[go: up one dir, main page]

JPS58177969U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58177969U
JPS58177969U JP7502282U JP7502282U JPS58177969U JP S58177969 U JPS58177969 U JP S58177969U JP 7502282 U JP7502282 U JP 7502282U JP 7502282 U JP7502282 U JP 7502282U JP S58177969 U JPS58177969 U JP S58177969U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
soldering
conductor pattern
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7502282U
Other languages
Japanese (ja)
Inventor
山代　秀夫
Original Assignee
日立電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立電子株式会社 filed Critical 日立電子株式会社
Priority to JP7502282U priority Critical patent/JPS58177969U/en
Publication of JPS58177969U publication Critical patent/JPS58177969U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは従来のプリント配線板上の導体パターンにチ
ップ部品を取付けた状態を示したふ、がん図、第１図す
は本考案の実施例、第２図ははんだ槽及びはんだ付は前
のプリント板の側面図、第３図ははんだ付は中のプリン
ト板の断面拡大図を示す。 １：チップ部品、２：チップ部品の電極部、３ニブリン
ト配線板、４ニブリント配線板上の導体パターン、５：
導体パターンに設けてた溝、６：ディプはんだ槽、７：
噴流はんだ槽、８：はんだ槽内の溶融はんだ、９：気泡
。Figure 1a shows a state in which chip components are attached to a conductor pattern on a conventional printed wiring board. 3 shows a side view of the front printed board, and FIG. 3 shows an enlarged cross-sectional view of the printed board inside during soldering. 1: Chip component, 2: Electrode part of chip component, 3 Niblint wiring board, 4 Conductor pattern on Niblint wiring board, 5:
Groove provided in the conductor pattern, 6: Dip solder bath, 7:
Jet solder bath, 8: Molten solder in the solder bath, 9: Air bubbles.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品（リードレス小形部品）をプリント配線板上
の導体パターンに取付け、当該部品の両側端に設けた電
極部を上記導体パターンにディップはんだ付は法又は噴
流はんだ付は法によりはんだ付けするとともに、はんだ
付けの際電極部付近に滞溜する気泡によるはんだ付は阻
害を防止する目的で気泡の逃げ溝を設けた導体パターン
を有することを特徴とするプリント配線板。Attach a chip component (small leadless component) to a conductor pattern on a printed wiring board, and solder the electrodes provided at both ends of the component to the conductor pattern by dip soldering or jet soldering. 1. A printed wiring board having a conductor pattern provided with air bubble escape grooves for the purpose of preventing soldering from being inhibited by air bubbles that accumulate near electrode portions during soldering.
JP7502282U 1982-05-24 1982-05-24 printed wiring board Pending JPS58177969U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7502282U JPS58177969U (en) 1982-05-24 1982-05-24 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7502282U JPS58177969U (en) 1982-05-24 1982-05-24 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58177969U true JPS58177969U (en) 1983-11-28

Family

ID=30084410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7502282U Pending JPS58177969U (en) 1982-05-24 1982-05-24 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58177969U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127263U (en) * 1983-02-17 1984-08-27 日本メクトロン株式会社 Land pattern of flexible printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127263U (en) * 1983-02-17 1984-08-27 日本メクトロン株式会社 Land pattern of flexible printed board

Similar Documents

Publication Publication Date Title
JPS58177969U (en) printed wiring board
JPH0487393A (en) Printed board for surface mounting
JPH01171024U (en)
JPS5851472U (en) automatic soldering equipment
JPS5844871U (en) wiring board
JPS61168677U (en)
JPS5849472U (en) printed wiring board
JPS583061U (en) Parts mounting structure
JPS5895673U (en) printed wiring board
JPS58189564U (en) Electrical component
JPS63136352U (en)
JPS5977256U (en) Printed board
JPS60116272U (en) printed wiring board
JPS5869978U (en) Printed board
JPS59149662U (en) Electrical component mounting device
JPS60186966U (en) solder sucking device
JPS5974760U (en) Double-sided printed wiring body
JPS58150869U (en) Printed board
JPS599568U (en) Electronic component mounting structure
JPS6113966U (en) Continuous printed circuit board
JPS58182455U (en) printed board
JPS6066068U (en) Chip parts mounting device
JPS5996869U (en) Mounting device for chip-shaped circuit components
JPS58116160U (en) Jet solder bath parts removal jig
JPS5989578U (en) Parts mounting structure