JPS5856472B2 - Planar electrical circuit products with insulation coating - Google Patents
Planar electrical circuit products with insulation coatingInfo
- Publication number
- JPS5856472B2 JPS5856472B2 JP9284379A JP9284379A JPS5856472B2 JP S5856472 B2 JPS5856472 B2 JP S5856472B2 JP 9284379 A JP9284379 A JP 9284379A JP 9284379 A JP9284379 A JP 9284379A JP S5856472 B2 JPS5856472 B2 JP S5856472B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- electrical circuit
- insulating material
- flux
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 title claims description 9
- 238000000576 coating method Methods 0.000 title claims description 9
- 238000009413 insulation Methods 0.000 title 1
- 239000011888 foil Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 18
- 239000011810 insulating material Substances 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Description
【発明の詳細な説明】
この発明はリード線を接続する場合に能率的にろう接作
業をおこなうことのできる面発熱体等絶縁被覆を有する
面状電気回路製品に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a planar electrical circuit product having an insulating coating, such as a planar heating element, which allows efficient soldering work when connecting lead wires.
金属箔で形成された発熱回路を絶縁材料で被覆してなる
面発熱体の端子部にリード線を接続する場合は、従来、
端子部の絶縁材料を除き、さらにはレジストインキ層（
プリント配線の際エツチング剤から金属箔な保護するた
めに塗布されるインキの層）が残っている場合はそのレ
ジストインキ層をも除去したのち、露出した金属箔面ま
たはろう材にろう接円フラックスを塗布し、ろう接（普
通ははんだ付け）を行なうという方法かとられた。Conventionally, when connecting lead wires to the terminals of a surface heating element made by covering a heating circuit made of metal foil with an insulating material,
In addition to removing the insulating material of the terminal part, the resist ink layer (
If there is a layer of ink applied to protect the metal foil from etching agents during printed wiring, remove that resist ink layer as well, then apply soldering flux to the exposed metal foil surface or brazing material. The method used was to apply a coating and perform soldering (usually soldering).
しかしながら、このように絶縁材料やレジストインキ層
を除去したのちフラックスを塗布してろう接すると言う
方法は、人手な必要とする作業が多く非能率的であるの
で、これを能率的に行なう方法に対する要望が強がった
。However, this method of removing the insulating material and resist ink layer and then applying flux and soldering requires a lot of manual labor and is inefficient. The demand became stronger.
この発明はこのような事情に鑑みなされたもので、端子
部へのリード線のろう接をより能率的に行なうことがで
きるような、絶縁被覆を有する面状電気回路製品を提供
することを目的としている。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a planar electric circuit product having an insulating coating, which enables more efficient soldering of lead wires to terminal portions. It is said that
以下にこれについて説明する。This will be explained below.
この発明にかかる自発熱体等絶縁被覆を有する面状電気
回路製品は、絶縁材料で被覆されている電気回路の端子
部に相当する位置の金属箔面にろう接円フラックスがあ
らかじめ塗布されていることを特徴としている。In the planar electric circuit product having an insulating coating such as a self-heating element according to the present invention, a soldering circle flux is applied in advance to the metal foil surface at a position corresponding to the terminal part of the electric circuit covered with an insulating material. It is characterized by
これを実施例にもとづいて説明すれば、第１図はこの発
明にかかる面発熱体の平面図であり、第２図はそのＡ−
Ａ’力方向部分断面図である。To explain this based on an example, FIG. 1 is a plan view of a surface heating element according to the present invention, and FIG.
A' is a partial sectional view in the force direction.
金属箔１で形成された発熱回路２はその全体が絶縁材料
３によって被覆されているのであるが、その端子部２′
においては第２図に示されているように金属箔１とレ
ジストインキ層４との間にフラックス５が予め塗布され
ている。The entire heating circuit 2 formed of metal foil 1 is covered with an insulating material 3, and the terminal portion 2'
As shown in FIG. 2, a flux 5 is applied in advance between the metal foil 1 and the resist ink layer 4.
面発熱体は普通、絶縁材料として合成樹脂シートを、ま
た金属箔としてアルミニウム、ステンレススチール、ま
たは亜鉛などの箔を用いてつくられる。Surface heating elements are usually made using a synthetic resin sheet as the insulating material and a foil of aluminum, stainless steel, or zinc as the metal foil.
その製造手順としては金属箔を先ず絶縁材料に接着し、
金属箔面にレジストインキで所定の回路を印刷したのち
エツチングして金属箔の不要な部分を除去することによ
り回路を形成し、その上から絶縁材料を貼り合わせるの
が一般的である。The manufacturing procedure is to first glue the metal foil to the insulating material,
It is common to form a circuit by printing a predetermined circuit on the surface of the metal foil with resist ink, etching it to remove unnecessary parts of the metal foil, and then bonding an insulating material over the circuit.
端子部の金属箔面にあらかじめフラックス層を形成して
おく場合は、上記レジストインキで印刷スる工程の前に
適当な方法、例えばスクリーン印刷やグラビア印刷の手
法で塗布しておく。When a flux layer is previously formed on the metal foil surface of the terminal portion, it is applied by an appropriate method, such as screen printing or gravure printing, before the resist ink printing step.
この場合のフラックス層の形成は機械力・と利用するこ
とができるので、能率的に行なうことができる。In this case, the flux layer can be formed efficiently using mechanical force.
なお、レジストインキを用いないで回路を形成する場合
は金属箔１と絶縁材料との間にフラックス層５が形成さ
れることになる。Note that when forming a circuit without using resist ink, a flux layer 5 is formed between the metal foil 1 and the insulating material.
ろう接方法としてはこの場合はんだ付けが常用されてい
るので、フラックスははんだ用のフラックスな用いれば
よい。Since soldering is commonly used in this case, the flux may be any soldering flux.
第３図はこの自発熱体の端子部２′ にリード線６をは
んだ付げした状態を示す。FIG. 3 shows a state in which a lead wire 6 is soldered to the terminal portion 2' of this self-heating element.
同図中７ははんだである。7 in the figure is solder.
この自発熱体の端子部２／ にリード線をはんだ付けす
る場合は、端子部をおおう絶縁材料３（レジストインキ
層がある場合はレジストインキ層４も）を剥離し端子部
２′のフラックス層５を露出させたのち、はんだをはん
だごてで溶かして金属箔面に重ねたリード線の上に供給
してやるだけでよい。When soldering a lead wire to the terminal part 2/ of this self-heating element, peel off the insulating material 3 (and the resist ink layer 4 if there is a resist ink layer) covering the terminal part, and then peel off the flux layer on the terminal part 2'. After exposing 5, all you need to do is melt the solder with a soldering iron and supply it onto the lead wire layered on the metal foil surface.
あらためてフラックスを塗布する必要がないので従来必
要であったろう接作業でのフラックスを塗布する作業が
不要となり、はるかに能率的にろう接を行なうことがで
きる。Since there is no need to apply flux again, the work of applying flux during soldering work, which was required in the past, is no longer necessary, and it is possible to perform soldering much more efficiently.
端子部のこのような構造（ろう接部にあらかじめフラッ
クス層を形成しておく構造）は単に面発熱体のみならず
、金属箔からなる電気回路を絶縁材料で被覆してなる部
品一般に応用することが可能であることは明らかである
。This structure of the terminal part (a structure in which a flux layer is formed on the soldered part in advance) can be applied not only to surface heating elements, but also to general parts made of electrical circuits made of metal foil covered with insulating material. is clearly possible.
実施例
あらかじめ絶縁材料上に接着されている金属箔の端子に
あたる部分へのフラックスの塗布を（Ａ）スクリーン印
刷および（Ｂ） グラビア印刷の２通りの方法で行な
ったのち、それぞれについてレジストインキでその上か
ら回路を印刷し、エツチングを施して回路を形成した。Example Flux was applied to the terminal portion of the metal foil that had been previously adhered to the insulating material using two methods: (A) screen printing and (B) gravure printing, and then each was coated with resist ink. The circuit was printed on top and etched to form the circuit.
つぎに、形成された回路の上から絶縁材料を貼りつげて
自発熱体を得た。Next, an insulating material was pasted on top of the formed circuit to obtain a self-heating element.
しかるのち、この自発熱体の端子部の絶縁材料とレジス
トインキ層とを剥離し、露出したフラックス層の上から
リード線ヲ押し当ててはんだ付けを行なったところ、リ
ード線は従来のものと同様、強固に接続され、何ら異常
は認められなかった。After that, the insulating material and resist ink layer of the terminal part of this self-heating element were peeled off, and the lead wires were pressed onto the exposed flux layer and soldered, and the lead wires were the same as conventional ones. , the connection was strong and no abnormality was observed.
以上に説明した如く、この発明にかかる、絶縁被覆を有
する面状電気回路部品は、絶縁材料で被覆されている電
、気回路の端子部に相当する位置の金属箔面にろう接円
フラックスがあらかじめ塗布されていることを特徴とす
るので、端子部へのリード線のろう接をより能率的に行
なうことが可能となった〇As explained above, in the planar electrical circuit component having an insulating coating according to the present invention, a soldering circle flux is applied to the metal foil surface at a position corresponding to the terminal portion of the electrical or electrical circuit covered with the insulating material. Since it is pre-coated, it is now possible to more efficiently braze the lead wires to the terminals.
第１図はこの発明にかかる面発熱体の平面図、第２図は
第１図におげろＡ−Ｒ方向の部分断面図、第３図は端子
部にリード線をはんだ付けした状態をあられす断面図で
ある。
１・・・・・・金属箔、２・・・・・・電気回路、２／
・・・・・・端子部、３・・・・・・絶縁材料、４・
・・・・・レジストインキ層、５・・・・・・フラック
ス、６・・・・・・リード線、７・・・・・・はんだ。Fig. 1 is a plan view of a surface heating element according to the present invention, Fig. 2 is a partial sectional view taken along the A-R direction of Fig. 1, and Fig. 3 shows a state in which lead wires are soldered to the terminal portions. FIG. 1... Metal foil, 2... Electric circuit, 2/
...Terminal part, 3...Insulating material, 4.
...Resist ink layer, 5...Flux, 6...Lead wire, 7...Solder.
Claims (1)
なる面状電気回路製品において、電気回路の端子部に相
当する位置の金属箔面にろう接円フラックスかあらかじ
め塗布されていることを特徴とする、絶縁被覆を有する
面状電気回路製品、２ 絶縁被覆を有する首状電気回路
製品が面発熱体である特許請求の範囲第１項記載の絶縁
被覆な有する面状電気回路製品。1. In a planar electric circuit product consisting of an electric circuit formed of metal foil covered with an insulating material, it is necessary to confirm that a soldering circle flux is applied in advance to the metal foil surface at the position corresponding to the terminal part of the electric circuit. A planar electrical circuit product having an insulating coating, characterized in that: 2. A planar electrical circuit product having an insulating coating according to claim 1, wherein the neck-shaped electrical circuit product having an insulating coating is a planar heating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9284379A JPS5856472B2 (en) | 1979-07-21 | 1979-07-21 | Planar electrical circuit products with insulation coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9284379A JPS5856472B2 (en) | 1979-07-21 | 1979-07-21 | Planar electrical circuit products with insulation coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5618383A JPS5618383A (en) | 1981-02-21 |
| JPS5856472B2 true JPS5856472B2 (en) | 1983-12-15 |
Family
ID=14065707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9284379A Expired JPS5856472B2 (en) | 1979-07-21 | 1979-07-21 | Planar electrical circuit products with insulation coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856472B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497683A (en) * | 1978-01-19 | 1979-08-01 | Kureha Chem Ind Co Ltd | Multi-ply laminate having high gas barrier properties |
-
1979
- 1979-07-21 JP JP9284379A patent/JPS5856472B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5618383A (en) | 1981-02-21 |
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