JPS58197758A - Tape carrier device and mounting method thereof - Google Patents

Abstract

PURPOSE:To facilitate mounting of a semiconductor element when the element is to be used by a method wherein the element whose leads are cut apart from the tape is adhered to be supported to the tape by adhesives to melt by heating. CONSTITUTION:Outside connecting terminals 3 are formed on the tape 1 at the prescribed interval, and after the terminals 3 are cut apart, a chip is held to the tape 1, and moreover standing in a row of the terminals is not destroyed. Moreover a holding conductor 4 is adhered to the tape 1 by epoxy adhesives, adhesives are molten by heating, and the chip can be removed from the tape. To connect the tape carrier device thereof to a wiring substrate, the terminals 3 are connected by pressing and heating with a jig for exclusive use, while the connecting conductor 4 is heated to separate the chip from the tape. According to this construction, the element can be supplied in the condition cut apart with the outside connecting terminals, and a user can mount easily even without a metal mold or a press device.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a tape carrier device in which a semiconductor element is bonded to a lead conductor attached to the surface of a long carrier tape, and further relates to an improvement in a tape carrier device in which a semiconductor element is bonded to a lead conductor attached to the surface of a long carrier tape. The present invention relates to a mounting method for mounting on a wiring board.

Conventionally, a tape carrier system in which a semiconductor element is mounted on a flexible film such as a polyimide film has been developed (for example, Japanese Patent Publication No. 47-3206).

The general procedure for this tape carrier method is to first bond the electrode of the semiconductor element to the tip of the lead conductor on the surface of the tape by inner lead bonding, then cut the other end of the lead conductor from the tape body and transport it to a predetermined connection position on the wiring board. It is mounted by outer lead bonding.

Now, as for the method of outer lead bonding mentioned above,
For example, (1) a positioning hole is drilled in the wiring board, and the individual divided tape carriers are aligned using the hole as a reference, and in this aligned state, the lead conductor of the wiring board is connected to the lead conductor of the wiring board using manual soldering material, etc. How to solder connect the lead conductor of the tape carrier and finally cut off the unnecessary film part.
Alternatively, there is a method (2) of cutting the lead conductor from the tape carrier, positioning and fixing the separated device, and then moving the wiring board to the device cut fixing part and connecting it by soldering.

Now, when these conventional outer lead bonding methods are adopted, molds and associated press equipment are required.Generally, when a user purchases a tape carrier and mounts the device on a board, the above equipment is a huge burden. Dero-)ta.

It is an object of the present invention to provide a tape carrier device and a mounting method therefor that enable outer lead bonding of tape carriers without the use of the above-mentioned mold and associated expensive equipment such as a press device.

Hereinafter, one embodiment of the tape carrier device according to the present invention will be described in detail.

FIG. 1 is a plan view of an embodiment of a tape carrier device according to the present invention. 1 is a carrier tape;
Perforations 2 for positioning are bored at both ends. Reference numeral 3 denotes external connection terminals formed on the tape 1 at predetermined intervals. 4 is a holding conductor, which holds the semiconductor chip (
(not shown) on the tape 1 and the external connection terminals 3 without disrupting their alignment. The holding conductor 4 is attached to the tape using an epoxy adhesive, and can be removed from the tape by melting the adhesive by heating.

The lead wires of the wiring board are previously subjected to surface treatment with tin, solder, gold, etc., and the external connection terminals of the tape carrier are also treated with tin, solder, gold, etc. When connecting the tape carrier device to the wiring board, the external connection terminals 3 are pressed and heated against the wiring board using a soldering iron or a special jig. FIG. 3 shows an example of a heating jig. Reference numeral 5 designates an A bottom surface portion that presses and heats the external connection terminal 3, and 6 represents a B bottom surface portion that heats the holding conductor 4. If this heating jig is used, the external connection terminals 3 can be connected to the wiring board almost simultaneously (the holding conductor 4 can be removed from the tape, and the semiconductor elements of the tape carrier can be connected while remaining aligned). .

The tape carrier device described above can be supplied to the user with the external connection terminals cut off in advance, and in that case, the user can easily mount the device (outer lead bonding) without using a mold or press equipment. ) is possible.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of a tape carrier device according to the present invention, FIG. 2 is a plan view of the tape carrier device with its external connection terminals cut away, and FIG. 3 is an external view of a heating jig. In the figure, 1: film, 2: par 74 rayon, 3: external connection terminal, 4: holding conductor, 5: A bottom part, 6: B bottom part.

Claims (1)

[Scope of Claims] 1. In a tape carrier device in which a semiconductor element is bonded to a lead conductor attached to a surface of a long tape, the semiconductor element is held on the tip with the lead conductor cut from the tape. A tape carrier device comprising a holding conductor. 2. The tape carrier device according to claim 1, wherein the holding conductor is bonded to the tape using an adhesive that melts when heated. 3. A lead conductor adhered to the surface of a long tape, a semiconductor element bonded to the lead conductor, and a semiconductor element bonded to the tape with an adhesive that melts when heated, with the lead conductor cut from the tape. A tape carrier device equipped with a holding conductor for holding a semiconductor element on the tape is brought into contact with a wiring board, the lead conductor is bonded to a predetermined position on the wiring board, and substantially simultaneously with the bonding, the holding conductor is heated and the holding conductor is heated. A method for mounting a tape carrier device, characterized in that holding of a holding conductor is released.