JPS58116276U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS58116276U JPS58116276U JP1226482U JP1226482U JPS58116276U JP S58116276 U JPS58116276 U JP S58116276U JP 1226482 U JP1226482 U JP 1226482U JP 1226482 U JP1226482 U JP 1226482U JP S58116276 U JPS58116276 U JP S58116276U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- circuit
- sides
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
〜 第１図は従来の回路基板の概念的断面構成図、第２
図は本考案の一実施例による回路基板の第１図と同様な
断面構成図、そして第３図は第２図の接続態様例を示す
概念的斜視図である。
１・・・・・・接着剤、５・・・・・・可撓性プリント
基板、６・・・・・・両面硬質基板、８・・・・・・ス
ルーホール導通部、９・・・・・−半田ジャンパー。~ Figure 1 is a conceptual cross-sectional configuration diagram of a conventional circuit board, Figure 2 is a conceptual cross-sectional diagram of a conventional circuit board.
The figure is a sectional view similar to FIG. 1 of a circuit board according to an embodiment of the present invention, and FIG. 3 is a conceptual perspective view showing an example of the connection mode shown in FIG. 2. DESCRIPTION OF SYMBOLS 1...Adhesive, 5...Flexible printed circuit board, 6...Double-sided rigid board, 8...Through-hole conduction part, 9... ...-Solder jumper.
Claims (1)
プリント、基板の一部で折り曲げて挾み込むように接合
し、上記硬質基板の回路パターンと上記可撓性プリント
基板に形成された回路パターンとの所要部分の接続を図
るように構成してなる回路基板。Both sides of a hard board with circuit patterns formed on both sides are made of flexible prints, and a part of the board is bent and sandwiched together to form a circuit pattern on the hard board and a circuit formed on the flexible printed board. A circuit board configured to connect required parts to a pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226482U JPS58116276U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226482U JPS58116276U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116276U true JPS58116276U (en) | 1983-08-08 |
Family
ID=30024849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1226482U Pending JPS58116276U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116276U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5410970A (en) * | 1977-06-27 | 1979-01-26 | Nippon Mektron Kk | Hybrid multiilayer circuit board and method of manufacturing same |
| JPS562270B2 (en) * | 1977-10-22 | 1981-01-19 |
-
1982
- 1982-01-30 JP JP1226482U patent/JPS58116276U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5410970A (en) * | 1977-06-27 | 1979-01-26 | Nippon Mektron Kk | Hybrid multiilayer circuit board and method of manufacturing same |
| JPS562270B2 (en) * | 1977-10-22 | 1981-01-19 |
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