JPS58152304A - Silver coated conductor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Is misexploded moe Ag or Ag combination? This relates to the coated body, and in particular, the AgX treatment is one that prevents the deterioration of the growth properties and storage properties of the Ag coalescence coating and layer.

In general, there are 44 types of rice coverings, Cu, Cu alloy, AA,
Ag or Ag-8b@he, Ag
-Cu alloy, Ag-B1 combination, Ag-Au combination, Ag-
It is a restoration of F3n@r, etc., with the crushed 17Ii degree of the conductor base and the excellent conductor characteristic peculiar to Ag or Ag joints,
Soldering is a once-in-a-lifetime process, and is widely used in the manufacture and assembly of electrical and electronic equipment parts such as connectors, switches, relays, terminals, and semiconductors. These S electric bodies are soldered, soldered, and soldered in the parts processing and assembly process.
Commercial temperature treatments such as drying are no longer necessary4, and furthermore, even after being incorporated into a device, the product is not used at a temperature that is 11 times higher than room temperature for a long period of time, so it is required to comply with the standard.

Since Ag or Ag combination is expensive, it is required for the coating thickness to be as uniform as possible for economical reasons. etc. diffuse into Ag or Ag@condensation, impairing the chemical stability of Ag or Ag@Hotarumotomai, and oxidation rapidly lowers the connectivity and solderability. do. Such AgX accelerates the deterioration of the shoai soshi, and in severe cases it may cause discoloration of the appearance.
#Turtle substrate and Ag or Ag@firefly coating and 0]
NtlTta'4r' is formed. Since hei does not react with Ag, it develops attractive barrier seedlings at a thickness of 0.1/i, but at temperatures above 180°C, for example, r# in the atmosphere, Ni penetrates the Ag or Ag alloy layer and oxidizes, resulting in poor adhesiveness of the Ag or Ag alloy layer, resulting in peeling due to bending, etc. is also affected. That is, since Ag rapidly dissolves in soldering, when the oxidized 1N solids are exposed and placed in the solder bath, the sieving properties are reduced.

Such an agglomerate is formed on the conductive substrate by the upper 1e and the Fe joint ■＼ζ
The same problem occurs when N1 alignment is used, so for Ag or Ag@gold coatings that need to withstand C, the thickness of the Ag or Ag alloy layer must be increased to 3 to 5 μm, sometimes even thicker. May be coated.

The present invention is based on this invention.
II) In the case of a special electric base made of Ni, CO or an alloy thereof, which is coated with Ag or an Ag alloy on the upper side, It is characterized by providing a Sn or Sn alloy layer with a thickness of 0.1) 1μ or more between the substrate and the Ag or Ag alloy supported layer.

That is, the conductor of the present invention has the following characteristics: ilI"e, Ni, Co
or
# Coated with Ni, Co or a combination thereof on a substrate such as an alloy
Using a dragon base, cover it with a 2Sn or 8N pot,
Moreover, C2A, L (or Ag alloy coating) can be coated using various methods such as # coating, sputtering, plating, mechanical compression, etc. Covering with plating is often the easiest practical method to implement. In particular, for coating Sn or S 11 @i fi2, a known plating bath such as alkaline plating, value acid plating, or fluoride bath is used (T7 is good.
-Pb, 5n-Zn, 5n-fNi% or self'9. J
r-C allo.

The coating thickness of Sn or Sn@firefly should be 001μ or more, preferably 0.1 to 0.5μ, and if the coating thickness is less than 0.01t, it is expected to be effective in preventing the outer layer from becoming transparent. Can not. Also, the upper limit of the coating thickness of BN or Bn joint site is different from Ag or the equinox of Ag platform ≦2, or the trace thickness is 1~
Since the effect is saturated at a thickness of 2 μm, excess coating beyond this point may be caused by 8n or 8n depending on the convenience of the weighing machine. There may be cases where there is an additional charge, but in practice it is 01 to 0.5.
The mu side looks good.

plane, Sn alignment is an alloy whose main component is Sn, and t1Mn
The higher the content, the more effective it is11, so it is desirable to use an alloy with a content of about 4% or more.

Now, two embodiments of the present invention will be explained.

Example (II Dj'-'ia O, 5JIia] Pure Mnl k'
a' Regular L CyoiJ Na01 (20, V/A, (i
(1 = 0) After taking off the sword +111 in the hot bath, H28U4 Fu, Ko Ini lO Shouma Dep, Ryo, to i
(SChNH2h30(M/ApH2,5Q) N i
plating! 6, 'current'eB 13t l OA/
Plating is done in dm2, and the thickness is 075μ on the surface of pure Nanjo.
of N 11% y and on top of that 5I04201/!
j,) 1.80410011/! 1% = Kawa 211/l
v＞Using a Sn plating bath (heat removed at 18°C), tun #L Mihiki 5
The plate was plated at A/dm to a thickness of 0.25 μo. 2g in on this C24 and 8C.

KCN 31) i/# 0) Using Ag strike plating metallurgy, Ag strike plating was applied at a plating degree of 5 A/dm2, followed by 5-AgCN50.9/A, KCN 10 (1,9/A').
O) Using Ag thick plating bath, ゛4 flow density If 2.5
Thick Ag plating was applied at A/dm 2 on the 1,9n layer (
A conductor of the present invention was fabricated by forming an Ag skin with a thickness of about 1.5 μm. 'Example f2+ Example (In II, snt luck #) I 11 Sn
80440 Ji'/13, ZnS0 7H204 (
IJ@/A, Rin fg secondary ammonium 150I/i
:(1'JR4)280a i U (J l/A,
Ammonia water (approx. 35%) 701//L 5n-Zn alloy with pH 7.5/Tsu + bath Ym, Dragon @ degree 1.5A/
S n Z n combination (approximately 20% Zn) plating with dm 2? T-1N indigo skin with a thickness of 0.3 μm,
A conductor of the present invention was manufactured by forming a conductor of the present invention by forming a conductor of the present invention by forming an Ag skin with a thickness of about 1.5 μm on it in the same manner as in Example tll. , Na28 in praise of Sn plating bath
rdJsiUO,V/A, INa(J)i15&/V using Sn plating bath (temperature '75℃), Arashi 1lJlt density 1.5 A/d m without δn plating, lNi1 thickness tl A 1s dragon body of the present invention was manufactured by depositing 16 layers of SnJ with a thickness of 0.075μ and forming Ag In with a thickness of about 1.5μ on it.

6- Comparative Example (II) In Example 2, the BN plating value was omitted using a Sn plating bath, and AJ Sona pre-forming with a thickness of about 1.5 μm was made on the first layer and a monument plate was manufactured and shipped. did.

Comparative example (2) Jj Soft example (N1 win in 11) Directly on the second thickness 3μ
A conductor was manufactured by forming Ag1-.

Comparative Example (X3) In Comparative Example (1), a 5μ thick Ag layer was applied directly onto the Ni layer.
The conductor was constructed by pre-forming strata.

Each of these conductors was heated to 220°C in the atmosphere.
After heating for 4 hours at 300℃ for 1 hour, 180℃
℃ fold number 1 bending process is fT, the bending part is 50
It was observed with a magnifying glass to check for peeling. Katana 1]
The silently treated material is treated with rosin flux and then heated to temperature 2.
It was immersed in a eutectic solder bath at 35° C. for 5 seconds, and the ratio of the solder area to the immersed surface was measured. The results are shown in Table 1.4-0 7- As is clear from Table 1, the conductor of the present invention has a thickness of
It can be seen that an Ag coating with a thickness of 5 μm can provide performance equivalent to or better than that of a conventional conductor with an Ag coating with a grain thickness of 5 μm.

Example (4) Thickness Q, 5 am Ni48%-r'e F) 2% bonded strip in the usual manner, Jl, 11 NaOH2 (H1/L
After cathodic degreasing in '&A furnace at 60℃, 15% HC
7(after 30 seconds, 5n(Hf!”e) 25
0.9/11HBFe100#/A Sn-plated liner (bath temperature 15°C) was used to conduct Mn plating at a "torque flow rate IOA7'ctm", and the surface of the Ni48%-F852% joint strip (two thickness A conductor of the present invention was manufactured by forming a 9n layer with a thickness of about 0.05 μm, and then forming an Ag layer with a thickness of 2.5 μm on it using the same Ag strike plating bath as in Example 11 (without using thick Ag plating). .

Comparative Example (41 ￥ Low Example) 80 plating by Mn plating bath was omitted, and an Ag layer with a thickness of 2.5 /j was directly applied to the surface of the N148%-'652% alloy strip. He then produced a humiliating body.

Both conductive pellets were heat-treated in the atmosphere at a temperature of 350°C for 30 minutes, and then their surfaces were observed with a 50x magnifying glass to check for blistering. Half 1l18#; resistance was tested.

As a result, no blisters were observed in the conductor of the present invention produced in Example (4), and the solder resistance was 93%. Comparative example (4) in which dn skin formation was omitted by 1
) The conventional conductor manufactured by
2. The solder resistance was 10% or more.

In this way, the conductor of the present invention prevents the corrosion resistance and density of the Ag or Ag laminate cover layer from becoming masculinized during high-temperature processing.
The dredged soldering is a method that shows properties and can be used to thin Ag or Ag alloy alloys, and it has a favorable industrial effect. be.

-l〇　-

Claims (1)

[Claims] In a conductor whose surface is made of Ag or an Ag alloy on a substrate made of l'e, Ni, Co or a combination thereof, there is a thickness of 0 between the substrate and the Ag or hg coating layer. A silver-coated conductor characterized in that it is provided with a copper alloy or a Sn alloy of .01 p or more.