JPS58209296A - Transducer - Google Patents

Abstract

PURPOSE:To realize to derive a lead out of an oscillation film with a very simple construction, by bending a conductive layer, where a connection lead is solidly extended, on the lower surface of an insulation base board in order to connect it electrically to the oscillation film. CONSTITUTION:A fixed electrode 3 consisting of an electrode 1 and high polymer dielectric layer 2, and conductive supporting ring 13 are formed on the upper surface of an insulation substrate 12. The supporting ring 13 is formed so that it becomes thicker than the electrode 3, and an oscillation film 6 consisting of an insulation film 14 and a conductive thin film 15 is stretched at the end of the ring. An output electrode 16 and a flexible printed board 18 which forms an earth electrode 17 surrounding the electrode 16 are adhered on the lower surface of the substrate 12. A connection lead 19 projecting from the edge of the printed board 18 is connected to a film 15 of a film 6 via the side of the ring 13 by soldering 20. The electrode 3 is connected to the electrode 16 with a conductive adhesive 22 filled in a through hole 21.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a transducer suitable for condenser microphones and the like.

1 Technical Background of the Invention] Transdi J −+), for example, electret type-1
As shown in FIGS. 1 and 2, a fixed electrode is constructed by forming a polymer dielectric layer 2, which has been converted into an electret 1, on one main surface of an electrode 1. 3 is supported on the open 11 side of the dish-shaped U stand 4, and vibration lI is applied to the edge of the fixed electrode 3 via a spacer ring 5
6 stretched crotch rings 7 are stacked one after another, and conductive cases 8 are placed on top of these crotch rings 7! It has a structure that covers the ring 7, the spacer ring 5, and the base 4, and is caulked so as to be placed over one and bent at the bottom surface of the base 4.

Reference numeral 9 indicates a communication hole formed in the fixed electrode 3 and base 4, reference numeral 10 indicates a conductive hole provided in the case 8, and reference numeral 11 indicates a communication hole formed in the fixed electrode 3 and the base 4. stand 4
This is an external output terminal that protrudes clearly.

This electret-type connector has the external output terminal 11 of the electrode 1 as the output terminal of 1/j, and the conductive thin film formed on the vibrating membrane 6 (see FIGS. 1 and 2). With the conductive case 8 connected to the other output end (not shown), shake! The capacitance change corresponding to the change in the distance between the fixed electrode 3 and the vibrating membrane 6 due to the vibration of the tlI membrane 6 is outputted to the outside as an audio signal.

[Problem in technology 1] However, in the conventional electret type condenser microphone configured in this way, the output end is the conductive case 8 which is placed over the de-ring 7 and connected to the conductive thin film of the vibrating membrane 6. Therefore, poor contact between the membrane ring 7 and the conductive case 8 is likely to occur, making it difficult to stabilize the output, and the work of covering the conductive case 8 is troublesome.

In addition, the base 4, fixed electrode 3, and
The spacer ring 5 and the crotch ring 7 are stacked and integrated by the conductive case 8.The dimensional accuracy of each component tends to vary, and the airtightness between the stacked components is insufficient. Characteristics such as sensitivity are not constant, and performance is not uniform at the time of production.

Furthermore, the base 4, the fixed electrode 3, the spacer ring 5,
Since it consists of many components such as membrane ring 7 J5 and conductive coos 8, there is a limit to miniaturization of the shape, and the work of assembling small components is extremely complicated, so manufacturing costs tend to increase and assembly is difficult. It was less efficient and suitable for mass production.

[Object of the Invention] The present invention has been made in order to eliminate such conventional vacancies.1. The structure is simple and the leads of the vibrating membrane can be easily and reliably derived.
The purpose is to provide transducers.

[Summary of the Invention] In order to achieve this object, the present invention provides a structure in which a vibrating membrane on which a conductive thin film is formed is mounted on the front surface of the conductive electrode at a predetermined distance from the electrode, A connecting lead is integrally extended 4 from the conductive layer of the L distribution edge board, and this connecting lead is bent to one side of the insulating iI4 to electrically connect it to the conductive i11 film of the vibrating membrane. By using a part of the conductive layer formed on the bottom surface of the insulating substrate as a connection lead, it is possible to simplify the extraction of the horn from the diaphragm and improve mass productivity. There is a tamago. .

[Embodiments of the invention] The details of the present invention will be explained below with reference to the drawings.

In addition, the same reference numerals are given to the parts common to the conventional example.
The figure is a longitudinal sectional view showing an embodiment of the transducer of the present invention using an electret type condenser microphone as an example.

An electrode 1 having a smaller diameter than the insulating substrate 12 is drawn at the center of one main surface (upper surface in the figure) of a flat disk-shaped insulating substrate 12 at J3 in the figure. A fixed electrode 3 is constructed by depositing an electret polymer dielectric layer 2 .

A conductive support ring 13 is attached to the outer periphery of the fixed electrode 3 on the upper surface of the insulating substrate 12 so as to surround it at a predetermined interval. This support ring 13 supports the electrode 1
The fixed electrode 3 is made of the same material as the fixed electrode 3 and is formed with a thicker thickness, and at its tip, a vibrating membrane 6 with a conductive film 15 formed by vapor deposition or the like on the upper surface of the insulating film 14 is connected to the insulating film 14. It abuts the support ring 13 and is stretched over the front surface of the fixed electrode 3 with a predetermined distance therebetween.

The other main surface (lower surface>1.= of the insulating substrate 12) includes an independent output electrode 16 and a surrounding earth electrode 44.!17
Flexible puddings 1 to 18 having been formed are adhered thereto. From the edge of the flexible cylinder plate 1B, a long and thin connection lead 19 as shown in FIG. It extends over the conductive thin film 15, and its tip at - is bent 117, and the ground electrode 17 and the vibrating membrane (5) are connected by solder 20.

In addition, the fixed electrode 3, the insulating substrate 12JjJ, and the frame ↓.

A small through hole 21 is bored in the flexible printed board 18, and a conductive adhesive 22 filled in this small through hole 21 connects the output voltage between the electrode 1 of the fixed electrode 3 and the flexible print T-4N18. 44! 16 are electrically connected.

In this electret type Contin IJ-microphone, the electrode 1 of the fixed electrode 3 and the output electrode 16 of the flexible printed board 18 are connected, and the ground electrode 17 of the root 18 is connected to the conductive wIWA 15 of the vibration l 116 and the flexible printed board 1. Therefore, an output signal corresponding to a capacitance change between the fixed electrode 3 and the vibrating membrane 6 in accordance with the vibrational displacement of the vibrating membrane 6 is outputted from these output electrodes 16 and the earth electrode 17.

Thus, the electret condenser microphone of the present invention constructed as described above is constructed by bending one connecting lead extending from the flexible print 1 to the plate 18 attached to the lower surface of the insulating substrate 12. Earth electrode 17 at the tip
Since the lead is connected to the conductive i1 film 15 of the vibrating membrane 6, it is possible to lead out the lead from the conductive 11915 during the song. Moreover, since the support ring 13 which also serves as the fixed electrode 3 and the scrubber is formed on the soil surface of the insulating base &12, the number of parts is greatly reduced and the structure becomes extremely simple and thin.

Next, an embodiment of the GB method for manufacturing the electronic 1-let type condenser microphone of the present invention will be described.

First, as shown in FIG. 5, a circular printed circuit board 24 having a conductive layer 23 coated on a 1° surface of an insulating substrate 12 is prepared. Then, as shown in FIG. 6, the two conductive layers are subjected to a conventionally known chemical treatment such as photoetching or mechanical treatment such as cutting to form an electrode IF3 and a support ring 13 surrounding the electrode IF3 at a predetermined interval. .

Thereafter, as shown in FIG. 7, the upper surface of the electrode 1 is etched to make it lower than the support ring 13, and then an electret polymer dielectric layer 2 is deposited on the upper surface of the electrode 1. A fixed electrode 3 is configured. Note that the polymeric derivative layer 2 can also be applied to the electrode 1 and then pressurized to form an electret.

Then, as shown in FIG. 8, a flexible printed board 18 on which the output electrode 16 and the ground electrode 17 as shown in FIG. 19 is printed circuit board 2
On the other hand, a vibration Ml 6 as shown in FIG. 3 is stretched over the support ring 13.

After that, as shown in FIG. 9, the fixed electrode 3, the insulating substrate 1
2 and the flexible printed circuit board 18 are formed, and the through holes 21 are filled with a conductive adhesive 22 to connect the electrodes 1 and the output electrodes 16.

From there, the connection lead 19 of the flexible printed board 18
Bend it so that it stands up on the top side of the printed circuit board 24, and then bend the tip further onto the vibrating membrane 6 and shake #JJl!
6 conductive layer Il! 15 and the tip of the ground electrode 17 of the flexible printed board 18 are connected with solder 20 to complete the process.

As is clear from this manufacturing method, the electret condenser microphone of the present invention can be manufactured by simply bending and soldering the connecting leads 19 of the flexible printed circuit board 18 attached to the lower surface of the insulating substrate 12. It becomes possible to lead out the lead from 6, which facilitates assembly. Furthermore, compared to the case where the leads are drawn out by applying conductive paint or the like to the side surface of the insulating substrate 12 or the support ring 13, disconnection is less likely to occur and reliability is improved.

Further, by processing the conductive layer 23 of the printed circuit board 24, the support ring 13 on which the electrode 1 and the vibrating membrane 6 are stretched
It is possible to form these electrodes 1 and support ring 1.
3 can be kept constant, and the airtightness between them and the insulating substrate 12 can be maintained sufficiently. This not only makes the characteristics uniform, but also makes it possible to form a large number of electrodes 1 and support rings 13 on the printed circuit board 23. This makes it possible to improve mass productivity.

Note that a large number of electrodes 1 and support rings 1 are mounted on the printed circuit board 23.
3, the printed circuit board 23 can be easily divided by providing dividing means such as perforations on the printed circuit board 23.

The electret type condenser microphone of the present invention is not limited to the case where the flexible printed board 18 is attached to the lower surface of the printed circuit board 24, as shown in FIG. It is also possible to bend the connection lead 26 provided on the conductive layer 25 and connect it to the conductive thin film 15 of the vibrating membrane 6. In such a structure, a double-sided printed circuit board is used. can be used, making it easier to mass-produce.

The electret type condenser microphone of the present invention has a configuration in which the connection leads 19 and 20 are directly connected to the conductive membrane 15 of the vibrating membrane 6, and can also be connected to the conductive membrane 15 through connection to the support ring 13. Therefore, it goes without saying that the polymer dielectric layer 2 can be formed not only on the electrode 1 but also in a structure where it is formed on the vibrating membrane 6 side.

Moreover, it can be widely applied not only to electret-type condenser microphones but also to transducers that combine electrodes and vibrating membranes.

[Effect of the invention 1 As explained above, the transducer of the present invention has an electrode formed on the upper surface of an insulating substrate with a conductive layer formed on the lower surface, and a vibrating membrane on which a conductive S film is formed on the front surface of the electrode. death,
A connecting lead is integrally extended from the conductive layer on the lower surface of the insulating substrate, and this connecting lead is bent toward the upper surface of the insulating substrate to be electrically connected to the vibrating membrane. The leads can be led out using an extremely simple structure, and the leads are less likely to be disconnected due to contact with other electronic components, resulting in good reliability.

Furthermore, since it is possible to form the support ring 3 as a support layer on which the fixed electrode 3 and the vibrating membrane 6 are stretched on the main four surfaces of the insulating substrate 12, the number of components can be reduced, making it possible to reduce the cost, size, and especially thickness. In addition, since the electrode 1 and the support ring can be formed using a printed circuit board, it is extremely suitable for mass production.

Generally speaking, if a flexible printed board with connection leads as a conductive layer is attached to the bottom surface of the insulating substrate and the connection leads are bent and connected to the vibrating membrane, assembly is easy and the mechanical strength of the connection leads is improved. is further improved, resulting in excellent durability.

[Brief explanation of the drawing]

1 and 2 are a sectional view and an exploded perspective view showing a conventional transducer, FIG. 3 is a longitudinal sectional view showing an embodiment of the transducer of the present invention, and FIG. 4 is a conductive view of the transducer shown in FIG. 3. Developed views of the layers, FIGS. 5 to 9 are process diagrams showing one embodiment of the method for manufacturing the transducer of the present invention shown in FIG. 3, and FIG. 10 shows another embodiment of the transducer of the present invention. FIG. 1... Electrode 2... Polymer dielectric layer 3...
......Fixed electrode 4...Base 5...Spacer ring 6...
..... Vibration membrane 7 ..... Membrane ring 8 ..... Conductive case 9 ....
...... Communication hole 12 ...... Insulating board 13 ...
......Support ring 16...
・Output electrode (external output electrode) 17...
...Earth electrode (external output electrode) 18...
...Flexible printed circuit board (conductive layer) 19.26...Connection lead 21...Through hole 22...
・・・・・・・・・Conductive 1noi contact agent 25・・・・・・
・・・・・・Conductive layer agent patent attorney 10+h III Figure 1 Figure 2 Figure 4

Claims (1)

[Claims] An electrode is formed on the - side of an insulating M plate with a conductive layer formed on the lower surface, and a conductive layer is placed in front of this electrode at a predetermined distance from the electrode. l? The vibrating membrane on which the membrane has been formed is stretched, connecting leads are integrally extended from the conductive layer of the insulating substrate, and the connecting leads are bent toward the upper surface of the insulating substrate to connect the conductive thin film of the vibrating membrane. A transformer characterized in that it is electrically connected to.