JPS5855767Y2 - Printed board mounting structure on back panel - Google Patents
Printed board mounting structure on back panelInfo
- Publication number
- JPS5855767Y2 JPS5855767Y2 JP17588078U JP17588078U JPS5855767Y2 JP S5855767 Y2 JPS5855767 Y2 JP S5855767Y2 JP 17588078 U JP17588078 U JP 17588078U JP 17588078 U JP17588078 U JP 17588078U JP S5855767 Y2 JPS5855767 Y2 JP S5855767Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- back panel
- connector
- printed
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008054 signal transmission Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 3
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
本考案はプリント板をバックパネルに接続するプリント
板実装構造に関するものである。[Detailed Description of the Invention] The present invention relates to a printed board mounting structure for connecting a printed board to a back panel.
一般にプリント板はコネクタによりバックパネルに結合
されここから各電子機器に電気的に接続される。Generally, the printed circuit board is connected to a back panel by a connector and is electrically connected to each electronic device from there.
近年、電子部品の小型化、性能の向上に伴ないプリント
板上に搭載される部品数が増大しこれとともにコネクタ
のピン数も増加しプリント板の一辺上に全てのピンを収
容することが出来ない場合がある。In recent years, with the miniaturization and improved performance of electronic components, the number of components mounted on a printed circuit board has increased, and the number of connector pins has also increased, making it possible to accommodate all pins on one side of the printed circuit board. There may be no.
この場合、２枚のプリント板上に素子を分散して搭載し
たのでは設置スペースを２倍要するためバックパネルお
よびプリント板の利用効率が悪くなる。In this case, if the elements are distributed and mounted on two printed boards, the installation space will be doubled, resulting in poor utilization efficiency of the back panel and printed boards.
本考案は上記の点に鑑みなされたものであって、素子を
高密度に搭載したプリント板をバックパネルに実装する
場合、設置スペースを広くとることなく簡単にバックパ
ネル側に取付けることができるようなプリント板実装構
造の提供を目的とする。The present invention was developed in view of the above points, and when mounting a printed circuit board with high-density elements on the back panel, it can be easily mounted on the back panel side without taking up a large installation space. The purpose is to provide a printed board mounting structure.
以下、図面に基いて本考案の実施例について説明する。Embodiments of the present invention will be described below based on the drawings.
ＬＳＩ等の多数の素子２を搭載した第１プリント板３が
コネクタ６によりバックパネル１に実装される。A first printed board 3 on which a large number of elements 2 such as LSIs are mounted is mounted on the back panel 1 through a connector 6.
第１プリント板３の素子搭載面の反対側にこれと並列し
て素子を搭載しない信号伝達専用の第２プリント板４を
コネクタ７によりバックパネル１に取付ける。On the opposite side of the element mounting surface of the first printed board 3, in parallel therewith, a second printed board 4 dedicated to signal transmission, on which no elements are mounted, is attached to the back panel 1 by a connector 7.
第１プリント板３と、第２プリント板４とはバックパネ
ル１と反対側において各々のプリント板に設けたコネク
タ８，９を介してケーブル５により連結される。The first printed board 3 and the second printed board 4 are connected by a cable 5 via connectors 8 and 9 provided on each printed board on the side opposite to the back panel 1.
以上のような構成のプリント板実装構造においては、第
１プリント板３の回路からの信号配線の一部はコネクタ
６を介してバックパネル側に伝達され残りの部分はコネ
クタ８．ケーブル５．コネクタ９．第２プリント板４．
およびコネクタ７を介してバックパネル側に伝達される
。In the printed board mounting structure configured as above, a part of the signal wiring from the circuit of the first printed board 3 is transmitted to the back panel side via the connector 6, and the remaining part is transmitted to the connector 8. Cable 5. Connector 9. 2nd printed board4.
and is transmitted to the back panel side via the connector 7.
またコネクタ８を介して外部配線と接続することも可能
である。It is also possible to connect to external wiring via the connector 8.
第２プリント板４のコネクタ９はプリント板４の下側、
即ち第１プリント板３と反対側に設けることが望ましい
。The connector 9 of the second printed board 4 is located on the lower side of the printed board 4,
That is, it is desirable to provide it on the side opposite to the first printed board 3.
このようにすれば、プリント板の装着時にまず第２プリ
ント板４をバックパネルに装着し次に第１プリント板３
を装着する際第１プリント板３の下面に突出するリード
端子あるいはディスクリートワイヤ等がコネクタ９と係
合することはないため装着が円滑に行なわれまた第１．
第２プリント板３，４間の間隔を狭くすることができ無
駄空間をなくすことができる。In this way, when attaching the printed boards, first the second printed board 4 is attached to the back panel, and then the first printed board 3 is attached.
When mounting the first printed board 3, the lead terminals or discrete wires protruding from the bottom surface of the first printed board 3 do not engage with the connector 9, so that the mounting can be carried out smoothly.
The interval between the second printed boards 3 and 4 can be narrowed, and wasted space can be eliminated.
以上のようなバックパネルへのプリント板実装構造にお
いては設置スペースをさほど増大させることなく高密度
に素子を搭載したプリント板の実装が可能となる。In the structure for mounting a printed board on the back panel as described above, it is possible to mount a printed board on which elements are mounted at high density without significantly increasing the installation space.
図面は本考案の実施例の断面図である。
１・・・・・・バックパネル、２・・・・・・素子、３
・・・・・・第１プリント板、４・・・・・・第２プリ
ント板、６，７，８．９・・・・・・コネクタ。The drawing is a cross-sectional view of an embodiment of the present invention. 1...Back panel, 2...Element, 3
....First printed board, 4...Second printed board, 6, 7, 8.9... Connector.
Claims (1)
するプリント板実装構造において、素子を搭載した第１
プリント板の素子搭載面の反対側にこれと並列して素子
を搭載しない信号伝達専用の第２プリント板をコネクタ
によりバックパネルに取付け、上記第１プリント板と第
２プリント板とをバックパネル側と反対側において連結
し、該第１および第２プリント板を連結するためのコネ
クタのうち第２プリント板側のコネクタを第１プリント
板との反対側の第２プリント板表面に設けたことを特徴
とするバックパネルへのプリント板実装構造。In the printed board mounting structure where a printed board is attached to the back panel using a connector, the first
On the opposite side of the element mounting surface of the printed board, a second printed board dedicated to signal transmission, which does not have any elements mounted thereon, is attached to the back panel using a connector, and the first printed board and the second printed board are connected to the back panel side. of the connectors for connecting the first and second printed boards, the connector on the second printed board side is provided on the surface of the second printed board on the opposite side to the first printed board. Features a printed board mounting structure on the back panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17588078U JPS5855767Y2 (en) | 1978-12-25 | 1978-12-25 | Printed board mounting structure on back panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17588078U JPS5855767Y2 (en) | 1978-12-25 | 1978-12-25 | Printed board mounting structure on back panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5594085U JPS5594085U (en) | 1980-06-30 |
| JPS5855767Y2 true JPS5855767Y2 (en) | 1983-12-21 |
Family
ID=29183864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17588078U Expired JPS5855767Y2 (en) | 1978-12-25 | 1978-12-25 | Printed board mounting structure on back panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855767Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611576Y2 (en) * | 1983-11-14 | 1994-03-23 | 三菱電機株式会社 | Semiconductor circuit device |
-
1978
- 1978-12-25 JP JP17588078U patent/JPS5855767Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5594085U (en) | 1980-06-30 |
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