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JPS58160095U - car toy - Google Patents

car toy

Info

Publication number
JPS58160095U
JPS58160095U JP5687182U JP5687182U JPS58160095U JP S58160095 U JPS58160095 U JP S58160095U JP 5687182 U JP5687182 U JP 5687182U JP 5687182 U JP5687182 U JP 5687182U JP S58160095 U JPS58160095 U JP S58160095U
Authority
JP
Japan
Prior art keywords
axle
chassis
gear
coupler
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5687182U
Other languages
Japanese (ja)
Other versions
JPS6024398Y2 (en
Inventor
佐藤　三次
永井　勝彦
Original Assignee
アルプス商事株式会社
日光玩具工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス商事株式会社, 日光玩具工業株式会社 filed Critical アルプス商事株式会社
Priority to JP5687182U priority Critical patent/JPS6024398Y2/en
Publication of JPS58160095U publication Critical patent/JPS58160095U/en
Application granted granted Critical
Publication of JPS6024398Y2 publication Critical patent/JPS6024398Y2/en
Expired legal-status Critical Current

Links

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  • Toys (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本案の実施例を示すものにして、第１図はシャー
シーの平面図、第２図は原動機枠の一部を切断して示す
側面図、第３図は原動機枠の底面斜視図、第４図は断面
図、第５図は組立た側面図、第６図は原動機枠を装着し
たシャーシーの平面図、第７図及び第８図は形態を異に
するボデー二種の例示斜視図である。 １・・・シャ゛−シー、３・・・後車輪軸、４・・・ボ
デー、５・・・取付具、７・・・原動機枠、８・・・１
モーター収容ケース、９・・・電池ボックス、１０・・
・連結器、１５・・・差込孔。The drawings show an embodiment of the present invention, and FIG. 1 is a plan view of the chassis, FIG. 2 is a side view with a part of the engine frame cut away, FIG. 3 is a bottom perspective view of the engine frame, and FIG. Figure 4 is a cross-sectional view, Figure 5 is an assembled side view, Figure 6 is a plan view of the chassis with the motor frame attached, and Figures 7 and 8 are perspective views illustrating two types of bodies with different configurations. be. 1... Chassis, 3... Rear wheel axle, 4... Body, 5... Mounting tool, 7... Motor frame, 8... 1
Motor storage case, 9...Battery box, 10...
・Coupler, 15...insertion hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 前車軸と後車軸を前後に軸架し、中央部両側にボデー取
付具を突設したシャーシーと、該ボデー取付具に適応す
るように取付孔を両側に設けた形態を異にする数種のプ
ラスチック製ボデーと、後車軸上に着脱できる連結器を
下面に設け、上方にモーター収容ケースと、電池ボック
スとを一体に構成した原動機枠と、形態及び外径を異に
し、且つ自由に前後車軸の両端に着脱できる車軸孔を具
えた車輪とからなり、原動機枠内にはモーター歯車に関
連させた減速伝動歯車を内装し、その伝動歯車一つか、
連結器を後車軸上に連結すると、同軸上の歯車と自動的
に噛合するようにしたことを特徴とする自動車玩具。There are several types of chassis that have a front axle and a rear axle mounted on the front and rear axles, and a chassis with body mounting hardware protruding from both sides of the center part, and mounting holes provided on both sides to accommodate the body mounting tools. The motor frame has a plastic body, a coupler that can be attached and detached to the rear axle on the lower surface, and a motor housing case and a battery box on the upper part. It consists of wheels with removable axle holes at both ends, and a reduction transmission gear related to the motor gear is installed inside the prime mover frame, and one of the transmission gears or
A toy car characterized in that when a coupler is connected to a rear axle, it automatically meshes with a gear on the same axle.
JP5687182U 1982-04-21 1982-04-21 car toy Expired JPS6024398Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5687182U JPS6024398Y2 (en) 1982-04-21 1982-04-21 car toy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5687182U JPS6024398Y2 (en) 1982-04-21 1982-04-21 car toy

Publications (2)

Publication Number Publication Date
JPS58160095U true JPS58160095U (en) 1983-10-25
JPS6024398Y2 JPS6024398Y2 (en) 1985-07-20

Family

ID=30067368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5687182U Expired JPS6024398Y2 (en) 1982-04-21 1982-04-21 car toy

Country Status (1)

Country Link
JP (1) JPS6024398Y2 (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012195U (en) * 1983-07-01 1985-01-26 日立造船株式会社 Wind box sealing device for sintering and firing machines
JPS6111083A (en) * 1984-06-25 1986-01-18 株式会社　タカラ traveling toy
JPS6120579A (en) * 1984-07-09 1986-01-29 株式会社　タカラ Running toy
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US6965159B1 (en) 2001-09-19 2005-11-15 Amkor Technology, Inc. Reinforced lead-frame assembly for interconnecting circuits within a circuit module
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7045396B2 (en) 1999-12-16 2006-05-16 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7183630B1 (en) 2002-04-15 2007-02-27 Amkor Technology, Inc. Lead frame with plated end leads
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
JP7365084B1 (en) * 2023-02-03 2023-10-19 チームラボ株式会社 traveling device

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012195U (en) * 1983-07-01 1985-01-26 日立造船株式会社 Wind box sealing device for sintering and firing machines
JPS6111083A (en) * 1984-06-25 1986-01-18 株式会社　タカラ traveling toy
JPS6120579A (en) * 1984-07-09 1986-01-29 株式会社　タカラ Running toy
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US7045396B2 (en) 1999-12-16 2006-05-16 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US6965159B1 (en) 2001-09-19 2005-11-15 Amkor Technology, Inc. Reinforced lead-frame assembly for interconnecting circuits within a circuit module
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US7183630B1 (en) 2002-04-15 2007-02-27 Amkor Technology, Inc. Lead frame with plated end leads
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
JP7365084B1 (en) * 2023-02-03 2023-10-19 チームラボ株式会社 traveling device
WO2024161934A1 (en) * 2023-02-03 2024-08-08 チームラボ株式会社 Travel device

Also Published As

Publication number Publication date
JPS6024398Y2 (en) 1985-07-20

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