JPS579894A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPS579894A JPS579894A JP8227380A JP8227380A JPS579894A JP S579894 A JPS579894 A JP S579894A JP 8227380 A JP8227380 A JP 8227380A JP 8227380 A JP8227380 A JP 8227380A JP S579894 A JPS579894 A JP S579894A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- pipe
- good
- masking jig
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To partially plate a metal having good adhesiveness and good quality with good accuracy by pressing a special masking jig containing electrodes therein to a body to be plated, and conducting electricity while flowing a plating soln. to the inside of the masking jig.
CONSTITUTION: A masking jig 2 having an inside pipe 3 and an inside pipe 4 and using an electrical insulator material is pressed and touched to the plating part of a body 1 to be plated by way of a packing 6. The body 1 is supported by a supporting table 8 in a manner as to leave no spacings by way of a plastic object 7. An electrode 5 is provided near the tip end of the jig 2 and is used as the counter electrode for the body 1. Various kinds of pretreating solns., a plating soln. or rinsing water is introduced from a storage tank through the pipe 4 onto the plating surface, thence it is returned into the storage tank through the pipe 3. Thereby, the partial plating is accomplished economically with good productivity.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8227380A JPS579894A (en) | 1980-06-18 | 1980-06-18 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8227380A JPS579894A (en) | 1980-06-18 | 1980-06-18 | Partial plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS579894A true JPS579894A (en) | 1982-01-19 |
Family
ID=13769871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8227380A Pending JPS579894A (en) | 1980-06-18 | 1980-06-18 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS579894A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5032234A (en) * | 1988-12-20 | 1991-07-16 | Minolta Camera Kabushiki Kaisha | Process for plating a printed circuit board |
| KR20030083905A (en) * | 2002-04-23 | 2003-11-01 | (주)에스티디 | Method And Apparatus For Partial Plating On A Surface Or A Section Of Pure Metal Or Alloys |
| EP2085503A1 (en) * | 2008-01-31 | 2009-08-05 | HDO -Druckguss- und Oberflächentechnik GmbH | Method and device for producing components |
| JP2009270182A (en) * | 2008-05-12 | 2009-11-19 | Suzuki Motor Corp | Plating treatment line |
| JP4828417B2 (en) * | 2003-06-27 | 2011-11-30 | ラム リサーチ コーポレーション | Electroplating equipment |
| WO2021177035A1 (en) * | 2020-03-02 | 2021-09-10 | 東京エレクトロン株式会社 | Plating treatment device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508025A (en) * | 1973-05-25 | 1975-01-28 | ||
| JPS5125434A (en) * | 1974-08-28 | 1976-03-02 | Inoue Japax Res | RENZOKUMET SUKISOCHI |
| JPS5126642A (en) * | 1974-08-29 | 1976-03-05 | Inoue Japax Res | METSUKIHOHO |
| JPS5127822A (en) * | 1974-09-02 | 1976-03-09 | Inoue Japax Res | METSUKISOCHI |
| JPS5274536A (en) * | 1975-11-17 | 1977-06-22 | Schering Ag | Process and apparatus for selectively plating metals |
-
1980
- 1980-06-18 JP JP8227380A patent/JPS579894A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508025A (en) * | 1973-05-25 | 1975-01-28 | ||
| JPS5125434A (en) * | 1974-08-28 | 1976-03-02 | Inoue Japax Res | RENZOKUMET SUKISOCHI |
| JPS5126642A (en) * | 1974-08-29 | 1976-03-05 | Inoue Japax Res | METSUKIHOHO |
| JPS5127822A (en) * | 1974-09-02 | 1976-03-09 | Inoue Japax Res | METSUKISOCHI |
| JPS5274536A (en) * | 1975-11-17 | 1977-06-22 | Schering Ag | Process and apparatus for selectively plating metals |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5032234A (en) * | 1988-12-20 | 1991-07-16 | Minolta Camera Kabushiki Kaisha | Process for plating a printed circuit board |
| KR20030083905A (en) * | 2002-04-23 | 2003-11-01 | (주)에스티디 | Method And Apparatus For Partial Plating On A Surface Or A Section Of Pure Metal Or Alloys |
| JP4828417B2 (en) * | 2003-06-27 | 2011-11-30 | ラム リサーチ コーポレーション | Electroplating equipment |
| EP2085503A1 (en) * | 2008-01-31 | 2009-08-05 | HDO -Druckguss- und Oberflächentechnik GmbH | Method and device for producing components |
| JP2009270182A (en) * | 2008-05-12 | 2009-11-19 | Suzuki Motor Corp | Plating treatment line |
| WO2021177035A1 (en) * | 2020-03-02 | 2021-09-10 | 東京エレクトロン株式会社 | Plating treatment device |
| JPWO2021177035A1 (en) * | 2020-03-02 | 2021-09-10 |
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