[go: up one dir, main page]

JPS58113372A - Thin film coating and manufacturing method thereof - Google Patents

Thin film coating and manufacturing method thereof

Info

Publication number
JPS58113372A
JPS58113372A JP20952181A JP20952181A JPS58113372A JP S58113372 A JPS58113372 A JP S58113372A JP 20952181 A JP20952181 A JP 20952181A JP 20952181 A JP20952181 A JP 20952181A JP S58113372 A JPS58113372 A JP S58113372A
Authority
JP
Japan
Prior art keywords
thin film
substrate
tension
film
film coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20952181A
Other languages
Japanese (ja)
Inventor
Tatsuo Asamaki
麻蒔 立男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP20952181A priority Critical patent/JPS58113372A/en
Publication of JPS58113372A publication Critical patent/JPS58113372A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/028Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Thin Magnetic Films (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は引延可能な基板の両表面に薄膜を被着して成
る薄膜の被覆体やその製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin film coating formed by coating thin films on both surfaces of a stretchable substrate, and a method for manufacturing the same.

薄膜被覆体としては例えば高密度磁気テープなどの磁気
記録媒体のように、高度な平面性を要求される部品は極
めて多い。これらはその基板となるテープに微視的な凹
凸があるにもかかわらずその表面に粘度の高い液体を塗
布することにより所要の平面性を得ている。しかし、こ
れらの部品その他の部品においては高度な性能が必要と
なシ。
There are many thin-film coatings that require a high level of flatness, such as magnetic recording media such as high-density magnetic tapes. Although the tape serving as the substrate has microscopic irregularities, the required flatness is obtained by coating the surface with a highly viscous liquid. However, these and other parts require high performance.

従来のように液体に所要の材料を混入して塗布する方法
では所定の性能を得ることが出来なくなってきた。最近
ではこれに代って真空を用いた薄膜作成法が用いられて
いるが、基板の表面に存在する微視的な凹凸やしわのた
めに所要の平面を得ることが出来ない欠点があった。
It has become impossible to obtain the desired performance using the conventional method of mixing a required material into a liquid and applying the mixture. Recently, a thin film production method using vacuum has been used instead, but it has the drawback that it is impossible to obtain the required flat surface due to microscopic irregularities and wrinkles that exist on the surface of the substrate. .

この発明の目的はこれらの欠点を除いた平面性のよい被
覆体の提供にある。
An object of the present invention is to provide a covering with good flatness that eliminates these drawbacks.

この発明の別の目的は、ひっかきなどによる膜への亀裂
のできにくい薄膜被覆体の提供にある。
Another object of the present invention is to provide a thin film coating that is less prone to cracking due to scratches or the like.

本発明によれば2弾力のある基板とこの基板の少なくと
も一方の表面に薄膜を被着した薄膜被覆体において、前
記基板が外側に多軸方向に引っ張薄膜被覆体が得られる
。またとのような薄膜被覆体を得るのに基板を多軸方向
例引っ張った状態にしておいて薄膜被着を行なうように
した薄膜被覆体製造方法が得られる。
According to the present invention, in a thin film coated body comprising two resilient substrates and a thin film coated on at least one surface of the substrate, a thin film coated body is obtained in which the substrate is pulled outward in multiple axial directions. In addition, there is obtained a method for producing a thin film coating in which the thin film is deposited while the substrate is stretched in multiple directions in order to obtain a thin film coating such as the one shown in FIG.

次に図面を参照して詳細に説明する。Next, a detailed explanation will be given with reference to the drawings.

第1図は本発明の一実施例である薄膜被覆体の構成の断
面を示した図でちる。図において10は厚さ約20μm
のフィルムであるフロッピーディスクを示しておシ、1
1はその基板となる厚さ約20μmで1弾力があってど
ちらの方向にも引伸ばせるポリエステルフィルムを示し
、12と13は厚さ約1μmの金属磁性薄膜、たとえば
コバルトとクロ一ムの合金の薄膜、を示している。そし
て基板11は矢印16の方向に引っ張られて3%程度伸
びている状態になっておシ、一方薄膜12゜13は前記
の引っ張る力により矢印17の方向に圧縮方向の応力1
7を受けているが、基板11よシは剛体に近い性質を有
しているので、縮むことはない。つまシ両者は互いに支
持体になっている。
FIG. 1 is a diagram showing a cross section of the structure of a thin film covering according to an embodiment of the present invention. In the figure, 10 is approximately 20 μm thick
Show me a floppy disk with a film on it.
Reference numeral 1 indicates a polyester film having a thickness of about 20 μm that is elastic and can be stretched in either direction, and 12 and 13 indicate metal magnetic thin films with a thickness of about 1 μm, such as an alloy of cobalt and chromium. A thin film is shown. The substrate 11 is pulled in the direction of the arrow 16 and stretched by about 3%, while the thin films 12 and 13 are subjected to compressive stress 1 in the direction of the arrow 17 due to the pulling force.
However, since the substrate 11 and the like have properties similar to rigid bodies, they do not shrink. Both the tabs support each other.

上記のような構成において、基板11が若干伸びた状態
になっているのは上に説明したように製造中に多軸方向
に約3%引伸ばした状態で薄膜を被着したからである。
In the above configuration, the substrate 11 is in a slightly elongated state because, as explained above, the thin film was applied in a state in which it was elongated by about 3% in the multiaxial direction during manufacturing.

このためポリエステル膜の表面部にある小さな凹凸或い
は各方向のしわは広げられて平面に近くなる。すなわち
ポリエステル膜が極めて平面に近い状態で磁性金属薄膜
が形成されたことになる。また薄膜12と13は圧縮方
向の力を受けているので、張力が働いているときに比較
してひっかきに対して格段の強度を有している。前記の
表面部の良好なこととひっがきにうして強いことは固定
ディスクや7o、ビーディスクや磁気チーfカどの記録
媒体として極めて好ましい性質であって、単に再生音が
良いというだけでなく寿命も長くなるものである。なお
基板11の張力による伸びは上では3チとしたが、実験
によれば、材質や膜厚などにょシまちまちであるが。
Therefore, small irregularities or wrinkles in various directions on the surface of the polyester film are widened and become nearly flat. In other words, the magnetic metal thin film was formed with the polyester film being extremely flat. Furthermore, since the thin films 12 and 13 are subjected to a force in the compressive direction, they have much greater strength against scratches than when tension is applied. The above-mentioned good surface area and resistance to scratching are extremely desirable properties for recording media such as fixed disks, 7O disks, B disks, and magnetic chips. It also becomes longer. The elongation of the substrate 11 due to tension was assumed to be 3 inches above, but experiments have shown that it varies depending on the material, film thickness, etc.

大体1%程度で効果があられれる。伸びは大きくなれば
平面度は向上するが、張力を与える機構上の制約から、
Io%程度までが実用上有効である。
Approximately 1% is effective. The flatness improves as the elongation increases, but due to mechanical constraints that apply tension,
It is practically effective up to about Io%.

また基板フィルム11の厚さは5011m程度のものが
ある。更にテープのような場合は厚さが2μm程度にう
すい場合もある。
Further, the thickness of the substrate film 11 is approximately 5011 m. Furthermore, in the case of a tape, the thickness may be as thin as about 2 μm.

上記の説明は薄膜が12および13として基板フィルム
11の両表面に被着している場合に関するものであるが
、この代シに1図示はしてないが。
The above description relates to the case where the thin films 12 and 13 are applied to both surfaces of the substrate film 11, although one is not shown in this illustration.

片面だけ薄膜を被着したものでも同様の効果を呈するも
のである。たとえばふつうの磁気テープがこの類に属す
るものである。なおこのような構成のものは自由状態に
おけば成る程度まるまるか。
A similar effect can be obtained even when a thin film is applied on only one side. For example, ordinary magnetic tape belongs to this category. Furthermore, does something with this kind of configuration work as well as it does in a free state?

使用状態では弱い張力でもまっすぐになるので。When in use, it will straighten even with weak tension.

特に問題はない。なお以下の説明は特に断らない限シ先
に説明した第1図のままの構成のものについて説明する
ことにする。
There are no particular problems. In the following description, unless otherwise specified, the configuration will be explained as shown in FIG. 1 as described above.

第2図および第3図は本発明の他の実施例である薄膜被
覆体を製造するスノJ?ツタ装置の真空室内の構成の概
要およびその中のロールの上部とその上の薄膜の概要を
それぞれあられした図である。
FIGS. 2 and 3 show Suno J's method of manufacturing a thin film coating according to another embodiment of the present invention. FIG. 2 is a diagram showing an outline of the configuration inside the vacuum chamber of the ivy apparatus and an outline of the upper part of the roll and the thin film thereon.

なおチャンバーや真空ポンプなどは省略しである。Note that the chamber, vacuum pump, etc. are omitted.

以下第2図の装置の構成と動作を第1図および第3図を
併用して説明すると、10〜13は第1図と同じであり
、14と15は基体フィルム11および出来上った薄膜
被覆体10の送り方向をそれぞれ示す。20は基体フィ
ルム11と薄膜被覆体10の送シ機構であって、そのう
ち21と24は送りロール、22と23は水冷されたロ
ールを示す。26はローラ23刻された溝であシ、あと
に説明する。30は引っ張シ機構であって、31〜34
は送シロール、35は例えばゴムで出来たオーリング、
36はオーリングに張力を与えるだめのロールの移動機
構、37はオーリング35に張力を与え基板11を溝2
6にはめ込むことにより基板にロール22.23の中心
軸方向(図の左右方向)の張力を与えるだめの力の方向
を示す。
Below, the configuration and operation of the apparatus shown in FIG. 2 will be explained with reference to FIGS. 1 and 3. 10 to 13 are the same as in FIG. The feeding directions of the covering body 10 are shown respectively. 20 is a feeding mechanism for the base film 11 and the thin film coating 10, of which 21 and 24 are feeding rolls, and 22 and 23 are water-cooled rolls. 26 is a groove carved by the roller 23, which will be explained later. 30 is a tension mechanism; 31 to 34;
35 is an O-ring made of rubber,
36 is a roll moving mechanism that applies tension to the O-ring, and 37 applies tension to the O-ring 35 and moves the substrate 11 into the groove 2.
6 indicates the direction of the force that applies tension to the substrate in the direction of the central axis of the rolls 22 and 23 (in the left-right direction in the figure).

この溝26はこの実施例においては端部に1本設けであ
るが、ロール22.23の平面度がよい場合、滑って十
分々張力を与えることができないことがある。そうした
場合溝を何本も作ることが望ましい。基板11にはフィ
ルムの走行方向14→15にフィルムを引っ張る力とロ
ールの中心軸方向に働く張力の2軸方向に張力が与えら
れる。
In this embodiment, one groove 26 is provided at the end, but if the rolls 22 and 23 have good flatness, they may slip and may not be able to apply sufficient tension. In such cases, it is desirable to make multiple grooves. Tension is applied to the substrate 11 in two axial directions: a force that pulls the film in the film running direction 14→15, and a tension that acts in the central axis direction of the roll.

38a、38bはスパッタターゲット電極であるが。38a and 38b are sputter target electrodes.

ターゲット電源は省略しである。The target power supply is omitted.

この装置は普通のスパッタ装置と同様な方法で運転され
、ターゲット電極38aと38bに電力(直流あるいは
交流)が供給されスパッタが始まると2巻き出しロール
(図示してない)からポリエステルフィルム11が矢印
14の方向に送シ出され、ターグツ)381Lによシ1
2で示される薄膜を基板の表面に付着させる。薄膜が付
着した被覆体は更にターグツ)40bによシ13で示さ
れる薄膜を付着され、完成品である薄膜被覆体10とな
って矢印15の方向に送られ2図示してない巻取シロー
ルに巻き取られる。薄膜を付着させるときには前述のよ
うに基板フィルム11には基板の進行方向(矢印14.
15)とこれに直角の方向(ロール22.23の中心軸
方向)に張力が与えられている。したがって基板11の
表面すなわち薄膜12と13の表面は良い平滑度を保っ
ている。
This device is operated in the same manner as a normal sputtering device, and when power (DC or AC) is supplied to the target electrodes 38a and 38b and sputtering begins, the polyester film 11 is released from two unwinding rolls (not shown) by arrows. It is sent in the direction of 14, and is sent to 381L.
A thin film indicated by 2 is deposited on the surface of the substrate. The coated body to which the thin film has been attached is further coated with a thin film indicated by 13 by a roller 40b, and the finished product, the thin film coated body 10, is sent in the direction of the arrow 15 and placed on a winding roll (not shown). It is wound up. When attaching a thin film, as described above, the substrate film 11 is attached in the direction of movement of the substrate (arrow 14.
15) and a direction perpendicular to this (direction of the central axis of the rolls 22 and 23). Therefore, the surface of the substrate 11, that is, the surfaces of the thin films 12 and 13, maintains good smoothness.

出来上った薄膜被覆体10は、外部からの張力を除くと
、3層のうち基板11′は縮もうとするが。
In the completed thin film coating 10, when the external tension is removed, the substrate 11' of the three layers tends to shrink.

薄膜12と13があるために縮むことができない。Due to the presence of thin films 12 and 13, it cannot shrink.

このため基板16は引伸ばされた状態で張力16を受け
るが、薄膜12と13は応力17を受ける。
Therefore, the substrate 16 is subjected to a tension force 16 in a stretched state, while the thin films 12 and 13 are subjected to a stress 17.

したがって先に説明したような表面が平滑でひつかきき
ずのつきにくい薄膜被覆体が得られる。
Therefore, a thin film coating with a smooth surface and less prone to scratches as described above can be obtained.

第4図は本発明のさらに他の実施例における張力を与え
る機構の概要を示しである。この実施例においては、基
板フィルム11をチャック41によってつかみ、矢印4
11の方向に引張ることによシロール23の軸方向(図
の左右方向)の引張シを与える構成を示している。基板
の進行方向に引張ることとともに多軸方向の引張シが与
えられる。
FIG. 4 shows an outline of a mechanism for applying tension in still another embodiment of the present invention. In this embodiment, the substrate film 11 is gripped by the chuck 41 and the arrow 4
A configuration is shown in which tension is applied in the axial direction (left-right direction in the figure) of the seal roll 23 by pulling it in the direction 11. In addition to pulling in the direction in which the substrate travels, tension in multiple axial directions is applied.

第5図は本発明の別の実施例における張力を与える機構
の概要を示してる。この実施例には、基板11に接触す
る小さいロール42を軸の回シに矢印421の方向に回
転させ、基板11にロール23の軸方向の引張シカを与
えるようになっている。これによシ矢印43の方向(第
1図の14゜15の方向)に引張シながらスパッタすれ
ば、フィルム11は2軸(多軸)方向の張力を受けなが
らスパッタされる。
FIG. 5 schematically shows a tensioning mechanism in another embodiment of the invention. In this embodiment, a small roll 42 in contact with the substrate 11 is rotated in the direction of an arrow 421 on a rotating shaft to apply tension to the substrate 11 in the axial direction of the roll 23. If the film 11 is sputtered while being stretched in the direction of the arrow 43 (direction 14.degree. 15 in FIG. 1), the film 11 will be sputtered while being subjected to tension in biaxial (multiaxial) directions.

基板に多軸方向の張力を与えるには、フィルム状の基板
そのものに張力を与えてもよいことはいうまでもない。
It goes without saying that in order to apply tension in multiple axial directions to the substrate, tension may be applied to the film-like substrate itself.

以下その例を示す。An example is shown below.

第6図および第7図は本発明の更に別の実施例における
張力を与える1機構の上面図およびその一部をA A/
で切断した断面図をそれぞれあられしておシ、長く且つ
比較的丈夫なリブ44を基板フィルム11にフィルムの
幅方向(図の左右方向)に張力を与えながら接着剤か機
械的方法でと)っけたものである。そしてフィルムの移
動方向すなわち矢印43の方向に引張シながらスパッタ
を行なえ幌基板多軸方向に張力が与えられた状態になっ
ている薄膜被覆体を得るととが出来る。なおリブ44を
取付ける代シに基板11そのものを変質させてリプのよ
うな形にしてリプの代シにしてもよい。
FIGS. 6 and 7 show a top view and a portion of a mechanism for applying tension in a further embodiment of the present invention.
The long and relatively strong ribs 44 are attached to the substrate film 11 using an adhesive or mechanical method while applying tension in the width direction of the film (horizontal direction in the figure). It's a great thing. Then, sputtering is performed while being stretched in the direction of movement of the film, that is, in the direction of arrow 43, thereby obtaining a thin film covering in which tension is applied in the multiaxial directions of the hood substrate. Note that the substrate 11 itself may be altered in quality to form a lip-like shape as a substitute for attaching the ribs 44.

第8図は本発明の他の実施例における張力を与える機構
を示したもので、金具450基体フィルム11に触れる
部分45′と金具46の間にフィルム11をはさみ、金
具45の上部の弾力のある吊シ部45’で図で左右にひ
らく張力を与えるようになっている。
FIG. 8 shows a tension applying mechanism in another embodiment of the present invention, in which the film 11 is sandwiched between the metal fitting 450, the part 45' that touches the base film 11, and the metal fitting 46, and the elasticity of the upper part of the metal fitting 45 is A certain hanging portion 45' applies tension to the left and right as shown in the figure.

一部9図および第10図は本発明の更に他の実施例にお
ける張力を与える機構の上面図およびB B’の断面図
を示したもので、枠47と48を基体フィルム11をは
さんではめ込むことによって多軸方向の張力を得るよう
にしたものである。
Parts of FIG. 9 and FIG. 10 show a top view and a cross-sectional view of a mechanism for applying tension according to still another embodiment of the present invention, in which frames 47 and 48 are sandwiched between base films 11. By fitting it in, it is possible to obtain tension in multiple axial directions.

以上いくつかの実施例を挙げたが、これらは何ら限定的
な意味を持つものではなく、多数の変形が可能であるこ
とは云う迄もない。重要な点は2弾力のある基板に二軸
以上の多軸方向に適度に引張シながら薄膜を付着させる
ことにょシ、平面度のよい、ひっかきなどに強い被服体
を得ることである。その具体的な方法はここに述べる実
施例のみならずいろいろな方法が可能である薄膜を付着
させる場合でも、その方法や条件は従来知られているい
ろいろなものを使うことができる。
Although several embodiments have been given above, these are not meant to be limiting in any way, and it goes without saying that many modifications are possible. The important point is to attach a thin film to a resilient substrate while applying appropriate tension in two or more multiaxial directions, thereby obtaining a coated body with good flatness and resistance to scratches. The specific method is not limited to the embodiments described here, but various methods are possible.Even when depositing a thin film, various conventionally known methods and conditions can be used.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による薄膜被覆体の構成の断面図、第2
図は本発明の他の実施例である薄膜被覆体を製造装置の
スバ、り装置における真空装置内の構成の概要を示した
図、第3図は第2図の装置。 のうちのロール23の上部部分の一部断面図、第4図、
第5図、および第6図はいずれも本発明の他の実施例に
おける張力を与えるWの@要を示した図、第7図は第6
図の一部のA −A’断面図、第8図および第9図はい
ずれも半発明の別の実施例における張力を与える機構の
概要を示した図、第10図は第9図のB −B’断面図
をそれぞれあられしている。 記号の説明=10は薄膜被覆体、11は基体(フィルム
)、12と13は薄膜、14と15は引っ張シ方向を示
す矢印、20は送シ機構、21は送シロール、22と2
3は(水冷された)ロール。 26は溝、31−34は送シロール、35はオーリング
、36は移動機構、38はスパッタターゲット、41は
チャック、42はロール、43は引っ張シ方向を示す矢
印をそれぞれあられしている。 −4(
FIG. 1 is a sectional view of the structure of the thin film coating according to the present invention, and FIG.
The figure shows an outline of the internal structure of a vacuum device in a thin film coating manufacturing apparatus according to another embodiment of the present invention, and FIG. 3 shows the apparatus shown in FIG. 2. A partial sectional view of the upper part of the roll 23, FIG.
5 and 6 are diagrams showing the main points of W providing tension in other embodiments of the present invention, and FIG.
A-A' sectional view of a part of the figure, FIGS. 8 and 9 are diagrams showing an outline of the mechanism for applying tension in another embodiment of the semi-invention, and FIG. -B' cross-sectional views are shown respectively. Explanation of symbols = 10 is a thin film coating, 11 is a base (film), 12 and 13 are thin films, 14 and 15 are arrows indicating the direction of tension, 20 is a feeding mechanism, 21 is a feeding roll, 22 and 2
3 is a (water-cooled) roll. 26 is a groove, 31-34 is a feed roll, 35 is an O-ring, 36 is a moving mechanism, 38 is a sputter target, 41 is a chuck, 42 is a roll, and 43 is an arrow indicating the direction of tension. −4(

Claims (1)

【特許請求の範囲】 1、 弾力のある基板とこの基板の少々くとも一方の表
面に薄膜を被着した薄膜被覆体において。 前記基板が多軸方向に外側に引っ張られるように2、 
弾力のある基板の少なくとも一方の表面に薄膜を被着し
て薄膜被覆体を製造する方法において、前記薄膜を基板
表面上に被着するときに該基板を多軸方向に引っ張った
状態にしておいて被着することを特徴とする薄膜被覆体
製造方法。
[Claims] 1. A thin film coating comprising a resilient substrate and a thin film coated on at least one surface of the substrate. 2, such that the substrate is pulled outward in a multiaxial direction;
In a method for manufacturing a thin film coating by depositing a thin film on at least one surface of a resilient substrate, the substrate is stretched in multiple axes when the thin film is deposited on the surface of the substrate. A method for producing a thin film coating, characterized in that the coating is applied using a thin film.
JP20952181A 1981-12-26 1981-12-26 Thin film coating and manufacturing method thereof Pending JPS58113372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20952181A JPS58113372A (en) 1981-12-26 1981-12-26 Thin film coating and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20952181A JPS58113372A (en) 1981-12-26 1981-12-26 Thin film coating and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JPS58113372A true JPS58113372A (en) 1983-07-06

Family

ID=16574162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20952181A Pending JPS58113372A (en) 1981-12-26 1981-12-26 Thin film coating and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPS58113372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6564503B1 (en) 1999-05-18 2003-05-20 Elm, Inc. Apparatus for trapping and killing insects
CN112195441A (en) * 2020-09-28 2021-01-08 中国科学院宁波材料技术与工程研究所 Method for preparing flexible electronic/quantum circuit by liquid metal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6564503B1 (en) 1999-05-18 2003-05-20 Elm, Inc. Apparatus for trapping and killing insects
CN112195441A (en) * 2020-09-28 2021-01-08 中国科学院宁波材料技术与工程研究所 Method for preparing flexible electronic/quantum circuit by liquid metal

Similar Documents

Publication Publication Date Title
JP7173005B2 (en) magnetic recording medium
JPS58113372A (en) Thin film coating and manufacturing method thereof
JPH08249649A (en) Magnetic recording medium
US4555444A (en) Magnetic recording medium and method for manufacturing the same
JPH02108232A (en) Magnetic recording medium
JPH09141172A (en) Coating apparatus
JP2605846B2 (en) Polishing method for magnetic recording media
JPS61233429A (en) Sputtering device
JPH01321997A (en) Supercalender apparatus
JPH0479024A (en) Magnetic recording medium manufacturing method and device
JPH079701B2 (en) Magnetic disk
JP2819214B2 (en) Disc and method of manufacturing the same
JPH0737241A (en) Production of magnetic recording medium
JPH07284710A (en) Coating apparatus
JPH08193138A (en) Film for magnetic recording medium
JPH09141167A (en) Coating apparatus
JPH0938560A (en) Coating apparatus
JPS62247071A (en) Device for producing thin metallic film
JPH0223523A (en) Method and apparatus for producing magnetic recording medium
JPH0451889B2 (en)
JPH0985150A (en) Coating applicator
JPH1031818A (en) Production of magnetic recording medium
JP2005205824A (en) Polyester film roll and manufacturing method of magnetic recording medium
JPH05128511A (en) Manufacture of magnetic recording medium
JPH0785302B2 (en) Magnetic recording medium and manufacturing method thereof