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JPS5797642A - Adjustment of pick up needle - Google Patents

Adjustment of pick up needle

Info

Publication number
JPS5797642A
JPS5797642A JP17505680A JP17505680A JPS5797642A JP S5797642 A JPS5797642 A JP S5797642A JP 17505680 A JP17505680 A JP 17505680A JP 17505680 A JP17505680 A JP 17505680A JP S5797642 A JPS5797642 A JP S5797642A
Authority
JP
Japan
Prior art keywords
needle
pick
adjustment
wafer sheet
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17505680A
Other languages
Japanese (ja)
Inventor
Yoshimitsu Kushima
Hisaaki Kojima
Masao Yamazaki
Masashi Nishizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Sharp Corp
Original Assignee
Shinkawa Ltd
Sharp Corp
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Sharp Corp, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP17505680A priority Critical patent/JPS5797642A/en
Publication of JPS5797642A publication Critical patent/JPS5797642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To enable to regulate precisely protruding quantity, centering of a pick up needle to separate a die on a wafer sheet by a method wherein the pick up needle is adjusted in the X and Y directions by a graduated microscope being provided with a scale in the direction perpendicular to the plane. CONSTITUTION:The pick up needle 8 and a pick up collet 9 are provided to separate the die on the wafer sheet 1. When the wafer sheet 1 is fixed, the graduated microscope being provided with the scale in the direction perpendicular to the X and Y directions making a right angle on the plane is equipped to a holding fittings (not shown) so as to enable to monitor the positional relation of tip ends thereof. The lengthwise directional line 22 of the graduated microscope is made to coincide with the axial center line of the needle 8 or the collet 9, and centering and adjustment of protruding quantity of the needle are performed by monitoring the tip end part of the needle 8 from the horizontal direction. Accordingly adjustment of the needle can be performed precisely and rapidly.
JP17505680A 1980-12-11 1980-12-11 Adjustment of pick up needle Pending JPS5797642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17505680A JPS5797642A (en) 1980-12-11 1980-12-11 Adjustment of pick up needle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17505680A JPS5797642A (en) 1980-12-11 1980-12-11 Adjustment of pick up needle

Publications (1)

Publication Number Publication Date
JPS5797642A true JPS5797642A (en) 1982-06-17

Family

ID=15989454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17505680A Pending JPS5797642A (en) 1980-12-11 1980-12-11 Adjustment of pick up needle

Country Status (1)

Country Link
JP (1) JPS5797642A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62213263A (en) * 1986-03-14 1987-09-19 Toshiba Seiki Kk Apparatus for pushing up pellet
JPS62245644A (en) * 1986-04-18 1987-10-26 Toshiba Seiki Kk Semiconductor pellet pickup method
JPH0799228A (en) * 1993-10-29 1995-04-11 Toshiba Seiki Kk Pellet pushing-up device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62213263A (en) * 1986-03-14 1987-09-19 Toshiba Seiki Kk Apparatus for pushing up pellet
JPS62245644A (en) * 1986-04-18 1987-10-26 Toshiba Seiki Kk Semiconductor pellet pickup method
JPH0799228A (en) * 1993-10-29 1995-04-11 Toshiba Seiki Kk Pellet pushing-up device

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