JPS5850575A - Display - Google Patents
DisplayInfo
- Publication number
- JPS5850575A JPS5850575A JP56148838A JP14883881A JPS5850575A JP S5850575 A JPS5850575 A JP S5850575A JP 56148838 A JP56148838 A JP 56148838A JP 14883881 A JP14883881 A JP 14883881A JP S5850575 A JPS5850575 A JP S5850575A
- Authority
- JP
- Japan
- Prior art keywords
- wiring body
- led
- display device
- wiring
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 241001092070 Eriobotrya Species 0.000 claims 1
- 235000009008 Eriobotrya japonica Nutrition 0.000 claims 1
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は発光ダイオード（ＬｈｉＤ）’に用いたディ
スプレイ装置に関し、特にＩＪＤの構造を区民したディ
スプレイ装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a display device using a light emitting diode (LhiD), and particularly to a display device using the structure of an IJD.
複１個のＬＥＤ′ｔ−配列して１字や図ルを駅がするデ
ィスプレイ装置ではＬＥＤに電気信号を送り込むための
配線体とＬＥＤとの敏絖方法及び構造を工夫して製造工
程を簡略化し、優れたディスプレイ装置を作ることが望
まれている。In a display device in which multiple LEDs are arranged to form a character or figure, the manufacturing process is simplified by devising a method and structure for connecting the wiring body and the LED to send electrical signals to the LED. It is hoped that the technology will improve and create superior display devices.
ｘｉ図は従来の最も−゛般的手法により完成したディス
プレイ装置の一部切欠料視図である。第１図におい・て
、絶縁基体１１上に絶縁層１２を介在させて第１の配線
体１３と第２の配線体１４とが設けられたマトリクス配
線基体にＬＥＤ１５を固着接続したものである。ＬＥｌ
） １５は４Ｉ電性樹脂１６で第１の配線体１３に固ｉ
され、ＬＥＤ１５にあらかじめ設けておい７′ｃ電極（
図示せず）とＭ２の配線体１４とが金線１７でワイキボ
ン′フ゛イグｖｈされている。このように構成したディ
スプレイ装置の第１と第２の配線間にＬＥＤを発光さぜ
るためのｔ圧を印加することによってディスプレイ装【
を１ｔｉＪｌできるものである。Figure xi is a partial cutaway view of a display device completed using the most conventional conventional method. In FIG. 1, an LED 15 is fixedly connected to a matrix wiring base in which a first wiring body 13 and a second wiring body 14 are provided on an insulating base 11 with an insulating layer 12 interposed therebetween. L.E.I.
) 15 is a 4I electrical resin 16 that is fixed to the first wiring body 13.
The 7'c electrode (
(not shown) and the wiring body 14 of M2 are wire-bonded with a gold wire 17. By applying a pressure of t to cause the LEDs to emit light between the first and second wires of the display device constructed in this way, the display device [
1tiJl.
ところでこのような促米のディスプレイ装置には、第ｌ
の配線体１３と第２の配線体１４とが接近してい−るた
めに尋亀性粒１旨１６による短糸ｉ出」題かプし生し易
く、又金線１７を各ＬＥＤにそれぞれワイヤボンディン
グする手間が非常に大変であること、金線をワイヤボン
ティングした隙にＬＥＤ １５上にできる釡の玉１８が
ＬＢＤ １８の中央部に１００μ＋ｎ８の径の太ささて
形成されるため見はえが慈く且つ電流集！がおこってＩ
ＪＩ）の輝糺むらが発生する等の欠点がめった。By the way, this type of promotional display device has the
Since the wiring body 13 and the second wiring body 14 are close to each other, it is easy to produce short threads due to the opaque particles 1 and 16, and the gold wire 17 is connected to each LED. The wire bonding process is very time consuming, and the ball 18 that is formed on the LED 15 during the wire bonding of the gold wire is formed in the center of the LBD 18 with a diameter of 100 μ + n8, so it is difficult to see. A collection of pictures and currents! Happens I
JI) frequently had drawbacks such as uneven brightness.
本釦明は上記の欠点に対処しなされたもので、製造工程
が１使確夾で輝糺むらの発生しない鮮明なディスプレイ
装を置を提供するものである。The present button light has been made to address the above-mentioned drawbacks, and provides a clear display device with no uneven brightness in a single manufacturing process.
仄のこの発明の一叉施例を第２図を参照して説明する。A second embodiment of this invention will be described with reference to FIG.
第２図はディスプレイ装置の一部切欠祠視図で、図囲上
＋＋ｉＪ側を断面図で示した。８１４２図において、ま
ず基体２１の表面にあらかじめ形成されたに４１の配線
体２２上にＬＥＤ ２３會等電性樹脂２４で固層する。FIG. 2 is a partially cutaway view of the display device, showing a cross-sectional view of the top ++iJ side of the figure. In FIG. 8142, first, the LED 23 is fixed with an isoelectric resin 24 on the 41 wiring bodies 22 previously formed on the surface of the base 21.
ｌ、Ｉ、Ｄは通常１辺の長さが０．３ＩＩＪＩ程度の立
方体であり、このＬＥＤにはＰＮ ｉ合（８）２３１及
び電極２３２が既に形成されている。このＬＥＤ ｌこ
ついて以下簡単に説明する。例えはＮ型のＬＥＤ結晶基
似に酸素あるいは窒素をふ加し７’（Ｐ型結晶を液相成
長法によ２て形成しＰＮ接合ｒｊＪ２３１を構成した後
電極２３２を形成し０．３ｍ＆！Ｍ方の大きさに切断し
′″ｃＬＥＤ２３を完成する。、ＬＥＤは前述したＰＮ
接合面２３１が基体２１の表面と平行になるように第１
の配線体２２上の一部に固層する。ＬＥＤのＰＮ接合面
に平行な而で基体に固層され要部の反対側の発光表示面
に形成する電極２３２は特に以下に述べる形状にするこ
とが必要である。まず本発明ではＬＥＤと配線とをワイ
ヤボンティング接続しないため、一極２３２にＵ ホｙ
ｆイングパッド部を設けなくてよい。ソシて１１ｔＭ
、集中を防ぎ且っＬＥＤの発した光を有効に外部に取り
出せる形状とする。さらに、後述する第２の配線体との
接続が容易である４＃等である。電柱は例えば第２図に
示すよりなＬＥＤの発光表示面の一部まで電柱２３２が
延長され、そして電流集中を１！／Ｉぎ且つＬＢＤの元
を有効に取り出す形状が俊れている。次に、上記ＬＥＤ
が固層された基体の表面に、ｖＭ１夕１ｊされた１、１
の間隔領域に例えはエポキシのような絶縁性樹脂２５を
充填硬化する。絶縁性樹脂２５はＩＪＤ２３の筒さとは
は同等になるようにする。例えはＬＥＤの高さのノーｙ
ス、マイナス１５％以内にすると後述する第２の配一体
展成及びＬＥＤとの接続に場合よい、次に第２の配線体
２６を絶縁性樹脂表面に形成するわけだがｗ＆２の配線
体は金属箔を貼９合わせて整形し喪ものや金属蒸＊ｍを
形成した後整形したもの、あるいは導電性樹脂を印刷し
たもの等各稙可能である。実施例では金Ｍ箔を貼り合わ
せた後配線パターン形成したものを図示した。次に第２
の配線体２６とＬＥＤ ２３の発光表示面に形成した電
極２３２と奢ｓ １ｔａｍ着剤２７で砿続する。そして
表面全体に保護体（図示せず）を形成してディスプレイ
装置を完成する。なお＃電性接層剤の代りに選択的に金
属を形成で逃るマスク急増によって第２の配線体と電極
との接続も’−１能である。1, I, and D are usually cubes with a side length of about 0.3IIJI, and a PN i joint (8) 231 and an electrode 232 are already formed in this LED. This LED will be briefly explained below. For example, oxygen or nitrogen is added to the N-type LED crystal base 7' (P-type crystal is formed by the liquid phase growth method to form the PN junction rjJ231, and then the electrode 232 is formed and the electrode 232 is 0.3 m &! Cut it into M-sized pieces to complete the LED23.
The first
It is solidified on a part of the wiring body 22. The electrode 232, which is parallel to the PN junction surface of the LED and is fixed to the substrate and formed on the light emitting display surface on the opposite side of the main part, particularly needs to have the shape described below. First, in the present invention, since the LED and the wiring are not connected by wire bonding, one pole 232 is connected to the U
There is no need to provide an f-ing pad section. Soshite 11tM
The shape is such that it prevents concentration and allows the light emitted by the LED to be effectively extracted to the outside. Furthermore, it is 4# etc. which can be easily connected to a second wiring body which will be described later. For example, as shown in FIG. 2, the utility pole 232 is extended to a part of the LED light-emitting display surface, and the current concentration is reduced to 1! /I and the shape that effectively takes out the base of the LBD is excellent. Next, the above LED
1, 1 was applied to the surface of the substrate on which vM1 and 1j were solidified.
An insulating resin 25 such as epoxy is filled and hardened in the spaced areas. The insulating resin 25 is made to have the same shape as the cylinder of the IJD 23. An example is the height of the LED.
If the value is within -15%, it is suitable for the second wiring body development and connection with the LED, which will be described later.Next, the second wiring body 26 is formed on the insulating resin surface, but the wiring body w&2 is made of metal. Various shapes are possible, such as those that are pasted together with foil and shaped to form a mourning material, metal vaporized *m and then shaped, or those that are printed with conductive resin. In the example, a wiring pattern was formed after gold M foil was bonded together. Then the second
The wiring body 26 and the electrode 232 formed on the light emitting display surface of the LED 23 are connected with a thin tam adhesive 27. A protective body (not shown) is then formed on the entire surface to complete the display device. Note that the connection between the second wiring body and the electrode can also be made by increasing the number of masks that selectively form metal instead of the electrically conductive adhesive.
ここでＬＥＤ ２３に形成した電極２３２について以下
訃しく説明する。一極はＬＢＤから弛した光を有効に外
部に取り出すことができる形状とするはかりでなく、第
２の配線体との接続が容易であることが必俄で、そのた
めには電極はＬＥＤの発光表示面の端部まで延長されて
いるかち部近傍まで延長されていることが望ましい。即
ち船２図を参照してＬψＪしたチー施ヤリのように節２
の配線体２６と一％１？乙２を尋稙性接石剤２７で接続
する場合、尋電性接り薊のＶ大ｒ力かＩＪＤ′″Ｃ祉餉
く金属でけ強い性質からｆｉす述し７１ｃ寛極形状が佼
れているわけである。そして轡篭性接看縮１がＬｌ−ヒ
で餉い裁〜力をかすにもがかわらず電極と第２の配線体
とを分断せずに−臥し＝１能々距敞を４１！ｒ楯央賎を
試みて求めたところ、ｌａ軸外周部の一部かＬＥＤの端
部つまりＰＮ振七面に士村″な発光板カ・ｍ＋とＰＮ接
合面に対して笹直な問とで構成される役から５０μｍ以
内であれは良好な粘呆でめった。−万石２の配線体と一
極との接わＣをマスク蒸篇で行かうか、あるいは紀２の
配線体を電極と皿なるように形成しｆＣ，場合において
も、ＬＥＩＪから発した元を有効に外部に取シ出すため
にｔ−１ｔ＆忙の外周部はＬＥＤｃＬｒ蝿部に接近して
いる形状が仮ｔ１ているわりである。Hereinafter, the electrode 232 formed on the LED 23 will be explained in detail. The single pole is not a scale that has a shape that can effectively extract the light loosened from the LBD to the outside, and it is necessary that it is easy to connect with the second wiring body. It is desirable that the display surface extends to the edge of the display surface and extends to the vicinity of the corner. In other words, referring to Figure 2 of the ship, LψJ is used as a reference to Section 2.
Wiring body 26 and 1% 1? When connecting Otsu 2 with hygrometallectal contact material 27, the 71c wide-pole shape is preferable due to the strong nature of the metal due to the V large force of hygrometal contact material or IJD'"C. This means that even though the closed contact force 1 is applied with Ll-H, the electrode and the second wiring body are not separated, and the result is 1 function. When I tried to calculate the distance from 41!R, I found that there is a part of the outer periphery of the la axis, or the end of the LED, that is, the light emitting plate that is ``Shimura'' on the 7th surface of the PN vibration. If the distance is within 50 μm from a hand consisting of a straight question and a simple question, it has a good viscosity and is rare. - If the connection C between the wiring body of Mangoku 2 and one pole is made by mask steaming, or the wiring body of Ki 2 is formed so as to be a dish with the electrode fC, even if the source emitted from LEIJ is In order to effectively take out the light to the outside, the outer circumferential portion of t-1t&busy has a shape that is close to the LED cLr fly portion.
以」二１己亀（したラーイスフ゛レイｌｂ＆に従来の４
Ｍ這に比べて、第１の配線と縞２の配線か接近していな
いため導電性樹脂による短絡間軸がなくなり、又ワイヤ
ボンディングによる工程畑雑もなくなり、且つ電流集中
轡によるディスプレイ４！蝋としての見はえも倹れたも
のである。Since then, I have used the conventional 4
Compared to the M-line, the first wiring and the striped 2 wiring are not close to each other, so there is no short-circuit between the conductive resins, there is no process clutter caused by wire bonding, and the display 4! The appearance of the wax is also stale.
第１図は従来のディスプレイ装置の一部の一部切欠斜視
図、ｗＪ２図は本発明−夾施例のディスプレイ装置の一
部の一部切欠斜視図である。
２１・基体、２４・・・導電性樹脂
２２・・・ｍｌの配線体、２５・・絶縁性樹脂２３ 、
ＬＥＤ ２６・・第２の配線体２３１・・・
ＰＮｉ合（３）、２７・・・尋電性接増剤２３２・・・
電極。FIG. 1 is a partially cutaway perspective view of a conventional display device, and FIG. wJ2 is a partially cutaway perspective view of a display device according to an additional embodiment of the present invention. 21. Base body, 24... Conductive resin 22... ml wiring body, 25... Insulating resin 23,
LED 26...Second wiring body 231...
PNi combination (3), 27... Hydraulic adhesive 232...
electrode.
Claims (1)
Ｎ接合面が前記基体の表面と平行に力るように固着し、
レジら元ダイオードの高さとほぼＩｂＩ尋の薗さに形成
した杷蒜性樹側及び第２の配線体とを形成してなるディ
スプレイ装−において、＾すｉ己う６光ダイオードのＰ
Ｎ−置部に平何で且つ基体に固着されていない面に形成
した電極の一部か該ＰＮ接合向に平行で且つ基体に１寓
されていない面とＰＮ接合面に対して垂直な面とで構成
される校に接するかもしくは該後から少なくとも５０μ
ｍの位置に近接した構造の発光ダイオードを具備したこ
とを特徴とするディスプレイ鋭敏。A light emitting diode is connected to a part of the first wiring body provided on the base.
N bonded surface is fixed so as to force parallel to the surface of the base body,
In a display device in which a loquat tree side and a second wiring body are formed at a height approximately equal to the height of the original diode, the P of the six photodiodes is
A part of the electrode formed on a plane that is flat on the N-placement part and not fixed to the substrate, a plane that is parallel to the PN junction direction and not fixed to the substrate, and a plane that is perpendicular to the PN junction surface. adjacent to or at least 50 μm after the school consisting of
A display device characterized by having a light-emitting diode structure close to the position of m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56148838A JPS5850575A (en) | 1981-09-22 | 1981-09-22 | Display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56148838A JPS5850575A (en) | 1981-09-22 | 1981-09-22 | Display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5850575A true JPS5850575A (en) | 1983-03-25 |
Family
ID=15461858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56148838A Pending JPS5850575A (en) | 1981-09-22 | 1981-09-22 | Display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5850575A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211182A (en) * | 1991-02-04 | 1992-08-03 | Sanyo Electric Co Ltd | Light emitting diode for optical printer |
| JP2011161709A (en) * | 2010-02-08 | 2011-08-25 | Fuji Xerox Co Ltd | Light emitting apparatus, print head, and image forming apparatus |
| JP2022505543A (en) * | 2018-11-13 | 2022-01-14 | ソウル バイオシス カンパニー リミテッド | Light emitting element |
-
1981
- 1981-09-22 JP JP56148838A patent/JPS5850575A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211182A (en) * | 1991-02-04 | 1992-08-03 | Sanyo Electric Co Ltd | Light emitting diode for optical printer |
| JP2011161709A (en) * | 2010-02-08 | 2011-08-25 | Fuji Xerox Co Ltd | Light emitting apparatus, print head, and image forming apparatus |
| JP2022505543A (en) * | 2018-11-13 | 2022-01-14 | ソウル バイオシス カンパニー リミテッド | Light emitting element |
| US11967605B2 (en) | 2018-11-13 | 2024-04-23 | Seoul Viosys Co., Ltd. | Light emitting device |
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