JPS5828365Y2 - integrated circuit device - Google Patents

Description

[Detailed description of the invention] The present invention relates to an integrated circuit device that wires a plurality of semiconductor elements formed on a semiconductor substrate, and in particular, an integrated circuit device that can reduce the substrate size by making the distribution of wiring density uniform and high within the substrate. Related to circuit devices.

2. Description of the Related Art Conventionally, a so-called mask sliced substrate is known, which is a substrate in which a plurality of functional blocks including logic gates, flip-flop circuits, etc. are formed on a chip.

FIG. 1 is a front view of a conventionally proposed mask sliced substrate.

In the figure, 1 is a Si substrate, 2 is a person, an output pad, 3 is a functional circuit block, 4 is an internal wiring area, and 5 is an external wiring area.

This mask sliced substrate is constructed by providing on a silicon substrate 1 connection pads 2 for connecting to external terminals and a functional circuit block 3 wired with transistors, diodes, etc. to perform predetermined functions.

When using such a master slice board to create a device with a predetermined function, for example, a function equivalent to a calculation processing unit of a calculation device, first arrange functional circuit blocks 3 having various functions, and then Wiring is formed in the internal wiring area 4, and the external connection area 5 is used to connect to the connection pad 2 for external connection.

In addition, in such conventional mask sliced boards, if the functional circuit blocks for forming various wiring patterns are uniformly distributed within the board, the conductor patterns to be wired will be concentrated near the center of the board, , the wiring density was high in the area where the board was buried, and the wiring density was low at the periphery of the board, making the wiring density non-uniform within the board.

Therefore, the wiring area for each functional circuit block was made equal to the size occupied by the conductor pattern of the wiring at the center of the board to enable wiring, which had the disadvantage of increasing the overall board size.

The purpose of the present invention is to eliminate the above-mentioned drawbacks, prevent wiring from concentrating in the center of the board, make the wiring density uniform and high within the chip, and reduce the board size in an integrated circuit device. Our goal is to provide the following.

In order to achieve the above object, the present invention provides an integrated circuit device in which a plurality of functional circuit blocks constituted by elements having a predetermined function are arranged in a substantially matrix shape on a rectangular semiconductor substrate. a plurality of connection pads provided, an external wiring area provided inside the connection pads, a functional circuit block area in which the functional circuit blocks are arranged in a substantially matrix shape inside the external wiring area, and the functional circuit. It is characterized by having a dedicated wiring area formed in the center of the block area for wiring between each functional circuit block, and dispersing the distribution of wiring without forming functional circuit blocks in the central part. This will be described in detail below based on the front view of the embodiment of the present invention shown in FIG.

In the figure, the same parts as those used in FIG. 1 are indicated by the same numbers, and 6 is an area dedicated to wiring.

That is, in the figure, the functional circuit blocks 3 formed on the substrate 1 are not provided in the wiring area 6, but are all provided around the wiring area 6.

In other words, all the wiring by the functional circuit blocks provided in the layout of the normal wiring area 6 is done around the wiring area, so not only is the density of wiring in the central part low, but the functional circuit blocks are evenly distributed in areas other than the wiring area 6. Since the wires can be distributed at high density, each of the various types of wiring does not become complicated.

As described above, according to the present invention, the wiring density does not decrease at the periphery of the substrate, but is uniform within the chip, and is high in density, so that the substrate size can be reduced.

Further, since the wiring pattern is not complicated and the wiring is not concentrated in the center of the board, short circuits and disconnections can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventionally proposed mask sliced substrate, and FIG. 2 is a front view of a mask sliced substrate to which an embodiment of the present invention is applied. In the figure, 1 is a substrate, 2 is a connection pad, 3 is a functional circuit block, and 4 and 5 are wiring areas.

Claims (1)

[Scope of utility model registration request] In an integrated circuit device in which a plurality of functional circuit blocks constituted by elements having a predetermined function are arranged approximately in a matrix on a rectangular semiconductor substrate, a plurality of connection pads provided around the substrate and the connection an external wiring area provided inside the pad; a functional circuit block area in which the functional circuit blocks are arranged in a substantially matrix shape inside the external wiring area; and each functional circuit formed in the center of the functional circuit block area. 1. An integrated circuit device comprising a dedicated wiring area for wiring between blocks.