[go: up one dir, main page]

JPS5790964A - Sealing method for semiconductor device - Google Patents

Sealing method for semiconductor device

Info

Publication number
JPS5790964A
JPS5790964A JP16783880A JP16783880A JPS5790964A JP S5790964 A JPS5790964 A JP S5790964A JP 16783880 A JP16783880 A JP 16783880A JP 16783880 A JP16783880 A JP 16783880A JP S5790964 A JPS5790964 A JP S5790964A
Authority
JP
Japan
Prior art keywords
sealing
sealing section
section
temperature
glass frit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16783880A
Other languages
Japanese (ja)
Inventor
Kiyoshi Sawae
Akio Inohara
Hisao Kawaguchi
Takeo Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP16783880A priority Critical patent/JPS5790964A/en
Publication of JPS5790964A publication Critical patent/JPS5790964A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the adhesive strength of a sealing material, and to improve the reliability of airtight sealing by a method whrein the sealing material is attached to a sealing section of a package with a hollow section and heated and hermetically sealed in an atmospheric gas, and gas pressure is incrased under a temperature-rise condition. CONSTITUTION:In a sealing method for the type package using glass frit, the atmospheric gas is supplied to a sealing device 2 through a flow rate regulating valve 1, and the gas is discharged previously by means of a leakage valve 3. The sealing section of the package is coated with the glass frit and housed in the device 2, the inside of the device is brought to proper pressure and the temperature is elevated, and the glass frit is melted and the sealing section is bonded. The temperature of the sealing section is elevated, and the sealing section is heated and held while the inner pressure of the device is increased, the glass frit sufficiently spreads to the sealing section, the temperature is dropped, the frit is cured while the leakage valve 3 is opened, the inner pressure is reduced and the sealing section is cooled. Accordingly, since the pressure difference of the inside and the outside of the vessel at the time of sealing is relaxed, the sealing section can be sealed in unform thickness, and the semiconductor device can be strengthened against a thermal shock, etc.
JP16783880A 1980-11-27 1980-11-27 Sealing method for semiconductor device Pending JPS5790964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16783880A JPS5790964A (en) 1980-11-27 1980-11-27 Sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16783880A JPS5790964A (en) 1980-11-27 1980-11-27 Sealing method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5790964A true JPS5790964A (en) 1982-06-05

Family

ID=15857011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16783880A Pending JPS5790964A (en) 1980-11-27 1980-11-27 Sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5790964A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425796A2 (en) * 1989-10-31 1991-05-08 International Business Machines Corporation Apparatus for and method using the apparatus for the encapsulation of electronic modules
US5151118A (en) * 1988-07-08 1992-09-29 Kabushiki Kaisha Goto Seisakusho Method for producing a package-type semiconductor assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151118A (en) * 1988-07-08 1992-09-29 Kabushiki Kaisha Goto Seisakusho Method for producing a package-type semiconductor assembly
EP0425796A2 (en) * 1989-10-31 1991-05-08 International Business Machines Corporation Apparatus for and method using the apparatus for the encapsulation of electronic modules
US5182424A (en) * 1989-10-31 1993-01-26 Vlastimil Frank Module encapsulation by induction heating

Similar Documents

Publication Publication Date Title
SE8103154L (en) PACKAGING PROCEDURE AND DEVICE
SE8601166D0 (en) PRESSURE-TIGHT PACKAGING
ES279822U (en) Method of sealing a glass container with a thin membrane closure
DE3665847D1 (en) Vacuum packaging process
GB1488331A (en) Hermetic sealing cover for a container for semi-conductor devices and method of fabricating the same
JPS5790964A (en) Sealing method for semiconductor device
KR890702268A (en) Alkaline metal electrode container filling and sealing device and method thereof
FR2423621A1 (en) Heatable double or multiple glazing - comprises glass panes with frame and built-in heater, and is sealed with butyl rubber and/or polyisobutylene putty
GB772972A (en) Improvements relating to the manufacture of insulating panels
ES482887A1 (en) Method of sealing metal foil closures to glass vessels
JPS57101815A (en) Production of display elemet
JPS5623755A (en) Assembly of semiconductor device
JPS5510781A (en) Preparation of cathode-ray tube
JPS5745522A (en) Sealing method of liquid crystal display cell
JPS5744967A (en) Manufacture of dry cell
JPS56122178A (en) Gas laser tube and manufacture thereof
JPS5790846A (en) Manufacture of vacuum valve
JPS567453A (en) Manufacture of semiconductor device
JPS5440795A (en) Easily openable sticked package and method of manufacture
JPS6278067A (en) Method of preventing leakage from plastic casing with clip
JPS56134508A (en) Synthetic method of diamond
JPS56137157A (en) Air-tight sealing method for gas rate sensor
GB1428829A (en) Containers for gassy liquids
JPS54128275A (en) Package for semiconductor device
JPS56144564A (en) Semiconductor device