICs in electronic circuits, when electrolytic capacitor elements are extremely small and are wound with several layers of electrode foil to a diameter of less than 5 mm, the exterior of the element should be replaced with an aluminum case, etc. A method has been adopted in which the element itself is molded with synthetic resin. However, because electrolytic capacitor elements have a polar structure and are impregnated with electrolyte, unlike other electronic components, the exterior must have sufficient airtightness to maintain constant electrical characteristics such as capacitance. is required. In other words, since an electrolytic capacitor element generates hydrogen gas by electrolyzing the electrolyte when current is passed through it, it not only prevents the evaporation of the electrolyte and the inhalation of impurities, but also can withstand the increase in internal pressure caused by the generated gas. It is necessary to maintain sufficient airtightness.
そこで、電解コンデンサ素子を合成樹脂で外装する場合
、電解コンデンサ素子から引出された端子即ち金属板と
合成樹脂の密着性が外装の気密性を保持する上で重要な
要素となる。とりわけ電解コンデンサ素子の小型化で端
子用金属板が小さくなる場合、両者間の気密性の保持は
より強固にすることが必要である。一般に熱可塑性合成
樹脂は熱硬化性合成樹脂に比較して金属との密着性が低
く、熱可塑性合成樹脂単体での外装−は気密不良となる
おそれが大である。また、熱硬化性合成樹脂の場合、成
形温度が150〜180℃と高く、電解液を含浸した電
解コンデンサ素子、をモールドした場合、加熱処理で電
解液が蒸発してしまうため、電解液の含浸はモールド後
に行う必要がある。しかし、素子を熱硬化性合成樹脂の
みでモールドする場合、その成形圧力が素子に作用する
と、素子が圧縮されて固化するため、モールド後電解液
を含浸するとしても電解液の含浸が不十分になり、静電
容量の低下やtanδの増大等の不都合を生じ、或いは
圧縮によって化成酸化皮膜に損傷が生じると、漏洩電流
を増大させる原因になる。また、電解液の含浸のために
注入孔を形成した場合、熱硬化性樹脂によると注入孔の
封止が極めて面倒で気密漏れの原因になるおそれがある
。Therefore, when an electrolytic capacitor element is packaged with a synthetic resin, the adhesion between the terminals drawn out from the electrolytic capacitor element, that is, the metal plate, and the synthetic resin is an important factor in maintaining the airtightness of the package. In particular, when the metal plates for terminals become smaller due to miniaturization of electrolytic capacitor elements, it is necessary to maintain airtightness between the two even more strongly. In general, thermoplastic synthetic resins have lower adhesion to metals than thermosetting synthetic resins, and there is a high risk that an exterior made of thermoplastic synthetic resin alone will have poor airtightness. In addition, in the case of thermosetting synthetic resin, the molding temperature is as high as 150 to 180°C, and when an electrolytic capacitor element impregnated with an electrolytic solution is molded, the electrolytic solution evaporates during heat treatment, so the impregnation of the electrolytic solution is difficult. must be done after molding. However, when an element is molded only with thermosetting synthetic resin, when the molding pressure acts on the element, the element is compressed and solidified, so even if it is impregnated with electrolyte after molding, the electrolyte will not be sufficiently impregnated. This causes problems such as a decrease in capacitance and an increase in tan δ, or if the chemical oxide film is damaged due to compression, this causes an increase in leakage current. Further, when an injection hole is formed for impregnation with an electrolytic solution, sealing the injection hole with a thermosetting resin is extremely troublesome and may cause airtight leakage.
この発明の目的は、熱可塑性合成樹脂で形成された外装
体に熱硬化性合成樹脂層を形成して金属との密着性が低
い熱可塑性合成樹脂の欠点を補い、ある。An object of the present invention is to form a thermosetting synthetic resin layer on an exterior body made of thermoplastic synthetic resin to compensate for the drawback of thermoplastic synthetic resin having low adhesion to metal.
この発明は、熱可塑性合成樹脂で成形加工された外装体
の内部に形成された収納空間に電解コンデンサ素子を封
入し、この電解コンデンサ素子の電極箔に接続されかつ
前記外装体より引出された端子の外装体近傍表面ととも
に外装体の外表面を熱硬化性合成樹脂層で被覆したこと
を特徴とするものである。In this invention, an electrolytic capacitor element is enclosed in a storage space formed inside an exterior body molded from thermoplastic synthetic resin, and a terminal connected to an electrode foil of the electrolytic capacitor element and drawn out from the exterior body. It is characterized in that the outer surface of the exterior body as well as the surface near the exterior body is coated with a thermosetting synthetic resin layer.
以下、この発明を図面に示した実施例に基づき詳細に説
明する。Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第1図及び第2図はこの発明の電解コンデンサの実施例
を示し、第1図はその外形形状を示す斜視図、第2図は
第1図の■−■線に沿う断面を示している。図において
、電解コンデンサ素子を封入する外装体2はポリプロピ
レン、ノリル、ナイロン、PBT、PPS等の熱可塑性
合成樹脂で成形加工された有底角筒状の外装体片2A、
2Bを接合して構成されており、この外装体2に形成さ
れた収納空間4の内部には円柱状の巻回型電解コンデン
サ素子6が封入されている。この電解コンデンサ素7r
6の陽極側又は陰極側の電極箔に接続された端子8.1
0は電解コンデンサ素子6の互に反対方向の端面部より
引出され、さらに外装体2の長手方向の端面即ち外装体
片2A、2Bの接合部を貫通して外装体2の外部に引出
されている。1 and 2 show an embodiment of the electrolytic capacitor of the present invention, FIG. 1 is a perspective view showing its external shape, and FIG. 2 is a cross section taken along the line ■-■ in FIG. 1. . In the figure, the exterior body 2 that encloses the electrolytic capacitor element is a bottomed rectangular cylindrical exterior body piece 2A molded from thermoplastic synthetic resin such as polypropylene, noryl, nylon, PBT, PPS, etc.
2B joined together, and a cylindrical wound electrolytic capacitor element 6 is sealed inside a storage space 4 formed in this exterior body 2. This electrolytic capacitor element 7r
Terminal 8.1 connected to the electrode foil on the anode side or cathode side of 6
0 are drawn out from the end faces of the electrolytic capacitor element 6 in opposite directions, and are further drawn out to the outside of the sheath 2 through the longitudinal end face of the sheath 2, that is, the joint between the sheath pieces 2A and 2B. There is.
この実施例の場合、端子8.1oは電極箔に直接接続さ
れる内部リード12と、外部接続を可能にする外部リー
ド14とからなり、内部リード12は電極箔と同種の金
属で、また外部リード14は例えば半田付は可能な金属
で、共に帯状に形成されている。各リード12.14は
外装体2の埋込み部分において、圧着又は溶接等の手段
で固着されている。そして、前記外装体2の外表面はそ
の一部を除き、外装体2から引出された端子8.10の
外装体近傍の表面部分とともにエポキシ、フェノール等
の熱硬化性合成樹脂層16で被覆されている。なお、端
子8.10は外装体2の側面部に形成された合成樹脂層
16の上面に折曲して臨マセられ、プリント基板等に直
付けするためのフェイスボンディング用端子部として用
いられる。In this embodiment, the terminal 8.1o consists of an inner lead 12 that is directly connected to the electrode foil and an outer lead 14 that allows an external connection, the inner lead 12 being of the same kind of metal as the electrode foil and the outer The leads 14 are made of metal that can be soldered, for example, and are both formed in a band shape. Each lead 12, 14 is fixed in the embedded part of the exterior body 2 by means such as crimping or welding. The outer surface of the exterior body 2, except for a part thereof, is coated with a thermosetting synthetic resin layer 16 of epoxy, phenol, etc. together with the surface portion near the exterior body of the terminal 8.10 pulled out from the exterior body 2. ing. The terminals 8 and 10 are bent onto the upper surface of the synthetic resin layer 16 formed on the side surface of the exterior body 2 and are used as face bonding terminals for direct attachment to a printed circuit board or the like.
第3図は前記電解コンデンサ素子6及びその端子構造を
示し、内部リード12は折曲して素子6の中心部に臨ま
せ、この内部リード12の上面又は下面に外部リード1
4を重ね合せて溶着する。FIG. 3 shows the electrolytic capacitor element 6 and its terminal structure. The internal lead 12 is bent to face the center of the element 6, and the external lead 1 is placed on the upper or lower surface of the internal lead 12.
4 and weld them together.
なお、外部リード14の先端両側部には外装体2の合成
樹脂との密着性を高めるために凹凸部17が形成されて
いる。Incidentally, uneven portions 17 are formed on both sides of the tip of the external lead 14 in order to improve adhesion to the synthetic resin of the exterior body 2.
そして、電解コンデンサ素子6を外装する前記外装体2
は、第4図に示すように内部に収納空間4が形成された
2個の外装体片2A、2Bからなり、一方の外装体片2
Aの外面中央には小径の突出部18が形成され、この突
出部1″′8には収納空間4に電解液を注入する注入孔
20が穿設されている。従って、電解コンデンサー子6
は対向させた外装体片2A、2Bの収納空間4の内部中
央に置き、その端子8.10を外装体片2A、2Bの外
部に引出した状態で、加圧しつつ加熱溶着又は超音波溶
着て外装体片2A、2Bを接合すれば、電解コンデンサ
素子6は第5図に示すように外装体2の内部に封入され
る。そして、第6図に示すように外装体2の外表面及び
外装体2から引出された端子8、lOの表面部分に注入
孔20を除き熱硬化性合成樹脂層16を形成した後、注
入孔20より電解液22を注入して電解コンデンサ素子
6に含浸させる。この電解液の含浸の後、第7図(A)
に示すように注入孔20に熱可塑性合成樹脂からなる円
鰭台形の栓24を挿入し、矢印Aの方向より加圧しなが
ら加熱溶着又は超音波溶着て成形加工すれば、第7図(
B)に示すように注入孔20が閉塞される。The exterior body 2 that exteriorizes the electrolytic capacitor element 6
consists of two exterior body pieces 2A and 2B each having a storage space 4 formed therein, as shown in FIG.
A small-diameter protrusion 18 is formed at the center of the outer surface of A, and an injection hole 20 for injecting electrolyte into the storage space 4 is bored in this protrusion 1'''8.
is placed in the center of the storage space 4 of the facing exterior body pieces 2A, 2B, and with the terminal 8.10 pulled out to the outside of the exterior body pieces 2A, 2B, heat welding or ultrasonic welding is performed while applying pressure. When the exterior body pieces 2A and 2B are joined, the electrolytic capacitor element 6 is sealed inside the exterior body 2 as shown in FIG. Then, as shown in FIG. 6, a thermosetting synthetic resin layer 16 is formed on the outer surface of the exterior body 2 and the surface portions of the terminals 8 and 10 pulled out from the exterior body 2, excluding the injection holes 20, and then the injection holes are Electrolytic solution 22 is injected from 20 to impregnate the electrolytic capacitor element 6. After impregnation with this electrolyte, Fig. 7 (A)
A trapezoidal plug 24 made of thermoplastic synthetic resin is inserted into the injection hole 20 as shown in FIG.
The injection hole 20 is closed as shown in B).
以上のように構成したので、熱可塑性合成樹脂で成形加
工された外装体2の外表面及び外装体2より引出された
端子8.10の外装体2の近傍表面が熱硬化性合成樹脂
層16で被覆されるため、外装体2の外装体片2A、2
Bの接合部分及び端子8.10の引出し部分の気密性が
前記合成樹脂層16の形成によって高度に保たれるので
、電解液の蒸発や不純物の吸収等が防止でき、電気的特
性を長期に亘り一定に維持することができる。なお、外
装体2に形成された注入孔20は熱的処理で確実に閉塞
でき、十分な気密性を確保することができる。With the above configuration, the outer surface of the exterior body 2 molded from thermoplastic synthetic resin and the surface near the exterior body 2 of the terminal 8.10 pulled out from the exterior body 2 are coated with the thermosetting synthetic resin layer 16. Therefore, the exterior body pieces 2A, 2 of the exterior body 2
The formation of the synthetic resin layer 16 maintains a high degree of airtightness at the joint part B and the lead-out part of the terminal 8.10, so evaporation of the electrolyte and absorption of impurities can be prevented, and the electrical characteristics can be maintained for a long time. It can be maintained constant over time. Note that the injection hole 20 formed in the exterior body 2 can be reliably closed by thermal treatment, and sufficient airtightness can be ensured.
また、外装体片2人、2Bの内部には電解コンデンサ素
子6より大なる収納空間4が形成されており、しかも熱
硬化性合成樹脂層16は外装体片2、A、2Bを接合し
た後の外装体2に形成される結果、外装体片2A、2B
の接合又は合成樹脂層16の形成時の成形圧力は外装体
2で阻止されて電解コンデンサ素子6に作用しないので
、電解コンデンサ素子6の固化や化成酸化皮膜の損傷の
発生が防止できる。即ち、固化の防止によって電解コン
デンサ素子6に電解液を十分に含浸させることができる
ため、静電容量の低下やtanδの増加等の不都合を未
然に防止できるとともに、化成酸化皮膜の損傷防止によ
って漏洩電流を抑制することができる。この結果電気的
特性の優れた電解コンデンサを得ることができる。Furthermore, a storage space 4 larger than the electrolytic capacitor element 6 is formed inside the two exterior body pieces 2B, and the thermosetting synthetic resin layer 16 is formed after the exterior body pieces 2, A, and 2B are joined. As a result, the exterior body pieces 2A, 2B are formed on the exterior body 2.
The molding pressure during bonding or formation of the synthetic resin layer 16 is blocked by the exterior body 2 and does not act on the electrolytic capacitor element 6, so that solidification of the electrolytic capacitor element 6 and damage to the chemical oxide film can be prevented. In other words, by preventing solidification, the electrolytic capacitor element 6 can be sufficiently impregnated with the electrolyte, thereby preventing inconveniences such as a decrease in capacitance and an increase in tan δ, and preventing damage to the chemical oxide film to prevent leakage. Current can be suppressed. As a result, an electrolytic capacitor with excellent electrical characteristics can be obtained.
以上説明したようにこの発明によれば、熱可塑性合成樹
脂からなる外装体の表面及び外装体から引出された端子
の外装体近傍表面に熱硬化性合成樹脂層を形成したので
、気密性の優れた外装体が得られ、電気的特性を′一定
に維持することができる。As explained above, according to the present invention, a thermosetting synthetic resin layer is formed on the surface of the exterior body made of thermoplastic synthetic resin and on the surface near the exterior body of the terminal pulled out from the exterior body, resulting in excellent airtightness. This results in an exterior body that maintains constant electrical characteristics.
第1図はこの発明の電解コンデンサの実施例を示す斜視
図、第2図は第1図の■−■線に沿う断面図、第3図は
電解コンデンサ素子及びその端子構造を示す斜視図、第
4図は外装方法を示す説明図、第5図は外装体で外装し
た素子の斜視図、第6図は電解液含浸前の電解コンデン
サを示す断面図、第7図(A)及び(B)は注入孔の閉
塞方法を示す説明図である。
2・・・外装体、2A、2B・・・外装体片、4・・・
収納空間、6・・・電解コンデンサ素子、8、lO・・
・端子、16・・・熱硬化性合成樹脂層。
第1図
第2図
第3図
第4図
第5図
第6図FIG. 1 is a perspective view showing an embodiment of the electrolytic capacitor of the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a perspective view showing an electrolytic capacitor element and its terminal structure. Fig. 4 is an explanatory diagram showing the packaging method, Fig. 5 is a perspective view of the element packaged with the packaging body, Fig. 6 is a sectional view showing the electrolytic capacitor before being impregnated with electrolyte, and Figs. 7 (A) and (B). ) is an explanatory diagram showing a method of closing an injection hole. 2... Exterior body, 2A, 2B... Exterior body piece, 4...
Storage space, 6... Electrolytic capacitor element, 8, lO...
- Terminal, 16... thermosetting synthetic resin layer. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6
Claims (2)
の外装体の内部に形成された収納空間の内部に封入され
る電解コンデンサ素子と、この電解コンデンサ素子の電
極箔に接続されかつ前記外装体より引出された端子の外
装体近傍表面とともG二外装体の外表面に形成した熱硬
化性合成樹脂層とから構成したことを特徴とする電解コ
ンデンサ。(1) An exterior body molded from thermoplastic synthetic resin, an electrolytic capacitor element sealed in a storage space formed inside the exterior body, and an electrolytic capacitor element connected to the electrode foil of the electrolytic capacitor element and 1. An electrolytic capacitor comprising a thermosetting synthetic resin layer formed on the outer surface of the G2 exterior body as well as the surface near the exterior body of a terminal pulled out from the exterior body.
有底角筒状の外装体片を接合して構成したことを特徴と
する特許請求の範囲第1項に記載の電解コンデンサ。(2) The electrolytic capacitor according to claim 1, wherein the exterior body is constructed by joining together exterior body pieces in the shape of a square cylinder with a bottom in which the storage space is formed.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56166654A JPS5867018A (en) | 1981-10-19 | 1981-10-19 | Electrolytic capacitor |
KR8204701A KR880001650B1 (en) | 1981-10-19 | 1982-10-19 | Electrolytic Capacitor and its manufacturing method |
DE198282109657T DE78001T1 (en) | 1981-10-19 | 1982-10-19 | ELECTROLYTE CAPACITOR AND METHOD FOR PRODUCING THE SAME. |
DE8282109657T DE3278548D1 (en) | 1981-10-19 | 1982-10-19 | Electrolytic capacitor and a process for producing the same |
EP82109657A EP0078001B1 (en) | 1981-10-19 | 1982-10-19 | Electrolytic capacitor and a process for producing the same |
US06/435,186 US4558399A (en) | 1981-10-19 | 1982-10-19 | Electrolytic capacitor and a process for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56166654A JPS5867018A (en) | 1981-10-19 | 1981-10-19 | Electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5867018A true JPS5867018A (en) | 1983-04-21 |
JPS629209B2 JPS629209B2 (en) | 1987-02-27 |
Family
ID=15835268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56166654A Granted JPS5867018A (en) | 1981-10-19 | 1981-10-19 | Electrolytic capacitor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5867018A (en) |
KR (1) | KR880001650B1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS559596U (en) * | 1978-07-06 | 1980-01-22 |
-
1981
- 1981-10-19 JP JP56166654A patent/JPS5867018A/en active Granted
-
1982
- 1982-10-19 KR KR8204701A patent/KR880001650B1/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS559596U (en) * | 1978-07-06 | 1980-01-22 |
Also Published As
Publication number | Publication date |
---|---|
KR840002151A (en) | 1984-06-11 |
KR880001650B1 (en) | 1988-09-03 |
JPS629209B2 (en) | 1987-02-27 |
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