JPS58101447A - Cooling device for electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling device for electronic components temporarily attached to a print.

In recent years, rapid progress has been made in medium- to large-scale integrated circuits.
However, the mounting density on printed boards and the mounting density If of electronic devices constructed by arranging several printed boards in parallel are becoming higher year by year.

As mounting WIk improves, processing of heat generated by electronic components becomes a major issue as reliability improves.

Conventionally, in electronic devices with such high packaging density, #i
A forced air cooling method is used in which multiple plates are installed with the screw parts attached, and the parts are cooled by blowing air directly onto them using a fan or the like.

On the other hand, the environment in which electronic devices are placed ranges from an empty room to an electrical room.
Things are getting worse from the electrical room to the field.

If the above-mentioned forced air cooling method is employed in such a bad environment, dust in the air may adhere to the bottle portion of components such as integrated circuits, causing short circuits. In addition, when used in an il environment where corrosive gas exists, the pin part corrodes and becomes thinner, and eventually the fi
Unexpected accidents such as disappearances have also occurred.

As a way to solve these problems, research has been conducted on coating agents for printed circuit boards and components coated with Kli on the substrate, and environmentally resistant coating agents have also been developed.

However, it has practical drawbacks such as the inability to replace parts because the coating is thick and hard, so it is not necessarily the same.

As described above, in electronic devices used in the field or in general electrical equipment, the direct forced air cooling method in which air is directly applied to the surface of components using a fan or the like is viewed as problematic from the viewpoint of reliability.

KI+ to solve the above-mentioned problem in direct air cooling system
4il! Cooling method: Ruru 0 Indirect cooling method: 1k
It is made of T-Aluo wood and is housed in a nine-box body, which is cooled by blowing air through the box using a fan or the like.

However, this indirect cooling system generally has poor cooling efficiency due to the presence of air with poor thermal conductivity in the box circle. It was. Another solution method is a fanless self-cooling system that dissipates heat without using it. In this self-cooling method, heat is radiated by natural convection from the surface of each component by lowering the backing device of the component, but the heat radiating area of the component is limited by @Rigame9. Particularly in the case of components that consume a large amount of power, the actual situation is that sufficient heat dissipation cannot be achieved. In the natural cooling system, the cooling efficiency is poor because the parts essentially have low atmospheric resistance in relation to natural fiK, which impedes the relation to fL'fr, and the air flow due to natural convection does not flow uniformly over each component surface. 6 for a reason. 9. Since the natural cooling system does not use a fan, the parts are not exposed to strong wind directly, but one part is in direct contact with the atmosphere, so #! +18 Accumulation of dust from the environment becomes unavoidable.

The present invention has been made to address the above-mentioned problems, and its object is to provide a cooling device for electronic components that can efficiently dissipate heat without causing failure of the electronic components even in a bad environment.

The feature of the present invention is that a heat dissipation plate is disposed on one or both sides of a printed board on which electronic components are layered, and a gel-like conductor in the form of a flat plate with good thermal conductivity and elasticity is provided between the heat dissipation plate and the printed board. Thermal mass t - Closely intervening and in contact with a specific electronic component Around the electronic component facing the opposing gel heat transfer medium and heat sink [surrounding 3 parts adjacent to the specific electronic component] The purpose is to prevent the heat generated from being transferred to specific electronic components.

Hereinafter, one embodiment of the present invention shown in Figs. 741 to 8 will be described in detail.

In Figures 1 to 6, 1 is a printed circuit board.

The electronic component 2 is attached to the - side, and the bottle portion protrudes from the other side. la is the plug part of the printed circuit board. Heat dissipation plates 3&, 3b are arranged on both sides of the pudding) Iil. Heat dissipation plates am, abti are made of aluminum or copper plate with good thermal conductivity in order to efficiently conduct and uniformize the heat in the vicinity of components that generate a large amount of heat to the heat dissipation plate rki. Heat sink 3a.

Supported by 5 bridle screws 8 and 4 m
.

4bKliII is added. The supports 41, 4b4C are provided with round grooves 5m, 5b for guiding and fixing the printed circuit board ik. t port) 41.4b is the heat sink 3m, 3b
The printed circuit board shown in Figure 1 is attached to the R connector, which is used as a guide when inserting it into the PUI electronic device housing.

6b is a gel-like heat transfer medium formed in a flat shape on the opposing surface of the board 11&f13&, 3b (D print) and adhered.It has excellent thermal conductivity and is flexible so that the parts 2t do not roll up when pressed against the 11 item 2. have sex. As the gel-like heat transfer medium @&, @b, silicon gel is typically used. Gel heat transfer medium 4m
, @b is a rounded type that is attached to the printed circuit board 1 and efficiently transmits the heat of the good electronic component 2 to the heat sinks 3m and 3b.
As shown in the figure, the thickness is such that it always comes into close contact with the electronic component 2. As shown in FIGS. 4 to 6, a slit 11 is provided in the heat transfer medium 6a and the heat sink 3&, which are in contact with a specific electronic component 2 km, so as to surround the opposing electronic component. The heat generating part 11 generates little heat and is provided to prevent the heat generated by other parts from being transmitted to parts that are weak against heat. Finally, the gel-like heat transfer medium 6b adhesively formed on the old heating plate 3b is provided with relief grooves 7 during compressive deformation, as shown in Figure IIEa. A front panel 9 is integrally connected to the printed circuit board l.

FIG. 6 is a perspective view showing a part of an electronic device constructed by arranging a plurality of electronic devices in parallel on the printed board unit Pu shown in FIG.

In the figure, each printed circuit board (Yue) PUFi empty 11
10 are provided and arranged in parallel 9. This space 1110 is configured so that air can flow as shown by the arrow. The air flow may be by natural convection or by a fan, and either way the cooling effect will be improved.

Since the embodiment of the present invention has the above-described configuration, the heat generated from the electronic component 2 is radiated through the gel-like heat transfer media 41m and 6bf. Heat sink 3m, a
The bOIjj product is several times larger than the total surface area of the parts because of the required spacing between the electronic parts 2 and the print board 1jlK. Therefore, it becomes difficult to properly dissipate heat.

Moreover, since the heat dissipating plates 3m and 3b are made of a material that has good thermal conductivity, the temperature distribution is made uniform over the entire surface even if there are parts that generate a large amount of heat locally. Therefore, when considering a component that generates a large amount of heat, the heat dissipation area becomes extremely large in terms of 5 equivalents, resulting in an extremely good heat dissipation effect.

Further, when heat is radiated in this manner, the parts 2 that generate little heat and are weak against heat are insulated by the slits 11, so that the hot weak parts can be kept.

Heat radiation from the heat sinks 3m and 3b is done by natural convection from their sides as shown in Figure 46, but compared to the conventional self-cooling system, heat radiation [because the heat radiation surfaces of 3m and 3b are smooth, There is less resistance to air flow, and under the same conditions, the wind speed and amount of heat dissipation are increased, which further improves cooling efficiency.

On the other hand, according to the present invention, the R1 part 2 is not directly exposed to the atmosphere, so dust does not accumulate on the part even in a bad environment, and the bottle part is not corroded by corrosive gas.

In addition, in the above-mentioned implementation, the gel heat transfer medium is 5 m, (
lbt-heat dissipation ffL38, 3bK adhesive Lf type jil printed circuit board 1 can be formed using a printing press, compared to this method, which is formed by filling a gel-like heat transfer medium onto the printed circuit board. .

It eliminates the need to prevent resin from leaking when the lid is closed, making it easy to manufacture.

As explained above, one aspect of the present invention is the heat generation t-m of electronic components.
Heat is radiated to the heat sink through a gel-like heat transfer medium with good conductivity, and even if the electronic components are covered with the gel-like heat transfer medium, heat dissipation is good without causing failure of the electronic components. can be done.

Togae 1: Electronic components that generate little heat and are sensitive to heat are insulated from other electronic components by slits.

It can protect electronic components that are sensitive to heat.

In addition, in the above-mentioned implementation row, heat sinks are arranged on both sides of the printed circuit board, but in cases where there is no intermission of corrosive gas, or furthermore, when the heat generation in the bottle part is small, the heat sink is placed on both sides of the printed circuit board. Of course, it is also possible to arrange the heat dissipation plate only at 1 and interpose the gel-like heat transfer medium therebetween.

First, it is clear that the heat dissipation effect klLK* can be improved by providing cooling fins on the heat dissipation plate.

[Brief explanation of the drawing]

1wA is a perspective view showing one actual row of rows of the present invention, and FIG. 2 is a cross-sectional view of A' in FIG. 1. Figure 3 shows the BIS in Figure 2.
Enlarged view, Figure 4 is a perspective view of the heat sink, Figure 5 is the x in Figure 4.
-x' sectional view, Fig. 6 is the Y-Y'm sectional view of Fig. 14, Fig. 7
The figure is an exploded perspective view of FIG. 1, and FIG. 8 is a perspective view showing one row of cooling states according to the present invention. 1... Printed circuit board, 2... Electronic components, 3... Heat sink.

Claims (1)

[Scope of Claims] 1.Print) A high-quality electronic component mounted on the printed board and a heat sink disposed on both sides of the printed board are formed by adhering to the opposite surface of the printed board of the heat sink. Equipped with a gel-like heat transfer medium with excellent thermal conductivity. The gel heat transfer medium in the heat sink is arranged so as to be in close contact with the electronic component, and a slit is provided to surround the gel heat transfer medium that contacts and faces a specific electronic component and the electronic component that faces the heat sink. “A cooling device for electronic components.