JPS5836411A - Outsert molded product - Google Patents
Outsert molded productInfo
- Publication number
- JPS5836411A JPS5836411A JP13279681A JP13279681A JPS5836411A JP S5836411 A JPS5836411 A JP S5836411A JP 13279681 A JP13279681 A JP 13279681A JP 13279681 A JP13279681 A JP 13279681A JP S5836411 A JPS5836411 A JP S5836411A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plate
- molded product
- outsert molded
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14344—Moulding in or through a hole in the article, e.g. outsert moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はアウトサート成形品に係り、特にビデオテープ
レコーダのシャーシを以下、VTRシャ−シと記す。)
等、精密でかつ優れた寸法安定性が要求されるアウトサ
ート成形品に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an outsert molded product, and in particular, the chassis of a video tape recorder is hereinafter referred to as a VTR chassis. )
etc., related to outsert molded products that require precision and excellent dimensional stability.
VTRシャーシは、部品数シ付は用の突起部(樹脂製機
能部)が場所によっては基準面(金属基板面)に対する
垂直度、および突起部相互間の平行度、それに、これら
の経時変形に対して高い精度が要求される。The VTR chassis has a number of parts, and depending on the location of the protrusions (resin functional parts), the perpendicularity to the reference plane (metal board surface), the parallelism between the protrusions, and their deformation over time. High precision is required.
しかし鋼板利用のシャーシはVTR,を重くするという
問題があり、その上鋼板と樹脂との熱膨張率の差が大き
過ぎて熱応力によるシャーシの反り或いは樹脂製機能部
乃至樹脂製機能部間を結ぶランチ部の割れが発生すると
いう問題がある。また、家電機器の難燃化の要求からア
ウトサート成形に用いる樹脂に難燃化用の添加剤(主に
塩化鉄の如きハロゲン化物)を加えると、成形時にこの
添加剤が分解ガスを発生して鋼板を腐食させるという問
題もある。However, a chassis using a steel plate has the problem of making the VTR heavier, and the difference in thermal expansion coefficient between the steel plate and resin is too large, causing the chassis to warp due to thermal stress, or to cause damage to the resin functional parts or between the resin functional parts. There is a problem in that cracks occur at the connecting launch part. In addition, due to the demand for flame retardancy in home appliances, when flame retardant additives (mainly halides such as iron chloride) are added to the resin used for outsert molding, the additives generate decomposed gas during molding. There is also the problem of corroding the steel plate.
本発明の目的はかかる従来の欠点を解消して、金属基板
の反シを効果的に防止するアウトサート成形品を提供す
るにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an outsert molded product which eliminates such conventional drawbacks and effectively prevents warping of a metal substrate.
本発明はアウトサート成形品の金属部材をアルミニウム
、アルミニウム合金の中から選択することに特徴がある
。The present invention is characterized in that the metal member of the outsert molded product is selected from aluminum and aluminum alloy.
以下、本発明の実施例を図;面に従って説明する。Embodiments of the present invention will be described below with reference to the drawings.
厚さ1mのアルミニウムーシリコン合金製の基板1には
複数の貫通孔2を適切に配置する。基板1の周縁部は折
り曲げて補強リプ3とする。各貫通孔2には樹脂製機能
部4を配置する。樹脂製機能部4は各個有の機能に従っ
て種々の形状に成形されたものであり、例えば筒状体4
1や柱状体42がある。樹脂製機能部4同士は必要に応
じてランナ43で連結する。また各樹脂製機能部4は樹
脂フランジ部44と突出部45とから構成し、成形工程
での樹脂の成形収縮に起因する力でアルミニウム基板1
に固着される。A plurality of through holes 2 are appropriately arranged in a substrate 1 made of aluminum-silicon alloy and having a thickness of 1 m. The peripheral edge of the substrate 1 is bent to form a reinforcing lip 3. A resin functional part 4 is arranged in each through hole 2. The resin functional parts 4 are molded into various shapes according to their unique functions, for example, a cylindrical body 4.
1 and a columnar body 42. The resin functional parts 4 are connected to each other by runners 43 as necessary. In addition, each resin functional part 4 is composed of a resin flange part 44 and a protruding part 45, and the aluminum substrate is
is fixed to.
補強リプ3はIIWI厚という薄い基板1に強い調性を
与える部分である。勿論第3図の様に基板1の厚さを増
すことによって調性を高め、補強リブ3を除くことも一
策である。また、第4図の如く基板の中央に段差31を
形成したシ、第5図の如く基板の中央をプレス加工で盛
り上げ部32を形成したりすることも有効である。また
、第6図。The reinforcing lip 3 is a part that gives strong tonality to the thin substrate 1 of IIWI thickness. Of course, it is also possible to increase the tonality by increasing the thickness of the substrate 1, as shown in FIG. 3, and to eliminate the reinforcing ribs 3. It is also effective to form a step 31 in the center of the substrate as shown in FIG. 4, or to form a raised portion 32 in the center of the substrate by press working as shown in FIG. Also, Fig. 6.
第7図のように基板をダイカスト品として得るならば、
補強リブ3やこれに代る肉厚部33を形成することも容
易である。勿論、補強すブ3やこれに相当する機能を有
する部分は、基板の材質や厚さ、他の部品の積載重量や
形状、配管等に応じて適宜その数や長さ、形状を選択す
る。If the board is obtained as a die-cast product as shown in Figure 7,
It is also easy to form the reinforcing ribs 3 and the thick portions 33 in place of the reinforcing ribs 3. Of course, the number, length, and shape of the reinforcing tubes 3 and parts having equivalent functions are selected as appropriate depending on the material and thickness of the board, the loaded weight and shape of other parts, the piping, etc.
本実施例において樹脂製機能部4はエポキシ樹脂に無機
充填剤を加えた樹脂組成物(熱膨張率は室温にて2.9
X10−’ (1/C))を使用した力;、−ケバ間の
放置に対して寸法安定性の優れていることを確認した。In this example, the resin functional part 4 is made of a resin composition made of an epoxy resin with an inorganic filler added (the coefficient of thermal expansion is 2.9 at room temperature).
It was confirmed that the dimensional stability was excellent when left between the fluff and the fluff.
無機充填剤は石英ガラス粉やガラス粉等力;適している
。無機充填剤は樹脂組成物の熱膨張率を調整したり、成
形品の耐クリップ性を向上させたりするのに効を奏する
。無機充填剤は樹脂の種類によっては(多くは熱可塑性
樹脂においては)無添加でもかまわない。Suitable inorganic fillers include quartz glass powder and glass powder. The inorganic filler is effective in adjusting the coefficient of thermal expansion of the resin composition and improving the clip resistance of the molded product. Depending on the type of resin (mostly thermoplastic resins), no inorganic filler may be added.
尚、この他にも樹脂組成物は適宜選択できるが金属基板
との熱膨張率を考慮するならば熱11=5J ! ”I
′。It should be noted that other resin compositions can be selected as appropriate, but if the coefficient of thermal expansion with the metal substrate is taken into consideration, then heat 11 = 5J! “I
'.
が室温にて1.8〜2.9X 10”’ (1/C)の
車1囲のものが良い。そのような樹脂組成物の樹脂とし
2ては、エポキシ樹脂の他に、列えばフェノ−ルff、
1脂、不飽和ポリエステル樹脂、ボリア七タール位1脂
等の熱硬化性樹脂やA B S =、?i指 、1′:
+)フェニレンスルフィド樹脂、ポリカーボネート樹脂
、 、+411アクリレート樹脂、ポリエーテルスルホ
ノの熱可塑性樹脂が好適である。It is best to use a resin with a diameter of 1.8 to 2.9 x 10'' (1/C) at room temperature.In addition to epoxy resins, examples of resins used in such resin compositions include phenolic resins. -Leff,
Thermosetting resins such as 1 fat, unsaturated polyester resin, boria 7 tar 1 fat, A B S =, ? i finger, 1':
+) Thermoplastic resins such as phenylene sulfide resin, polycarbonate resin, +411 acrylate resin, and polyether sulfono are suitable.
また本実施例においては、アルミニウム、−71157
合金製の基板1を採用しているが、この他のアルミニウ
ム合金板やアルミニウム板、であっても差し支えない。In addition, in this example, aluminum, -71157
Although the alloy substrate 1 is used, other aluminum alloy plates or aluminum plates may be used.
ちなみに各材料の基板と鋼板との材質を比較すれば第1
表の通りである。By the way, if you compare the materials of each material's substrate and steel plate, the first
As shown in the table.
本実施例のアウトザート成形品はこのように、F^畠で
かつ手法安定性に優れており、しかも軽量で腐食発生が
・初い憂れた成形品である。As described above, the outsert molded product of this example is a molded product that is F^Hatake and has excellent process stability, is lightweight, and is free from corrosion.
用脂製機能部4用の樹脂組成物の例を・メ、′晶−ドに
ト・レツイ1各熱膨張率と共に第2表に列挙する。尚、
成分計は重量部で示す。Examples of resin compositions for the functional parts 4 are listed in Table 2 along with their respective coefficients of thermal expansion. still,
Ingredients are shown in parts by weight.
第 2 表
第1表と第2表とから明らかなように、本発明のアウト
サート成形品の構成部材すなわちアルミニウム等の軽金
属と樹脂とは熱膨張率が近似しており、従って成形品の
反りや割れの問題は解消する。すなわち本発明によれば
精密でかつ寸法安定性に優れ、しかも軽量な成形品を得
ることができるという効果がある。しかも金属基板には
腐食発。Table 2 As is clear from Tables 1 and 2, the constituent members of the outsert molded product of the present invention, that is, light metals such as aluminum, and resin have similar coefficients of thermal expansion, and therefore the molded product will warp. This solves the cracking problem. That is, according to the present invention, it is possible to obtain a molded article that is precise, has excellent dimensional stability, and is lightweight. Moreover, corrosion occurs on the metal substrate.
生の問題が無くなるという副次的効果も得られる。You can also get the side effect of eliminating problems in your life.
第1図は本発明のアウトサート成形品の一実施例を示す
平面図、第2図は第1図のa −a断面図、第3図は第
2図の変形例を示す第1図のa−a断面図、第4図乃至
第7図はいずれも金磯基板の変形例を示す断面説明図で
ある。
1・・・基板、2・・・貫通孔、3・・・補強リブ、4
・・・樹脂第1図
第2図
第4図
1
」
慄5図
2
第6図
第q図Fig. 1 is a plan view showing an embodiment of the outsert molded product of the present invention, Fig. 2 is a sectional view taken along line a-a of Fig. 1, and Fig. 3 is a modification of Fig. 1 of Fig. 2. The a-a cross-sectional view and FIGS. 4 to 7 are all cross-sectional explanatory views showing modified examples of the Kaniso substrate. DESCRIPTION OF SYMBOLS 1... Board, 2... Through hole, 3... Reinforcement rib, 4
...Resin Figure 1 Figure 2 Figure 4 Figure 1'' Figure 5 Figure 2 Figure 6 Figure q
Claims (1)
アウトサート成形品において、前記金属基板はアルミニ
ウム板、アルミニウム合金板から選ばれる軽金属板であ
り、前記樹脂製機能部の樹脂の熱膨張率は室温下で前記
軽金属板に近似したものであることを特徴とするアウト
サート成形品。 26前記軽金属板がアルミニウム板まだはアルミニウム
合金板であり、前記樹脂製機能部の樹脂材質が室温にお
いて熱膨張率1.8〜2.9X10−5(1/T)であ
ることを特徴とする特許請求の範囲第1項記載のアウト
サート成形品。 3、前記樹脂製機能部を形成する樹脂組成物が、フェノ
ール樹脂、不飽和ポリエステル樹脂、エポキシ樹脂、ポ
リフェニレンスルフィド樹脂、ポリカーボネート樹脂、
ポリアクリレート樹脂、ポリエステルスルホン樹脂から
選ばれた樹脂に無機充填剤を配合したものであることを
特徴とする特許請求の範囲第1項又は第2項に記載のア
ウトサート成形品。 4゜前記樹脂製機能部を形成する樹脂はボ、リフエニレ
ンスルフイド樹脂、ポリカーボネート樹脂、ポリアクリ
レート樹脂、ポリエーテルスルホン樹脂から選ばれたも
のであることを特徴とする特許請求の範囲第1項乃至第
3項のいずれかに記載のアウトサート成形品。 5、所定の位置に複数個の貫通孔を有する金属基板と、
該貫通孔を利用して及び/または樹脂と金属との成形収
縮を利用して前記金属基板に成形と同時に固着した樹脂
製機能部とから成るアウトサート成形品において、前記
金属基板がアルミニウム板またはアルミニウム合金板で
あり、前記樹脂の室温下における熱膨張率が1.8〜2
.9 X 10””(1/lll”であることを特徴と
するアウトサート成形品。[Scope of Claims] 1. In an outsert molded product in which resin functional parts are fixed to a plurality of locations on a metal substrate, the metal substrate is a light metal plate selected from an aluminum plate and an aluminum alloy plate, and the resin An outsert molded product characterized in that the coefficient of thermal expansion of the resin in the functional part is similar to that of the light metal plate at room temperature. 26 The light metal plate is an aluminum plate or an aluminum alloy plate, and the resin material of the resin functional part has a coefficient of thermal expansion of 1.8 to 2.9X10-5 (1/T) at room temperature. An outsert molded product according to claim 1. 3. The resin composition forming the resin functional part is a phenol resin, an unsaturated polyester resin, an epoxy resin, a polyphenylene sulfide resin, a polycarbonate resin,
The outsert molded article according to claim 1 or 2, characterized in that it is a resin selected from polyacrylate resin and polyester sulfone resin mixed with an inorganic filler. 4. The first aspect of the present invention is characterized in that the resin forming the resin functional part is selected from polycarbonate, rifhenylene sulfide resin, polycarbonate resin, polyacrylate resin, and polyether sulfone resin. The outsert molded product according to any one of items 1 to 3. 5. A metal substrate having a plurality of through holes at predetermined positions;
In an outsert molded product comprising a resin functional part that is fixed to the metal substrate at the same time as molding using the through hole and/or using molding shrinkage between the resin and the metal, the metal substrate is an aluminum plate or It is an aluminum alloy plate, and the coefficient of thermal expansion of the resin at room temperature is 1.8 to 2.
.. An outsert molded product characterized by having a size of 9 x 10"(1/lll").
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13279681A JPS5836411A (en) | 1981-08-26 | 1981-08-26 | Outsert molded product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13279681A JPS5836411A (en) | 1981-08-26 | 1981-08-26 | Outsert molded product |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5836411A true JPS5836411A (en) | 1983-03-03 |
JPS6241448B2 JPS6241448B2 (en) | 1987-09-03 |
Family
ID=15089757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13279681A Granted JPS5836411A (en) | 1981-08-26 | 1981-08-26 | Outsert molded product |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5836411A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018139034A1 (en) * | 2017-01-27 | 2018-08-02 | Dic株式会社 | Metal/resin composite structure and method for manufacturing same |
US10207438B2 (en) * | 2014-01-31 | 2019-02-19 | Sumitomo Electric Industries, Ltd. | Composite member and composite-member manufacturing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5187568A (en) * | 1975-01-31 | 1976-07-31 | Polyplastics Kk | INSAATOSEIKEIHO |
JPS52149348A (en) * | 1976-06-08 | 1977-12-12 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5452664U (en) * | 1977-09-21 | 1979-04-11 | ||
JPS54134763A (en) * | 1978-04-11 | 1979-10-19 | Hitachi Ltd | Composite molded article composed of metal plate and resin |
JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
-
1981
- 1981-08-26 JP JP13279681A patent/JPS5836411A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5187568A (en) * | 1975-01-31 | 1976-07-31 | Polyplastics Kk | INSAATOSEIKEIHO |
JPS52149348A (en) * | 1976-06-08 | 1977-12-12 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5452664U (en) * | 1977-09-21 | 1979-04-11 | ||
JPS54134763A (en) * | 1978-04-11 | 1979-10-19 | Hitachi Ltd | Composite molded article composed of metal plate and resin |
JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10207438B2 (en) * | 2014-01-31 | 2019-02-19 | Sumitomo Electric Industries, Ltd. | Composite member and composite-member manufacturing method |
WO2018139034A1 (en) * | 2017-01-27 | 2018-08-02 | Dic株式会社 | Metal/resin composite structure and method for manufacturing same |
JPWO2018139034A1 (en) * | 2017-01-27 | 2019-11-07 | Dic株式会社 | Metal / resin composite structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS6241448B2 (en) | 1987-09-03 |
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