JPS58147295U - Heatsink for printed board mounting - Google Patents
Heatsink for printed board mountingInfo
- Publication number
- JPS58147295U JPS58147295U JP4501982U JP4501982U JPS58147295U JP S58147295 U JPS58147295 U JP S58147295U JP 4501982 U JP4501982 U JP 4501982U JP 4501982 U JP4501982 U JP 4501982U JP S58147295 U JPS58147295 U JP S58147295U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- heatsink
- radiator
- board mounting
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第11図は従来のものの要部斜視図、第2図は本考案の
放熱器の一実施例正面図、第3図は本考案の実装の一実
施例、第4図は放熱器の他の一実施例正面図である。
図中1はプリント板、2はトランジスタ、3゜3′、3
″は放熱器、32は舌片、36.36′は孔を示す。Fig. 11 is a perspective view of the main parts of the conventional one, Fig. 2 is a front view of one embodiment of the radiator of the present invention, Fig. 3 is an embodiment of the implementation of the radiator of the present invention, and Fig. 4 is another example of the radiator of the present invention. FIG. 1 is a front view of one embodiment. In the figure, 1 is a printed board, 2 is a transistor, 3°3', 3
'' indicates a heat radiator, 32 indicates a tongue piece, and 36.36' indicates a hole.
Claims (1)
面から突出する舌片とを具えてなり、該舌片をプリント
板孔に挿通し半田付は固定する放熱器において、前記舌
片が突出する主面側に該舌片に対する熱伝導阻止用の孔
を設けたことを特徴とするプリント板実装用放熱器。A radiator comprising a main surface of the radiator to which components requiring heat dissipation are attached, and a tongue protruding from the main surface, the tongue being inserted into a printed board hole and fixed by soldering. A heat radiator for mounting on a printed board, characterized in that a hole for preventing heat conduction to the tongue piece is provided on the protruding main surface side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4501982U JPS58147295U (en) | 1982-03-30 | 1982-03-30 | Heatsink for printed board mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4501982U JPS58147295U (en) | 1982-03-30 | 1982-03-30 | Heatsink for printed board mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58147295U true JPS58147295U (en) | 1983-10-03 |
Family
ID=30056060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4501982U Pending JPS58147295U (en) | 1982-03-30 | 1982-03-30 | Heatsink for printed board mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58147295U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017183906A (en) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | Piezoelectric oscillator |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5131067B1 (en) * | 1970-08-03 | 1976-09-04 |
-
1982
- 1982-03-30 JP JP4501982U patent/JPS58147295U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5131067B1 (en) * | 1970-08-03 | 1976-09-04 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017183906A (en) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | Piezoelectric oscillator |
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