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JPS58161803A - strain sensor - Google Patents

strain sensor

Info

Publication number
JPS58161803A
JPS58161803A JP4418382A JP4418382A JPS58161803A JP S58161803 A JPS58161803 A JP S58161803A JP 4418382 A JP4418382 A JP 4418382A JP 4418382 A JP4418382 A JP 4418382A JP S58161803 A JPS58161803 A JP S58161803A
Authority
JP
Japan
Prior art keywords
point
resistor
film
insulating film
strain sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4418382A
Other languages
Japanese (ja)
Inventor
Koichiro Sakamoto
孝一郎 坂本
Ikuo Fujisawa
藤沢 郁夫
Shozo Takeno
武野 尚三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Toshiba Corp
Toshiba Tec Corp
Original Assignee
Tokyo Sanyo Electric Co Ltd
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Tokyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Toshiba Corp, Tokyo Shibaura Electric Co Ltd, Tokyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP4418382A priority Critical patent/JPS58161803A/en
Publication of JPS58161803A publication Critical patent/JPS58161803A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

PURPOSE:To obtain high reliability, by forming an insulating film on a beam body provided with thin parts, connecting resistor bodies having specified composition of three components Ni, Cr, and Si at the corresponding position on said film so as to form a bridge, thereby forming conductive layers. CONSTITUTION:The insulating film 9 is formed on a beam body 2 with the thin parts 4. The resistor bodies 10 made of a thin film are laminated and formed at the positions corresponding to a thin parts 4 on said film 9. The conducting layers 11, wherein the resistor bodies 10 are connected in the bridge form, are laminated and formed. The resistor body 10 is constituted by using the material having the composition surrounded by a quadrilateral figure formed by connecting a point w (Ni is 50, Cr is 50, and Si is 0), a point x (Ni is 90, Cr is 0, and Si is 10), a point y (Ni is 77, Cr is 0, and Si is 23), and a point z (Ni is 50, Cr is 40, and Si is 10) (numerals in parentheses are weight %), in a triangle chart of the three components Ni, Cr, and Si.

Description

【発明の詳細な説明】 本発明は、ロードセル秤などへの利用に適した歪センサ
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a strain sensor suitable for use in load cell scales and the like.

従味、ロードセル秤に使用される歪センサは、四個の薄
肉部を有するビームを形成してそれぞれの薄肉部にスト
レンゲージを貼付してブリッジ結合している。このよう
なもの紘装置が大蓋化し、安定性もないことから、薄膜
技術を利用して薄膜抵抗体とそれらの接続とを行なうこ
とが提案されている。この場合の薄膜抵抗体材料として
は、Njcr合金が使用される。この場合、抵抗温度係
数が低いことが要求されるものであるが、N1−Crの
組成と酸素の量とにより抵抗温度係数を制御することか
ら酸化の制御が難しいと云う欠点を有している。また、
Nt−Crの組成によっては経時変化が大きくて安定性
に欠けると云う問題がある。
A strain sensor used in a load cell weighing device forms a beam having four thin parts, and bridge-connects the beam with a strain gauge attached to each thin part. Since such devices are bulky and unstable, it has been proposed to utilize thin film technology to connect thin film resistors and their connections. In this case, Njcr alloy is used as the thin film resistor material. In this case, a low temperature coefficient of resistance is required, but since the temperature coefficient of resistance is controlled by the composition of N1-Cr and the amount of oxygen, it has the disadvantage that it is difficult to control oxidation. . Also,
Depending on the composition of Nt-Cr, there is a problem that the change over time is large and stability is lacking.

本発明は、抵抗温度係数が低くその制御が容易であり、
安定した状態を示す抵抗体を備えた歪センサを得ること
を目的とする。
The present invention has a low temperature coefficient of resistance and is easy to control.
The purpose of the present invention is to obtain a strain sensor equipped with a resistor that exhibits a stable state.

本発明は、ビーム体の表面に絶縁膜を形成し、この上に
薄膜技術を利用して抵抗体と導電層とを積層形成するよ
うにし丸ものにおいて、NニーCデー84の三成分の所
定の組成配分を設定することにょυ、低抵抗温度係数で
あってその調整も上敷PPMの制御が容易にでき、温度
変化に対して安定した特性を示し、経時変化もきわめて
少ないように構成した4のである。
In the present invention, an insulating film is formed on the surface of a beam body, and a resistor and a conductive layer are laminated thereon using thin film technology. By setting the composition distribution of It is.

本発明の一実施例を図面に基づいて説明する。An embodiment of the present invention will be described based on the drawings.

まず、金属弾性体、たとえば80863G (JI8)
のようなステンレス鋼やA 221g (JIS)のよ
うな高力アルミニウムなどを機械加工して平滑な面(1
)を有するビーム体(2)を形成し、これにたがいに連
通した二個の円形の孔(3)を設けて薄肉ms (4)
を形成する。そして、前記ビーム体(2)の一端は固定
* (6)とされ、他端は荷重受部(6)とされている
。前記固定部(5)には取付ボルトが挿通される堆付孔
(7)が形成されておシ、前記荷重受iis (6)に
は樽下金具または荷重受皿が取付けられる係止孔(8)
が形成されている。
First, a metal elastic body, for example 80863G (JI8)
Stainless steel such as A 221g (JIS) or high strength aluminum such as
), and two circular holes (3) communicating with each other are provided in the beam body (2) to form a thin wall ms (4).
form. One end of the beam body (2) is fixed* (6), and the other end is a load receiving portion (6). The fixing part (5) is formed with a mounting hole (7) into which a mounting bolt is inserted, and the load receiver IIS (6) is formed with a locking hole (8) into which a lower barrel fitting or a load receiver is attached. )
is formed.

しかして、前記面(1)には、その全面に絶縁膜(9)
が形成されている。この絶縁膜(9)は絶縁樹脂または
無機化合物よりなるもので#)如、たとえば、ポリイミ
ド樹脂よ如なる。この場合、粘度100GCPのポリイ
ミド樹脂を160Or、p、mのスピンナーで塗布し、
均一厚さにしてから加熱硬化させることにより形成して
いる。
Therefore, the surface (1) is covered with an insulating film (9).
is formed. This insulating film (9) is made of an insulating resin or an inorganic compound, such as polyimide resin. In this case, a polyimide resin with a viscosity of 100GCP is applied with a spinner of 160Or, p, m,
It is formed by heating and curing it to a uniform thickness.

ついで、抵抗体材料をターゲットとして絶縁膜(9)上
にスパッタリングを行ない薄膜の抵抗体(至)を形成し
ている。この抵抗体αQの材料は、jlK3図に示す三
成分三角図表において、W点(N45G、Cデ50.8
40 )(ただし、BtFiOを越える)、X点(Ns
eo、cro、8i 10 )、 Y点 (N<77、
Cr018423 )、2点(N’s50、Cr40.
 auto)(但し、カッコ内の数字の単位はwt%)
を結ぶ四角形に囲まれた範囲内のものである。このとき
の条件は、 電源RFIKW 真空度 4 X 1G  TORR Af圧4X10 toRR 膜厚500 A である。
Next, using the resistor material as a target, sputtering is performed on the insulating film (9) to form a thin film resistor. The material of this resistor αQ is shown in the three-component triangular diagram shown in figure jlK3 at point W (N45G, C de50.8
40) (but exceeds BtFiO), X point (Ns
eo, cro, 8i 10), Y point (N<77,
Cr018423), 2 points (N's50, Cr40.
auto) (However, the unit of numbers in parentheses is wt%)
It is within the range surrounded by the rectangle connecting the . The conditions at this time are: power source RFIKW degree of vacuum 4×1G TORR Af pressure 4×10 toRR film thickness 500 A.

このようにして形成された抵抗体(至)の上に膜厚1μ
倶の金による膜を形成して導電層α珍とする。
A film with a thickness of 1 μm is placed on the resistor (to) formed in this way.
A film of gold is formed to form a conductive layer α.

この導電層αυと抵抗体(至)との層を選択エツチング
して嬉2図に示すように、四個のゲージ部(2)とこれ
らのゲージ部働をたがいに接続してブリッジ結合させる
リード線部(2)と外部配線の丸めの端子部Q4とを形
成する。
By selectively etching the layers of the conductive layer αυ and the resistor (to), as shown in Figure 2, leads are formed to connect the four gauge parts (2) and these gauge parts to each other for a bridge connection. A wire portion (2) and a rounded terminal portion Q4 of external wiring are formed.

なお、前述の抵抗体(至)の材料中には、F−1Co。In addition, among the materials of the above-mentioned resistor (to), F-1Co is included.

MnlMo、 W、V、T4.Zs、Zr%H/、 T
a、 Ni、 B、AJ。
MnlMo, W, V, T4. Zs, Zr%H/, T
a, Ni, B, AJ.

Mg%Ga、sns pbs cs p等の元素が単独
で、あるいは組合せで5wt%未満の含有は許容される
。これは、Ni、Cデ、84のいずれの元素も単独元素
のみで添加することは実際には困−であシ、工業的に常
識的な範囲で他種金属が混入することを本質的な性能が
変らない範1で許容するものである。また、M%などに
ついては、加工性を向上させる九めに0.01〜0.1
 wt%揚度は積極的に添加することが望ましいもので
ある。
It is permissible to contain less than 5 wt% of elements such as Mg%Ga, SNS, PBS, CSP, etc. alone or in combination. This means that it is actually difficult to add any of the elements Ni, C, or 84 as a single element, and that it is essential to prevent the mixing of other metals within an industrially common sense range. This is acceptable in range 1 where the performance does not change. In addition, regarding M% etc., 0.01 to 0.1 is the ninth factor to improve workability.
It is desirable to actively add wt% lift.

このよう、に構成した抵抗体(2)は低抵抗温度係数を
有して温度変化に対して抵抗値の変化が少なく、その経
時変化についても菖4図に示すようにきわめて安定し良
状態を示す。
The resistor (2) constructed in this way has a low temperature coefficient of resistance, with little change in resistance value due to temperature changes, and its change over time is extremely stable and in good condition as shown in Figure 4. show.

本発明け、上述のようにビーム体の絶縁膜の上に形成さ
れる抵抗体をNi −Cr−84系合金とし、その組成
の範囲も三成分三角図表でW点(Nf50.Cデ50、
fii O)、X点(NIO1CrO18i 10 )
、Y点(N(77、Cr011023 )、 2点 (
Ni50、Cr 40.Bi 1G)(ただし、カッコ
内の数字の単位はwt%)を結ぶ四角形に囲まれた範囲
内としたので、低抵抗温度係数であり、抵抗温度係数の
上敷PPMの温度係数の制御が容易であシ、抵抗体の抵
抗変化部を四つ形成してブリッジ結合して使用するよう
な場合。
In the present invention, as mentioned above, the resistor formed on the insulating film of the beam body is made of a Ni-Cr-84 alloy, and its composition range is also the W point (Nf50, Cde50,
fii O), X point (NIO1CrO18i 10 )
, Y point (N(77, Cr011023), 2 points (
Ni50, Cr40. Bi 1G) (however, the unit of numbers in parentheses is wt%), so it has a low resistance temperature coefficient, and it is easy to control the temperature coefficient of the PPM overlaying the resistance temperature coefficient. In the case where four resistance change parts of a resistor are formed and bridge-coupled.

各部の温度係数のバラツキが少ないため、ゼロ点の温度
ドリフトが少なく、温度に対して安定な製品が得られ、
また、経時変化がきわめて少なく長期間にわたって高い
信頼性を得ることができる等の効果を有するものである
Because there is little variation in the temperature coefficient of each part, there is little temperature drift at the zero point, and a product that is stable over temperature can be obtained.
Further, it has the advantage that there is very little change over time and high reliability can be obtained over a long period of time.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示すもので、511図は一部
を誇張した側面図、纂2図は抵抗体生導電部との形状を
示す平面図、第3図は三成分三角図表、縞4図は抵抗値
の経時変化を示すグラフである。 2・・・ビーム体、4・・・薄肉部、9・・・絶縁膜、
10・・・抵抗体、11・・・導電層 曇へ1 口。 蓼も7図
The drawings show one embodiment of the present invention, and Fig. 511 is a partially exaggerated side view, Fig. 2 is a plan view showing the shape of the resistor with a live conductive part, and Fig. 3 is a three-component triangular diagram. Stripe 4 is a graph showing the change in resistance value over time. 2... Beam body, 4... Thin wall part, 9... Insulating film,
10...Resistor, 11...1 mouth to conductive layer fog. Figure 7

Claims (1)

【特許請求の範囲】 1、薄肉部を備えたビーム体に絶縁膜を形成し、この絶
縁膜上の前記薄肉部に対応する位置に薄膜による抵抗体
を積層形成し、これらの抵抗体がブリッジ結合されるよ
うに接続する導電層を積層形成したものにおいて、前記
抵抗体をNi −Cr−at。 三成分三角図表でW点(N450.Cr 5G%840
 )、X点(Ni90、Cry、8jlG)、 Y点(
Ns 7?、Cry、Bi23)、−2点(Ni50.
Cr2O,8410)(71jだし、カッコ内の数字の
単位はwt%)を結ぶ四角形に囲まれた範囲内の組成の
材料としたことを特徴とする歪センサ。 2、抵抗体の材料中に、F−1Co、Mo、Mo、 W
、 V、Ti、Zs、Zr、 H/、Ta、Nb、B、
ム1、Mg、Ga、8s、P6%C%Pの元素を単独あ
るいは二種以上の組合せで合わせてSwt%未溝の混入
を許容したことを特徴とする特許請求の範囲篇1項記載
の歪センサ。
[Claims] 1. An insulating film is formed on a beam body having a thin wall portion, and thin film resistors are stacked on the insulating film at positions corresponding to the thin wall portions, and these resistors form a bridge. In the structure in which conductive layers connected to each other are laminated, the resistor is made of Ni-Cr-at. Point W in the ternary triangular diagram (N450.Cr 5G%840
), X point (Ni90, Cry, 8jlG), Y point (
Ns 7? , Cry, Bi23), -2 points (Ni50.
A strain sensor characterized in that the material has a composition within a range surrounded by a rectangle connecting Cr2O, 8410) (71j, and the units of numbers in parentheses are wt%). 2. F-1Co, Mo, Mo, W in the material of the resistor
, V, Ti, Zs, Zr, H/, Ta, Nb, B,
According to claim 1, the elements 1, Mg, Ga, 8s, P6%C%P are allowed to be mixed alone or in combination of two or more without Swt%. Strain sensor.
JP4418382A 1982-03-19 1982-03-19 strain sensor Pending JPS58161803A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4418382A JPS58161803A (en) 1982-03-19 1982-03-19 strain sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4418382A JPS58161803A (en) 1982-03-19 1982-03-19 strain sensor

Publications (1)

Publication Number Publication Date
JPS58161803A true JPS58161803A (en) 1983-09-26

Family

ID=12684453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4418382A Pending JPS58161803A (en) 1982-03-19 1982-03-19 strain sensor

Country Status (1)

Country Link
JP (1) JPS58161803A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074454A (en) * 2017-10-18 2019-05-16 公益財団法人電磁材料研究所 Thin-film alloy for strain sensors with superior thermal stability and high strain gauge factor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146619A (en) * 1974-10-18 1976-04-21 Hitachi Ltd EAABURIIDOSHIKISHOKUBAIHOGOSOCHI
JPS5677356A (en) * 1979-11-29 1981-06-25 Res Dev Corp Of Japan Amorphous alloy for strain gauge material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146619A (en) * 1974-10-18 1976-04-21 Hitachi Ltd EAABURIIDOSHIKISHOKUBAIHOGOSOCHI
JPS5677356A (en) * 1979-11-29 1981-06-25 Res Dev Corp Of Japan Amorphous alloy for strain gauge material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074454A (en) * 2017-10-18 2019-05-16 公益財団法人電磁材料研究所 Thin-film alloy for strain sensors with superior thermal stability and high strain gauge factor

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