JPS58102595A - Electric circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to an electric circuit board.

In recent years, in order to provide high-density electrical circuit components on a printed circuit board, a method has been devised in which a board having a specific number of electrical circuit components is inserted into a hole provided in a motherboard, and then the two are connected by soldering.

The method will be explained below with reference to the drawings.

FIG. 1 shows a side view of a board 1 inserted into a hole in a mother board, which will be described later. In the figure, reference numeral 2 denotes a hard support plate made of metal such as aluminum for heat dissipation when the electric component is an integrated circuit, which will be described later, and 3 is a flexible support plate bonded to the hard support plate 2 with an adhesive 4. The printed wiring board 6 is various electrical components connected to the printed wiring board 3 at solder joints 6.

The substrate 1 configured as described above is point 1! The rose is bent around A, as shown in Figure 2. ! ! The printed wiring of the board 1 is inserted into the hole of the mother board 8 which has the printed wiring part 7 on the bottom surface, and then immersed in a soldering tank to form the soldering joint part 9. However, in the above-described configuration, the board 1 is connected to the wiring section 7 of the mother board 8.
When forming the solder joint 9 after inserting the solder into the hole, since the hard support plate 2 is made of metal, the heat of the solder tank is conducted in a short time, so that the solder joint 6 formed earlier is No.1
This has the disadvantage that the solder is remelted and the electrical component 6 falls off the board 1.

In view of the above-mentioned drawbacks, the present invention includes providing a hole in the hard support plate of the first substrate.The first substrate is inserted into the hole of the second substrate. Even when wiring is connected to the second board by solder, the heat of the solder is conducted to the solder joint of the electrical component soldered to the first board through the hole provided in the first board. An object of the present invention is to provide an electric circuit board that can prevent such problems.

An embodiment of the present invention will be described below with reference to side views.

FIG. 3 shows four sides of a board 1a constituting an electric circuit board in an embodiment of the present invention.

In the figure, 2 is a rigid support plate made of metal such as aluminum, 3 is a flexible printed wiring board, 4 is an adhesive, 6 is an electrical component,
Reference numeral 6 denotes a solder joint, which has the same structure as the board 1 shown in FIG. The difference from the structure of the substrate 1 shown in FIG.
0, 11, 12° 13, two on each side, are provided outside the region B where the electrical components 6 are disposed.

The board 1a configured as described above is bent along the dotted line, and as shown in FIG. , by immersing it in a solder bath and providing solder joints 9, the printed wiring board 3 of the board 1a is connected to the mother board 8.
Connect and fix to the wiring section 7 of. Now, when the board 1a is immersed in a solder tank, the heat from the solder tank is conducted to the metal hard support plate 2, but when the board 1a is bent around the dotted line A, the holes 10, 11, 12, and 13, and the elongated hole 14 prevents heat from the solder bath from being conducted to the region B where the electrical component 6 is disposed, and prevents the solder in the solder joint 6 from remelting. It can be prevented.

In addition, when providing the solder joint part 9 with the structure explained in FIG. 1 and FIG. 2, the temperature rise characteristic of the flexible printed wiring board 3 at points C and D of the board 1 shown in FIG. The measurement results were as shown in FIG. on the other hand,
In this embodiment, the position is the same as that in FIG.
The temperature rise characteristics of the flexible printed wiring board 3 were measured at points C' and D' shown in the figure, and the results were as shown in FIG. As is clear from comparing Figures 6 and 7, for example, at point 0, there is a difference of about 30 degrees when immersed in the No-Da tank for 3 seconds, and a difference of about 40 degrees when immersed for 6 seconds. When you get the effect, you can do it.

As described above, the holes 10 and 11°12.1 are formed in the hard support plate 2.
3, even if the solder joint 9 is immersed in the solder bath, the elongated hole 14 formed by the holes 10, 11, 12, 13 prevents heat conduction from the solder bath, and - It is possible to prevent the solder in the solder joint portion 6 from re-melting.

In this embodiment, the substrate 1a is formed by bending, and the hole portions 10, 11, 12, and 13 form two elongated holes, but the substrate 1a is not limited to being formed by bending. In addition, the holes 1o and 711.12.13 are not necessarily hardened so that they form two long holes when bent.
．． 0,11. and 12.14 may be shifted in a stepped manner. Further, two holes 10, 11, 12, and 13 are provided at two places on the left and right sides, but the number may be any number.As described above, the present invention provides holes in the hard support plate of the first substrate. By providing the first board, the first board is inserted into the hole of the second board, and the first board is inserted into the hole of the second board. Even if the wiring is connected to the second board by the solder, the hole provided in the first board allows the heat of the solder to be transferred to the electrical components connected to the first board by the solder. In order to reduce heat conduction to the solder joint, re-melting of the solder joint can be prevented,
Its practical effects are as great as moxibustion.

[Brief Description of the Drawings] Figures 1 and 2 are cross-sectional views of a conventional electric circuit board, Figure 3 is a cross-sectional view of a board constituting an electric circuit board according to an embodiment of the present invention, and Figure 4 is a cross-sectional view of a circuit board constituting an electric circuit board according to an embodiment of the present invention. FIG. 6 is a plan view of the same rigid support plate, and FIG. 6 is a partial sectional view of an electric circuit board in an embodiment of the present invention.
Figure 6.7 is a temperature characteristic diagram. 1a...Substrate, 2...Hard support plate, 3
...Flexible printed wiring board, 6...Electrical components,
6...Solder joint, 8...Mother board, 10, 11°1213...Hole, 14...
...Long hole. Name of agent: Patent attorney Toshio Nakao and 1 other person11
11 Figure Δ Figure 3 Figure 5 Figure 6 Figure 7 444 Set

Claims (1)

[Claims] (1) A wiring board is provided on a hard support plate having a hole near one end, and a first board to which electrical components are solder-connected is inserted into the wiring board, and the first board is inserted into the wiring board. and a second board having a hole for wiring connection to the first board, and inserting one end of the first board having the hole into the hole of the second board. , the above-mentioned No. 1. Electric circuit board 0 formed by wiring connection to a second board using a solder.