JPS5844608Y2 - Jig board for multilayer adhesion of printed circuit boards - Google Patents
Jig board for multilayer adhesion of printed circuit boardsInfo
- Publication number
- JPS5844608Y2 JPS5844608Y2 JP17026378U JP17026378U JPS5844608Y2 JP S5844608 Y2 JPS5844608 Y2 JP S5844608Y2 JP 17026378 U JP17026378 U JP 17026378U JP 17026378 U JP17026378 U JP 17026378U JP S5844608 Y2 JPS5844608 Y2 JP S5844608Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit boards
- jig
- jig board
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
本考案は多層プリント回路板のための多層接着用治具板
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer adhesive jig plate for multilayer printed circuit boards.
多層プリント回路板は一般的に銅張積層板に内層パター
ンを形成後、ガラス布にレジンを含浸させて半硬化状に
した接着剤(プリプレグ)をはさんでガイドピンと治具
板で個定して、接着用プレスで加熱、加圧しながら多層
接着し、一体とする。Multilayer printed circuit boards are generally produced by forming an inner layer pattern on a copper-clad laminate, then sandwiching a semi-cured adhesive (prepreg) made by impregnating glass cloth with resin and fixing it individually using guide pins and a jig board. Then, use an adhesive press to bond the multiple layers together while applying heat and pressure.
接着は昇温の方法により、プレス熱盤の温度を最初から
あげておくホットプレス法と室温から温度をあげていく
コールドプレス法に大きく分けている。Adhesion is broadly divided into hot press methods, in which the temperature of the press platen is raised from the beginning, and cold press methods, in which the temperature is raised from room temperature.
接着温度はプリプレグレジンが溶融してから硬化するま
での時間、粘度に影響し、プリプレグレジンの溶融状態
が適正でないと、接着ボイド、ハガレなどの不良の原因
となる。The adhesion temperature affects the time from when the prepreg resin melts until it hardens, as well as the viscosity, and if the molten state of the prepreg resin is not appropriate, it may cause defects such as adhesive voids and peeling.
プリプレグレジンの溶融状態を適正にするために接着す
るプリプレグ層の昇温速度をコントロールするとともに
、温度のバラツキを小さくする必要がある。In order to make the molten state of the prepreg resin appropriate, it is necessary to control the heating rate of the prepreg layer to be bonded and to reduce the temperature variation.
その方法として治具板の材質や厚さを変えることもある
が、多くの方法は第1図のようにクラフト紙や、ゴムと
布をサンドイッチにしたクッション材2を、プレス熱盤
1と治具板3の間にはさんで用いることにより昇温をコ
ントロールする場合が多い。One way to do this is to change the material and thickness of the jig plate, but in most cases, as shown in Figure 1, a cushioning material 2 made of kraft paper or a sandwich of rubber and cloth is placed between the press heating plate 1 and the jig plate. In many cases, temperature rise is controlled by using it between the filling plates 3.
従来のクッション材を用いて接着する方法は第1図に示
すように、内層基材4とプリプレグ5を重ね合せガイド
ピン6で位置合せした後、治具板3で固定して、プレス
熱盤1と治具板3の間にクッション材2をはさんで加熱
、加圧しながら多層接着する。As shown in Fig. 1, the conventional bonding method using cushioning materials involves aligning the inner layer base material 4 and the prepreg 5 with overlapping guide pins 6, fixing them with a jig plate 3, and pressing them onto a press hot plate. Cushion material 2 is sandwiched between 1 and jig plate 3, and multilayer bonding is performed while heating and pressurizing.
この場合クッションと治具板が一体でないため、プレス
熱盤にセットするときの作業性が非常に悪い。In this case, since the cushion and the jig plate are not integrated, the workability when setting on the press heating plate is very poor.
またガイド穴から流出した硬化レジンがクッション材に
付着するため清掃が大変であり、損傷しやすいため定期
的な交換が必要である。In addition, the cured resin that flows out of the guide hole adheres to the cushioning material, making cleaning difficult and easily damaging it, requiring periodic replacement.
本考案の目的は、前記従来の問題点を解決し、作業性が
良く、シかもゴミや流出レジンの付着がない治具板を提
供することである。The purpose of the present invention is to solve the above-mentioned conventional problems and provide a jig plate that has good workability and is free from adhesion of dust and spilled resin.
本考案の特徴とするところは、金属の治具板の間にクッ
ション材をはさみ、一体構造とするところにある。The feature of this invention is that a cushioning material is sandwiched between metal jig plates to form an integral structure.
第2図に本考案の一実施例を示すように金属性の治具板
3と3′の間にクッション材2をはさみ、ネジ8等で個
定して一体構造としたものを接着治具板として、内層基
材4とプリプレグ5を重ね合せガイドピン6で位置合せ
しめたものを固定して、多層接着する。As shown in Fig. 2, an embodiment of the present invention is shown, a bonding jig is made by sandwiching a cushioning material 2 between metal jig plates 3 and 3' and securing them with screws 8, etc. to form an integral structure. As a plate, an inner layer base material 4 and a prepreg 5 are stacked and aligned with guide pins 6, and then fixed and bonded in multiple layers.
従来では接着時に溶融したレジンが、ガイド穴7から、
治具の外側に流出してクッション2に付着するため、作
業終了後、それを取り除くための清掃が必要であり、ま
た熱盤1の上をすべらせたりするため損傷を生じるので
定期的な交換が必要であったが、本考案によれば、クッ
ション2が金属板3と3′で覆われているため損傷がな
く半永久的に使用できる。Conventionally, the resin melted during adhesion flows through the guide hole 7.
Since it flows out of the jig and adheres to the cushion 2, cleaning is required to remove it after the work is completed, and it also slides on the heating plate 1, causing damage, so it must be replaced regularly. However, according to the present invention, since the cushion 2 is covered with the metal plates 3 and 3', it can be used semi-permanently without damage.
また一体構造であるため、プレス熱盤へのセットするた
めの作業性が良いなどの利点がある。Furthermore, since it has an integrated structure, it has advantages such as good workability when setting it on a press heating plate.
第1図は従来の多層接着用治具板を用いて多層接着する
ところを示す側面図、第2図は本考案の治具板を用いて
多層接着するところを示す側面図である。
1・・・・・・プレス熱盤、2・・・・・・クッション
、3.3’・・・・・・治具板、4・・・・・・内層基
板、5・・・・・・プリプレグ。FIG. 1 is a side view showing multilayer bonding using a conventional multilayer bonding jig plate, and FIG. 2 is a side view showing multilayer bonding using the jig plate of the present invention. 1...Press heating plate, 2...Cushion, 3.3'...Jig plate, 4...Inner layer board, 5...・Prepreg.
Claims (1)
接着するとき用いる治具板であって、金属板の間にクッ
ション材をはさみ、一体構造としたことを特徴とするプ
リント回路板の多層接着用治具板。Multi-layer bonding of printed circuit boards, which is a jig plate used when bonding the inner layer base material and the adhesive prepreg by applying pressure and heating, and having an integrated structure by sandwiching a cushioning material between the metal plates. jig board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17026378U JPS5844608Y2 (en) | 1978-12-13 | 1978-12-13 | Jig board for multilayer adhesion of printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17026378U JPS5844608Y2 (en) | 1978-12-13 | 1978-12-13 | Jig board for multilayer adhesion of printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5588278U JPS5588278U (en) | 1980-06-18 |
JPS5844608Y2 true JPS5844608Y2 (en) | 1983-10-08 |
Family
ID=29173093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17026378U Expired JPS5844608Y2 (en) | 1978-12-13 | 1978-12-13 | Jig board for multilayer adhesion of printed circuit boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844608Y2 (en) |
-
1978
- 1978-12-13 JP JP17026378U patent/JPS5844608Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5588278U (en) | 1980-06-18 |
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