JPS5832313Y2 - Heat sink mounting structure - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a structure for attaching a heat-generating circuit component such as a transistor to a wiring board (hereinafter simply referred to as a board) together with a heat sink.

Conventionally, in order to attach the above-mentioned heat generating circuit components to a board together with a heat sink, a connecting plate 1a having a hole 1b of a heat generating circuit component 1 having a terminal bar 1C as shown in FIG. Second
Bend it as shown in the figure, align the hole 2a of the heat sink 2 with a U-shaped cross section like the example shown in FIG. ) and the terminal rod 1C of the circuit component 1 to which the heat sink 2 is fixed,
The tip of the terminal bar 1C inserted into the terminal hole 5 of the board 4 shown in FIG. 5 and protruding from the back side of the board 4 as shown in FIG.
The work was completed by soldering to the back side of the .

In the conventional heat sink mounting structure described above, the heat sink was attached to the heat-generating circuit component with screws, which required complicated work to tighten components such as screws and nuts.

In addition, heat-generating circuit components whose heat sinks are attached with screws are in a state of wobbling that may fall off until the terminal rods are inserted into the holes of the board and soldered.

Furthermore, if the degree of tightening of the screws is insufficient, heat conduction from the heat generating circuit component to the heat sink may become insufficient.

The present invention is a heat sink mounting structure aimed at eliminating the above-mentioned conventional drawbacks.

Next, embodiments of the present invention will be described with reference to the drawings.

The embodiment of the present invention has a heat dissipation plate 8 having an inverted U-shaped cross section, which has protrusions 6 on the inside of both side plates and a protrusion 7 on the outside of the lower end as shown in FIGS. 7 and 8, and FIG. As shown in the example shown in Fig. 2, a heat-generating circuit component 9 has a connecting plate 9a with a hole 9b and a tip facing downward, and a terminal bar 9C having a tip at the same height as the tip of the connecting plate 9a on the left and right sides. , as in the example shown in FIG.
A board 1 having an elongated hole 10a of an appropriate width for inserting the terminal rod 9C of the heat-generating circuit component by prying it open with the protrusion 7 while keeping the lower ends of the parts aligned, and a terminal hole 10b for simultaneously inserting the terminal rod 9C of the heat generating circuit component.
0, as shown in FIG. 11, the protrusion 6 on the inside of the side plate of the heat sink 8 is engaged with the hole 9b of the connecting plate 9a of the heat generating circuit component 9, and the lower end of the heat sink 8 is connected to the connecting plate 1a. As shown in FIG. As shown in FIG. It is fixed to the substrate 10.

As described above, according to the present invention, the connection relationship between the heat generating circuit component 9 and the heat sink 8 is easily determined by the engagement of the hole 9b of the connecting plate 9a and the inner protrusion 6 of the side plate of the heat sink 8. 9a
The lower end of the heat sink 8 matches the lower end of the heat sink 8, and the matching bottom ends are fixed to each other by soldering, so that heat propagation from the heat generating circuit component 9 to the heat sink 8 is better than in the conventional connection using screws. Not only this, but also parts such as screws and nuts and their complicated installation operations are no longer required.

By providing the protrusion 7 on the outer lower end of the side plate of the heat dissipation plate 8, there is no fear that the portion once inserted into the board 10 will come out before soldering.

By providing a removal preventing protrusion 7a shown in FIG. 14 in place of the projection 7, removal can be prevented even more reliably.

[Brief explanation of the drawing]

Figures 1 to 6 relate to examples of conventional heat sink mounting structures.
FIGS. 1 and 2 are perspective views of heat generating circuit components. FIG. 3 is a perspective view of the heat sink. FIG. 4 is a perspective view showing the heat dissipation plate fastened to the circuit component with screws. FIG. 5 is a perspective view of the board on which the circuit components are mounted. FIG. 6 is a front view, partially in cross section, showing a state in which the circuit component having a heat dissipation plate screwed is attached to a board by soldering. 7 to 14 relate to an embodiment of the present invention, and FIG. 7 is a perspective view of a heat sink. FIG. 8 is a sectional view of the heat sink. FIG. 9 is a perspective view of a heat generating circuit component. FIG. 10 is a perspective view of the substrate. FIG. 11 is a front view showing a state in which the heat dissipation plate is engaged with the circuit component, and a portion thereof is shown in cross section. FIGS. 12 and 13 are front views showing a state in which the engaged heat sink and a part of the circuit component are inserted into the terminal hole and elongated hole of the board and individually attached by soldering. It is shown in cross section. FIG. 14 is a partial perspective view of the lower part of the heat dissipation plate having a removal prevention protrusion. 1... Heat generating circuit component, 1a... Connection plate, 1b... Hole, 1C... Terminal bar, 2
... Heat sink, 2a ... Hole, 3 ...
...Screw, 4...Board, 5...Terminal hole, 6,7...Protrusion, 7a...Protrusion to prevent removal, 8... ... Heat sink, 9 ... Heat generating circuit component, 9a ... Connection plate, 9b ... Hole, 10 ... Board, 10 a ... ...long hole,
10b...Terminal hole.

Claims (1)

[Scope of utility model registration request] A heat dissipation plate having an inverted U-shaped cross section with engagement protrusions on the inside of both side plates and the outside of the lower end, a heat-generating circuit component having connecting plates with engagement holes and terminal rods on the left and right sides, and the above heat dissipation plate. The wiring board has a long hole for inserting the connecting plate with the lower end of the connecting plate of the circuit component aligned with the lower end of the connecting plate of the circuit component, and a terminal hole for simultaneously inserting the terminal rod of the circuit component, and a side plate of the heat sink. Engage the inner engaging protrusion with the retaining hole of the connecting plate of the circuit component to match the lower end of the heat sink and the lower end of the connecting plate, and then extend the matched tip to the length of the wiring board. Insert it into the hole, engage the engagement protrusion on the outside of the side plate of the heat sink with the back side of the elongated hole on the wiring board, and solder the respective protruding parts to the back side of the wiring board. A heat sink mounting structure that fixes the heat sink to a heat-generating circuit component and also fixes the circuit component to a wiring board.