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JPS58103990A - Table for laser working - Google Patents

Table for laser working

Info

Publication number
JPS58103990A
JPS58103990A JP56203909A JP20390981A JPS58103990A JP S58103990 A JPS58103990 A JP S58103990A JP 56203909 A JP56203909 A JP 56203909A JP 20390981 A JP20390981 A JP 20390981A JP S58103990 A JPS58103990 A JP S58103990A
Authority
JP
Japan
Prior art keywords
laser
energy
grooves
substrate
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56203909A
Other languages
Japanese (ja)
Inventor
Tetsuo Fujisawa
藤澤 哲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56203909A priority Critical patent/JPS58103990A/en
Publication of JPS58103990A publication Critical patent/JPS58103990A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To provide decreased height of a table, decreased reflected light to the work and improved durability of the table body by coating a laser absorbing material on the surface of a light resistant substrate which is so formed as to take many reflection times of laser beams. CONSTITUTION:V-grooves 12 having a specified angle in such a way that incident laser beams 11 repeat the reflection effective for absorption of energy are provided without any spacing on a substrate 10 made of copper or the like, whereby a table for laser working is formed. Heat resistant paint 13 is coated in the grooves 12 to absorb focused energy effectively. The work is held on the peak parts 14 formed by the grooves 12 and is subjected to cutting, etc. by the focused beams. By such construction the improvement in working characteristic owing to the considerable decrease in reflected energy is attained.

Description

【発明の詳細な説明】 本発明は、レーザビームの集束エネルギーを用いる加工
装置において、ワーク(被加工物)を積載するテーブル
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a table on which a workpiece is loaded in a processing apparatus that uses focused energy of a laser beam.

従来、レーザ加工におけるワークの積載テーブル(以下
、これ全加工用テーブルという)は、特に、切断・穴あ
けといったビームの集中エネルギーを利用する加工分野
においては、ワークの保持の他に、ビームのエネルギー
に対し耐久性のある材質・構造を有していることが必要
であった。
Conventionally, workpiece loading tables in laser processing (hereinafter referred to as "all-processing tables") have not only been used to hold the workpiece, but also to handle the energy of the beam, especially in processing fields that utilize concentrated beam energy, such as cutting and drilling. However, it was necessary to have a durable material and structure.

以下、従来の加工用テーブルの例を第1図にもとづき説
明する。
Hereinafter, an example of a conventional processing table will be explained based on FIG. 1.

この例は、金属板、樹脂等の切断に用いられる加工用テ
ーブルである。
This example is a processing table used for cutting metal plates, resin, etc.

レーザビーム1は集光レンズ2により集束され、焦点3
を結ぶ。ワーク4はその加工目的に応じ、焦点3との位
置関係が決定される。一般には、ビームエネルギーの有
効活用のため、ワーク4の表面あるいは内部に焦点3を
結ばせる。
A laser beam 1 is focused by a condensing lens 2 and has a focal point 3.
Tie. The positional relationship of the workpiece 4 with the focal point 3 is determined according to its processing purpose. Generally, the focal point 3 is placed on the surface or inside of the workpiece 4 in order to effectively utilize the beam energy.

加工用テーブルは、基板6とピン6よりなり、加工時の
反射光の影響を低減するため、基板6の材質、ピン6の
材質・寸法には制約がある。すなわち、ビン6の高さが
小さい場合、基板6よりの反射光がワーク4の裏面に照
射され、特に樹脂等加工に要するエネルギーが小さいワ
ークの場合には、仕上りに致命的な欠点となって現われ
る。
The processing table consists of a substrate 6 and pins 6, and in order to reduce the influence of reflected light during processing, there are restrictions on the material of the substrate 6 and the material and dimensions of the pins 6. In other words, if the height of the bottle 6 is small, the reflected light from the substrate 6 will be irradiated onto the back surface of the workpiece 4, which will be a fatal flaw in the finish, especially for workpieces that require little energy to process, such as resin. appear.

したがって、ビン6の高さを大きくするとともに、基板
6の材質も反射率の低いものとする必要があった。しか
し、これは基板6へのエネルギー吸収を意味し、耐久性
の点からみれば決して好ましいものではない。
Therefore, it was necessary to increase the height of the bottle 6 and to make the material of the substrate 6 low in reflectance. However, this means that energy is absorbed into the substrate 6, which is by no means preferable from the viewpoint of durability.

また、ピン6は直接その上にワーク4を積載する構造上
、点支持に近い形状とし、ワーク4への反射光の影響を
極力少くするとともに、レーザビーム1の集中エネルギ
ーによって、ピン6の先端部が容易に変形しない形状・
材質でなければならない。これは点支持構造を必要とす
る条件とは相反[7た内容である。
In addition, the pin 6 has a shape similar to a point support because the work 4 is directly loaded on it, and the influence of reflected light on the work 4 is reduced as much as possible. A shape that prevents parts from deforming easily.
It must be the material. This is contrary to the condition that requires a point support structure.

以上のように、従来の加工用テーブルは、高さ寸法、ワ
ーク仕上げ精度、耐久性すなわち平面保持性のうちいず
れかを犠牲にした構造のものであった○ 本発明け、上記の欠点を改善するためになされたもので
あり、テーブル高4さの低減、ワークへの反射光の低減
、テーブル本体の耐久性の向上を目的としたものである
As mentioned above, conventional machining tables had a structure that sacrificed one of the following: height dimension, workpiece finishing accuracy, and durability, that is, flatness retention.The present invention improves the above drawbacks. The purpose of this design is to reduce the table height, reduce the amount of light reflected on the workpiece, and improve the durability of the table body.

そして本発明における加工用テーブルは、レーザビーム
のエネルギーを有効に吸収する形状・構造を採用したこ
とを特徴とする。
The processing table according to the present invention is characterized by adopting a shape and structure that effectively absorbs the energy of the laser beam.

すなわち、第2図に示すように、頂角θの円錐体に成形
された冷却ブロック7に、レーザビーム8が入射する場
合を考える。ブロック7の材質は。
That is, as shown in FIG. 2, consider the case where the laser beam 8 is incident on the cooling block 7 shaped like a cone with an apex angle θ. What is the material of block 7?

使用するレーザの波長に対し高い反射率、高い熱伝導度
および熱拡散率を有するもの、例えば銅などを選定使用
し、耐久性を持たせる。レーザビームの照射面には、エ
ネルギー吸収を高める目的で耐熱性のある5例えばカー
ボン系塗料9を塗布する0 照射面におけるレーザビームの反射率をRとすると、1
回反射後のエネルギーは、元のエネルギーをΣとした場
合 pn 、 、で表わされる。
A material with high reflectance, high thermal conductivity, and thermal diffusivity for the wavelength of the laser used, such as copper, is selected and used to ensure durability. Heat-resistant paint 5, for example, carbon-based paint 9, is applied to the laser beam irradiation surface in order to increase energy absorption.0 If the reflectance of the laser beam on the irradiation surface is R, then 1
The energy after the second reflection is expressed as pn, where the original energy is Σ.

いま仮りに頂角θを20’にとると、第3図に示すよう
に、レーザビームが円錘体中心軸と平行に入射した場合
、反射を繰返し再び外部に放出されるまでの反射回数は
9回となる。
Assuming that the apex angle θ is 20', as shown in Figure 3, if the laser beam is incident parallel to the central axis of the cone, the number of times it will be reflected until it is emitted to the outside again is This will be the 9th time.

反射率R=0.2と仮定すると、戻ってくるレーザビー
ムのエネルギーは0.2・Eすなわち6,12 Xl 
o−’にとなって全く問題とならない程度に減衰するこ
とがわかる。
Assuming that the reflectance R = 0.2, the energy of the returning laser beam is 0.2·E or 6,12 Xl
It can be seen that the attenuation becomes o-' and is attenuated to such an extent that it does not pose a problem at all.

この場合、ビームの反射回数は頂角θのみに関係し、寸
法とは無関係であるので、レーザビームの入射方向の奥
行寸法を任意に設定することが可能となる。
In this case, the number of times the beam is reflected is related only to the apex angle θ and has nothing to do with the dimensions, so it is possible to arbitrarily set the depth dimension in the incident direction of the laser beam.

以上のように、反射回数を多くとるように形状を選び、
かつビーム照射部を耐光性の良い材質を基板に、エネル
ギー吸収を高める耐熱塗料を塗布した構造とする。
As mentioned above, choose the shape to increase the number of reflections,
In addition, the beam irradiation part has a structure in which the substrate is made of a material with good light resistance and is coated with heat-resistant paint to increase energy absorption.

以下本発明による一実施例を第4図にもとづき説明する
An embodiment of the present invention will be described below based on FIG. 4.

第4図は、使用するレーザに対し高い耐光性を有する材
質例えば銅などで作られた基板1o上に入射レーザビー
ム11がエネルギー吸収に有効な反射を繰返えすように
、一定の角度を有するV形溝12を隙間なく設けたもの
である。V形溝12には、エネルギーを有効に吸収させ
る目的で、耐熱性塗料13が塗布されている。
In FIG. 4, the incident laser beam 11 has a certain angle so that the incident laser beam 11 is repeatedly reflected onto a substrate 1o made of a material such as copper that has high light resistance against the laser used. The V-shaped grooves 12 are provided without gaps. A heat-resistant paint 13 is applied to the V-shaped groove 12 for the purpose of effectively absorbing energy.

寸たレーザの出力、波長等に応じ、基板1oを冷却する
ことにより、一層の耐久性向上が図れる。
By cooling the substrate 1o according to the laser output, wavelength, etc., the durability can be further improved.

ワークへの反射光の影響については、頂部14にてワー
クを保持するため、集束ビームと頂部14とが一致しな
い限り問題とならない。頂部の耐久性については、耐光
性の高い材、質使用、熱容量の拡大等により、従来より
信頼性の高いものとなっている。また、V形溝12のピ
ッチを小さくすることにより、基板10の高さを低減す
ることが可能である。
Regarding the influence of reflected light on the workpiece, since the workpiece is held at the top 14, there is no problem unless the focused beam and the top 14 coincide. The durability of the top part is more reliable than before due to the use of materials with high light resistance, the use of quality materials, and increased heat capacity. Furthermore, by reducing the pitch of the V-shaped grooves 12, it is possible to reduce the height of the substrate 10.

以上のような構成よりなる本発明のレーザ加工用テーブ
ルによれば、次のような効果がある。
According to the laser processing table of the present invention having the above configuration, the following effects can be achieved.

(1)  レーザビームの反射エネルギーの大幅低減に
よる加工性状の改善が図れる。
(1) Processing properties can be improved by significantly reducing the reflected energy of the laser beam.

(2)加工用テーブルの高さの低減による、使用範囲の
拡大が図れる。
(2) The range of use can be expanded by reducing the height of the processing table.

(3)加工用テーブル本体の耐久性の大幅向上が期待で
きる。
(3) A significant improvement in the durability of the processing table body can be expected.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はレーザ加工の説明を付加した従来の加工用テー
ブルの正面図、第2図および第3図は本発明におけるレ
ーザビームの反射の説明図、第4図(イ)、(ロ)、(
ハ)は本発明によるレーザ加工用テープルの平面図と一
部切欠正面図と側面図である。 10・・・・・・耐光性基板、11・・・・・・レーザ
ビーム、12・・・・・・V形溝、13・・・・・・レ
ーザ吸収体(耐熱性塗料)、14・・・・・・頂部。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第2図 第3図 10’ 第4図 IΔ
Fig. 1 is a front view of a conventional processing table with an explanation of laser processing added, Figs. 2 and 3 are illustrations of reflection of a laser beam in the present invention, Figs. 4 (a), (b), (
C) is a plan view, a partially cutaway front view, and a side view of the table for laser processing according to the present invention. 10... Light-resistant substrate, 11... Laser beam, 12... V-shaped groove, 13... Laser absorber (heat-resistant paint), 14... ...Top. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
Figure 2 Figure 3 Figure 10' Figure 4 IΔ

Claims (2)

【特許請求の範囲】[Claims] (1)表面をレーザビームの反射回数の多い形状に成型
した耐光性基板の前記表面にレーザ吸収体を塗布形成し
てなるレーザ加工用テーブル。
(1) A laser processing table formed by coating a laser absorber on the surface of a light-resistant substrate whose surface is shaped into a shape that allows a large number of laser beam reflections.
(2)耐光性基板として銅板を用い、その表面にV形溝
を形成し、その表面に耐熱性塗料を塗布形成してなる特
許請求の範囲第(1)項に記載のレーザ加工用テーブル
(2) A laser processing table as set forth in claim (1), wherein a copper plate is used as the light-resistant substrate, a V-shaped groove is formed on the surface of the copper plate, and a heat-resistant paint is applied to the surface.
JP56203909A 1981-12-17 1981-12-17 Table for laser working Pending JPS58103990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56203909A JPS58103990A (en) 1981-12-17 1981-12-17 Table for laser working

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56203909A JPS58103990A (en) 1981-12-17 1981-12-17 Table for laser working

Publications (1)

Publication Number Publication Date
JPS58103990A true JPS58103990A (en) 1983-06-21

Family

ID=16481702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203909A Pending JPS58103990A (en) 1981-12-17 1981-12-17 Table for laser working

Country Status (1)

Country Link
JP (1) JPS58103990A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080086U (en) * 1983-11-02 1985-06-04 三菱電機株式会社 Laser processing machine
JPS61200686U (en) * 1985-05-30 1986-12-16
JPS61200685U (en) * 1985-05-30 1986-12-16
JPH0342192A (en) * 1989-07-10 1991-02-22 Mitsubishi Electric Corp Laser beam machine
JPH03234394A (en) * 1990-02-08 1991-10-18 Honda Motor Co Ltd Work supporting member for welding machine
JPH03281084A (en) * 1990-03-23 1991-12-11 Juki Corp Support for workpiece of laser cutting machine
JP2008290123A (en) * 2007-05-25 2008-12-04 Shibaura Mechatronics Corp Laser processing equipment
US7847215B2 (en) * 2005-09-06 2010-12-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping in a cutting beam processing machine
JP2013000753A (en) * 2011-06-13 2013-01-07 Universal Seikan Kk Machined material fixing jig, laser processing device, and method of manufacturing sleeve printing plate
JP2016172271A (en) * 2015-03-17 2016-09-29 株式会社デンソー Laser processing device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080086U (en) * 1983-11-02 1985-06-04 三菱電機株式会社 Laser processing machine
JPS61200686U (en) * 1985-05-30 1986-12-16
JPS61200685U (en) * 1985-05-30 1986-12-16
JPH0342192A (en) * 1989-07-10 1991-02-22 Mitsubishi Electric Corp Laser beam machine
JPH03234394A (en) * 1990-02-08 1991-10-18 Honda Motor Co Ltd Work supporting member for welding machine
JPH03281084A (en) * 1990-03-23 1991-12-11 Juki Corp Support for workpiece of laser cutting machine
US7847215B2 (en) * 2005-09-06 2010-12-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping in a cutting beam processing machine
JP2008290123A (en) * 2007-05-25 2008-12-04 Shibaura Mechatronics Corp Laser processing equipment
JP2013000753A (en) * 2011-06-13 2013-01-07 Universal Seikan Kk Machined material fixing jig, laser processing device, and method of manufacturing sleeve printing plate
JP2016172271A (en) * 2015-03-17 2016-09-29 株式会社デンソー Laser processing device

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