JPS58141214A - Treatment of thin-film element - Google Patents
Treatment of thin-film elementInfo
- Publication number
- JPS58141214A JPS58141214A JP2470382A JP2470382A JPS58141214A JP S58141214 A JPS58141214 A JP S58141214A JP 2470382 A JP2470382 A JP 2470382A JP 2470382 A JP2470382 A JP 2470382A JP S58141214 A JPS58141214 A JP S58141214A
- Authority
- JP
- Japan
- Prior art keywords
- thin
- polymer substrate
- thin film
- film element
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000010894 electron beam technology Methods 0.000 claims abstract description 11
- 229920000307 polymer substrate Polymers 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 238000004804 winding Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は高分子成形物基板上の一方の面に半導体、磁性
体等の薄膜を形成して成る機能薄膜素子の製造に利用さ
れ、薄膜形成時に生じた欠陥や表面の汚染を除去し安定
化を図る処理方法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention is used to manufacture a functional thin film element in which a thin film of semiconductor, magnetic material, etc. is formed on one side of a polymer molded substrate. The present invention relates to improvements in treatment methods for removing contamination and stabilizing the environment.
最近、平滑なポリエチレンテレフタレート(P。Recently, smooth polyethylene terephthalate (P.
E、T、)基板等の高分子基板上に、co、Co−14
合金薄膜を蒸着法にて形成した磁気テープや、アモルフ
ァスシリコン薄膜を形成した太陽電池の開発が進み、一
部実用になっている。co, Co-14 on a polymer substrate such as E, T, ) substrate.
Magnetic tapes made of alloy thin films formed by vapor deposition methods and solar cells made of amorphous silicon thin films have been developed, and some of them are now in practical use.
これらの素子の欠点は、実用環境で長時間の使用に耐え
ないものが、薄膜製造条件の管理のみでは発生すること
である。A drawback of these devices is that they cannot withstand long-term use in a practical environment if only the thin film manufacturing conditions are controlled.
磁気テープは太陽電池の場合と違い、表面に保護層を設
けるのに対して、スペース損失の面から短波長記録のビ
デオ用途の場合等には厚さに制限が加わり、保護層の厚
みは高々200人程度である。Unlike the case of solar cells, magnetic tape has a protective layer on its surface, but due to space loss, there are restrictions on the thickness for short wavelength recording video applications, etc., and the thickness of the protective layer is at most There were about 200 people.
しかしこの厚みで保護効果を有する薄膜をあらたに、ス
パンタリング、蒸着等の手段で形成することは困難であ
る。それは、基板が高分子のために、薄膜形成時に温度
をあげられないからである。However, it is difficult to newly form a thin film having a protective effect with this thickness by means such as sputtering or vapor deposition. This is because the substrate is made of polymer, so it is not possible to raise the temperature when forming a thin film.
従って、磁性層そのものの耐蝕性をあげる方法の工夫が
重要になってくる。Therefore, it is important to devise a method for increasing the corrosion resistance of the magnetic layer itself.
そのひとつとして、部分酸化の技術を真空蒸着時に採用
することが考えられる。One possible solution is to use partial oxidation technology during vacuum deposition.
この方法はかなり当を得た解決策と思えるが、工業規模
でテープを製造するのに、利用される蒸着速度は2,0
00人/secと通常実験室で研究に用いられる蒸着速
度の100〜1,000倍と極めて大きい。従って、酸
素中で蒸着することで、結晶あ“l子の表面に形成され
る酸化膜は、欠陥が残っている。Although this method seems to be a fairly reasonable solution, the deposition rate used to produce the tape on an industrial scale is 2.0
00 people/sec, which is extremely high and 100 to 1,000 times the deposition rate normally used for research in laboratories. Therefore, defects remain in the oxide film formed on the surface of the crystalline atom by vapor deposition in oxygen.
・力太陽電池に於ても、ダングリングボンドを減らすた
めに、H2、02等のガスが蒸着、スパッタリング、グ
ロー放電蒸着、グロー放電重合時に利用されるが、表面
だけでなく内部にも欠陥が残り、リーク電流が多くなり
、低い起電力しか得られないことがおこる。・In order to reduce dangling bonds in solar cells, gases such as H2 and 02 are used during vapor deposition, sputtering, glow discharge deposition, and glow discharge polymerization, but defects can occur not only on the surface but also inside. Otherwise, leakage current increases and only a low electromotive force can be obtained.
これらに対してとられていた方法は、エージングと呼ば
れる手法である。The method used to deal with these problems is a technique called aging.
残念ながら、この手法に於ても高分子材料を基板に用い
ていることから、エージング条件の温度に制約が生じる
。従って、長時間のエージングを必要とすることと、時
間だけでは動かない欠陥が残り、改良を十分に行うこと
は出来なかった。Unfortunately, even in this method, since a polymeric material is used for the substrate, there are restrictions on the temperature of the aging conditions. Therefore, a long period of aging is required, and defects that cannot be cured by time alone remain, making it impossible to make sufficient improvements.
本発明は、かかる点に鑑みなされたもので、薄膜が吸収
し、ポリエチレンテレフタレート等の高を主とした光を
集光し照射を行って、薄膜層を高温にて処理することを
、長尺もの全体にわたって完全に行うことができる方法
を提供するものである。The present invention has been made in view of this point, and it is possible to treat the thin film layer at high temperature by concentrating and irradiating light that is mainly absorbed by the thin film and containing high-temperature light such as polyethylene terephthalate. It provides a method that can be applied completely throughout the entire process.
そのためにとられた方法は、基板側を確実に冷却するこ
とと、光の照射を減圧下で行うことで安定な処理を図る
ことである。The methods adopted for this purpose were to reliably cool the substrate side and to perform light irradiation under reduced pressure to ensure stable processing.
図は、本発明を実施するだめの装置の一例を示す。The figure shows an example of a device for carrying out the invention.
高分子基板上に薄膜が設けられた長尺、広幅の薄膜素子
1は、高分子基板を冷却するローラ2(これは媒体を循
環させ、かつその媒体は温調され、定温制御されるのが
好ましい。)の周側面に沿って移動し、処理され、巻き
取られるように構成された巻取り系に装着される。A long, wide thin film element 1 having a thin film provided on a polymer substrate is connected to a roller 2 (which circulates a medium, which cools the polymer substrate, and whose temperature is regulated and whose temperature is controlled at a constant temperature). ) is mounted on a winding system configured to move along the circumferential side of the film, to be processed and to be wound up.
巻取り系の構成要素として、図では送り出し軸3、巻き
取り軸4.フリーローラ61ロー22のみ示しであるが
、他の公知の要素が必要に応じて導入されるのは勿論で
ある。The components of the winding system are a feed shaft 3, a winding shaft 4, and a winding shaft 4 in the figure. Although only the free roller 61 and the row 22 are shown, it goes without saying that other known elements may be introduced as necessary.
真空槽6は図では3つの空間7,8.9に分割されてい
るが、これ以上の分割が必要な場合も差圧条件によりで
てくるが、その都度対処できるものである。Although the vacuum chamber 6 is divided into three spaces 7, 8, and 9 in the figure, there may be cases where further division is necessary depending on the differential pressure conditions, but this can be handled on a case-by-case basis.
7は電子線1oの照射を行う部屋であり、例えばクライ
オポンプ11で排気され、1 e)−’ Torr以下
に保持されるよう構成される。電子線は電子銃12より
放射され、偏向コイル13により偏向走査される。この
電子線照射の作用効果は、薄膜の形成が別の真空系で行
われた後、大気にさらされていたために吸着したガスを
追い出す清浄代作;11にあることと、薄膜層を貫通し
高分子基板に到達する電子線のエネルギーを選択するこ
とで、高分子に電子注入による補か〈準位が発生し、従
って同転ローラ2を金属製にしかつ接地電位に置いてや
れば(なお積極的に行わなくても通常の機械系では自然
に接地電位に置かれる。)、静電気力で回転ローラの周
側面に垂直方向の圧力が大きくなり、熱伝達が極めて良
好になることである。Reference numeral 7 denotes a room in which electron beam 1o is irradiated, and is configured to be evacuated, for example, by a cryopump 11, and maintained at 1e)-' Torr or less. An electron beam is emitted from an electron gun 12 and deflected and scanned by a deflection coil 13. The effects of this electron beam irradiation are that after the thin film is formed in a separate vacuum system, it is a cleaning agent that expels the gas that has been adsorbed due to exposure to the atmosphere; By selecting the energy of the electron beam that reaches the polymer substrate, a compensation level is generated in the polymer by electron injection. (Even if you do not do this actively, normal mechanical systems are naturally placed at ground potential.) The electrostatic force increases vertical pressure on the circumferential surface of the rotating roller, resulting in extremely good heat transfer.
この効果は真空内で特に顕著で、上記処理を施すことに
より、熱伝達率は1/1000程度になることを別の実
験で確認している。→この効果により、光処理のエネル
ギー密度を増して高温処理が達成できるのである。This effect is particularly remarkable in a vacuum, and it has been confirmed in another experiment that the heat transfer coefficient can be reduced to about 1/1000 by performing the above treatment. →This effect makes it possible to increase the energy density of light treatment and achieve high-temperature treatment.
8は光処理するだめの部屋である。ポンプ14で排気し
、ニードル弁の調節により02等のガスを導入するよう
に構成されたガス導入系16を具備している。8 is a room for light processing. A gas introduction system 16 is provided, which is configured to exhaust gas with a pump 14 and introduce gas such as 02 by adjusting a needle valve.
光源は例えば・・ロゲンランプ16で幅方向に、基板の
幅と同等かそれ以上の長さのランプが反射鏡17(楕円
鏡が普通用いられる。)の焦点位置近傍に置かれ、薄膜
面位置に光18が集光するように構成する。図では3組
の光源を有する場合を示したが、2組作用させ1組予備
として、故障時も処理を継続できるようにするのが好ま
しい。勿論、光源数、ワット数等は処理速度とも関連し
て決められるものである。The light source is, for example, a logen lamp 16 whose length in the width direction is equal to or longer than the width of the substrate, and placed near the focal point of the reflecting mirror 17 (usually an elliptical mirror), and positioned at the thin film surface. It is configured so that the light 18 is condensed. Although the figure shows a case where three sets of light sources are provided, it is preferable to have two sets working and one set as a spare so that processing can be continued even in the event of a failure. Of course, the number of light sources, wattage, etc. are determined in relation to the processing speed.
空間9は高分子基板の捕かく準位の発生による帯電を見
かけ上中和するだめのグロー処理を行うことと、電子線
照射室と光処理室の差圧が一段でとれない場合にも、差
圧を保持するのにも有効である。J19はグロー処理の
電極を模式的に示しである。これは、交流、直流、高周
波の選択によっても異なるし、磁界の作用を用いること
でも異なる構成になるが、設計事項である。Space 9 performs glow treatment to apparently neutralize the charge caused by the generation of trapped levels in the polymer substrate, and also when the differential pressure between the electron beam irradiation chamber and the photoprocessing chamber cannot be maintained at one stage. It is also effective in maintaining differential pressure. J19 schematically shows an electrode for glow treatment. This differs depending on the selection of alternating current, direct current, and high frequency, and also differs depending on the use of magnetic field action, but this is a design matter.
20.21は差圧を得るだめのかくへきである。20.21 is the hole for obtaining the differential pressure.
基板裏面のグロー処理にガスを導入するようにするか否
かも光処理室の圧力と、グロー処理の圧力と、かくへき
の設計で光処理室へのガス導入でまかなえることもあり
、あえて示さなかったが、個別に設けても良いのは勿論
である。Whether or not gas should be introduced for the glow treatment on the back side of the substrate is not indicated because it depends on the pressure of the light treatment chamber, the pressure of the glow treatment, and the design of the stirrer, so it can be covered by the introduction of gas into the light treatment chamber. However, it goes without saying that they may be provided individually.
次に具体的に本発明の詳細な説明する。Next, the present invention will be specifically explained in detail.
1実施例1〕
同転ローラ:直径1m、表面の仕上げ精度0.098
循環媒体温度:25±0.6℃
処理対象:ポリエチレンテレフタレートフィルム(厚さ
9.6μm)上に、最小入射
角36°で酸素圧3X10’Torrで1μmの厚さに
COを蒸着した、幅
プ原反
処理条件は下の表に示す通りである。1 Example 1 Co-rotating roller: diameter 1 m, surface finishing accuracy 0.098 Circulating medium temperature: 25 ± 0.6°C Processing target: Minimum incident angle of 36° on polyethylene terephthalate film (thickness 9.6 μm) The processing conditions for the original fabric, in which CO was evaporated to a thickness of 1 μm at an oxygen pressure of 3×10' Torr, are shown in the table below.
(以下余白)
0
〔実施例2」
回転ローラ:直径1 m +表面の仕上げ精度0.04
8
循環媒体温度;40°±1℃
処理対象:ポリエチレンテレフタレートフィルム(厚さ
11.6μm)上に最小入射
角40°で酸素分圧2.5 X 10 TOrTでQ
、15μmの厚さにCo s o % Ni2Oチを蒸
着した、幅60(1’1m、長さ4ooOmの磁気テー
プの原反
処理条件:フィルム速度2orr)/1Iin一定電子
線a s Key 、 e 6o mム電子線照射面積
0.08rn’
裏面グロー条件60Hz、400’0.2ム〜330
0.4ム
光照射s x 1o’(/m”)X2基雰囲気条件は下
の表に示す通りである。(Left below) 0 [Example 2] Rotating roller: diameter 1 m + surface finishing accuracy 0.04
8 Circulating medium temperature; 40° ± 1°C Processing target: Polyethylene terephthalate film (thickness 11.6 μm) at a minimum incident angle of 40° and an oxygen partial pressure of 2.5 x 10 TOrT Q
, 15 μm thick Coso % Ni2O film was deposited on a magnetic tape with a width of 60 mm (1'1 m and a length of 400 m). Processing conditions: film speed of 2 orr)/1 inch constant electron beam a s Key , e 6 o mm Electron beam irradiation area 0.08rn' Back glow condition 60Hz, 400'0.2mm~330
0.4 μm light irradiation s x 1o'(/m'') x 2 group Atmosphere conditions are as shown in the table below.
11
〔実施例3〕
回転ローラ:直径’ m +表面の仕上げ精度O,1S
循環媒体温度=120℃±2℃
処理対象:ボリアミドフィルム(厚さ12μm)上に、
高周波(15,66MH2)スパッタ法によりアモルフ
ァスシリコン膜ヲ
ムr9X10−3Torr 、H23x1o−”ror
rの放電ガス雰囲気で0.6μmの厚さ
に形成した幅50 cIIL、長さ1,200mの太陽
電池用原反
処理条件:フィルム移動速度1s m、4電子線45に
θV、1ム
裏面グロー条件60)1z、400 0.22ム〜32
0 0.5ム
光照射5 X 10 ” (T/m”) X 2基1−
ム〜3−Diでの14試料について60℃96SRHの
環境中に4週間、10週間保存した後、磁気テープにつ
いては、振動試料磁束計により磁気特性を測定し、アモ
ルファスシリコンについては電気伝導度の変化率を調べ
た。その結果を下の2つの表に示す。表中ではいずれも
初期値に対する増減をパーセントで表わした。11 [Example 3] Rotating roller: diameter 'm + surface finishing accuracy O, 1S Circulating medium temperature = 120°C ± 2°C Processing target: On a polyamide film (thickness 12 μm),
Amorphous silicon film was formed using high frequency (15,66MH2) sputtering method at 9X10-3Torr, H23X1O-''r
Processing conditions for a solar cell original fabric with a width of 50 cIIL and a length of 1,200 m formed to a thickness of 0.6 μm in a discharge gas atmosphere of r. Condition 60) 1z, 400 0.22mm~32
0 0.5 μm light irradiation 5 × 10” (T/m”) × 2 groups 1-
After storing the 14 samples at 3-Di for 4 weeks and 10 weeks in an environment of 60°C and 96 SRH, the magnetic properties of the magnetic tape were measured using a vibrating sample magnetometer, and the electrical conductivity of the amorphous silicon was measured. We investigated the rate of change. The results are shown in the two tables below. In each table, the increase/decrease from the initial value is expressed as a percentage.
3
4
上の表に示しだ結果から明らかなように、本発明により
処理したものは経時変化が極めて小さくなっている。3 4 As is clear from the results shown in the table above, the samples treated according to the present invention show extremely small changes over time.
さらに本発明により処理したものと従来品との他の条件
下での安定性を比較するために、40’C80チRH,
30’C80チRH,802ガス16ppmを含む雰囲
気あるいは温泉地等に放置したときの特性の変化を調べ
たところ、上記両者の間で明らかな有意差が認められた
。Furthermore, in order to compare the stability under other conditions between the product treated according to the present invention and the conventional product, 40'C80CHRH,
When the changes in characteristics were investigated when the product was left in an atmosphere containing 16 ppm of 30'C80CH 802 gas or in a hot spring area, a clear significant difference was found between the two.
以上のように本発明は、安定な性能の維持を可能とし、
その工業的有価値性は犬である。As described above, the present invention makes it possible to maintain stable performance,
Its industrial value is a dog.
図は本発明を実施するための装置の1例を示す図である
。
1・・・・・・薄膜素子、2,6・・・・・・ローラ、
6・・・・・・真空槽、1o・・・・・・電子線、16
・・・・・・光源、17・・・・・・反射鏡、19・・
・・・・グロー電極。The figure is a diagram showing an example of an apparatus for carrying out the present invention. 1... Thin film element, 2, 6... Roller,
6...Vacuum chamber, 1o...Electron beam, 16
...Light source, 17...Reflector, 19...
...Glow electrode.
Claims (1)
薄膜層が外側になるようにして、温度割出1された金属
ローラに沿って走行せしめるとともに、上記金属ローラ
上を走行中の上記薄膜素子に、電子線を照射し、かつ、
上記薄膜素子の幅方向に線状に集光された光を減圧下で
照射することを特徴とする薄膜素子の処理方法。A thin film element having a thin film layer provided on one side of a polymer substrate is made to run along a metal roller whose temperature has been determined 1 with the thin film layer facing outside, and a thin film element is made to run along a metal roller whose temperature is determined. irradiating the thin film element with an electron beam, and
A method for processing a thin film element, comprising irradiating the thin film element with linearly focused light in the width direction of the thin film element under reduced pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2470382A JPS58141214A (en) | 1982-02-17 | 1982-02-17 | Treatment of thin-film element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2470382A JPS58141214A (en) | 1982-02-17 | 1982-02-17 | Treatment of thin-film element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58141214A true JPS58141214A (en) | 1983-08-22 |
Family
ID=12145534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2470382A Pending JPS58141214A (en) | 1982-02-17 | 1982-02-17 | Treatment of thin-film element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58141214A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533566A (en) * | 1984-07-05 | 1985-08-06 | Minnesota Mining And Manufacturing Company | Electron-beam adhesion-promoting treatment of polyester film base for silicone release liners |
US4543268A (en) * | 1984-07-05 | 1985-09-24 | Minnesota Mining And Manufacturing Company | Electron-beam adhesion-promoting treatment of polyester film base for magnetic recording media |
US4594262A (en) * | 1984-07-05 | 1986-06-10 | Minnesota Mining And Manufacturing Company | Electron beam adhesion-promoting treatment of polyester film base |
JPH02120803A (en) * | 1988-10-31 | 1990-05-08 | Nippon Electric Glass Co Ltd | Treatment of multilayered interference filter film |
-
1982
- 1982-02-17 JP JP2470382A patent/JPS58141214A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533566A (en) * | 1984-07-05 | 1985-08-06 | Minnesota Mining And Manufacturing Company | Electron-beam adhesion-promoting treatment of polyester film base for silicone release liners |
US4543268A (en) * | 1984-07-05 | 1985-09-24 | Minnesota Mining And Manufacturing Company | Electron-beam adhesion-promoting treatment of polyester film base for magnetic recording media |
US4594262A (en) * | 1984-07-05 | 1986-06-10 | Minnesota Mining And Manufacturing Company | Electron beam adhesion-promoting treatment of polyester film base |
JPH02120803A (en) * | 1988-10-31 | 1990-05-08 | Nippon Electric Glass Co Ltd | Treatment of multilayered interference filter film |
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