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JPS5788753A - Lead frame and semiconductor device prepared by using the same - Google Patents

Lead frame and semiconductor device prepared by using the same

Info

Publication number
JPS5788753A
JPS5788753A JP16455380A JP16455380A JPS5788753A JP S5788753 A JPS5788753 A JP S5788753A JP 16455380 A JP16455380 A JP 16455380A JP 16455380 A JP16455380 A JP 16455380A JP S5788753 A JPS5788753 A JP S5788753A
Authority
JP
Japan
Prior art keywords
lead
tab
lead frame
permeation
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16455380A
Other languages
Japanese (ja)
Inventor
Tomio Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16455380A priority Critical patent/JPS5788753A/en
Publication of JPS5788753A publication Critical patent/JPS5788753A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the permeation of moisture by providing a step part on the side of a lead for suspending a tab of the pellet fitting part of a lead frame. CONSTITUTION:The tab 18 for fitting a pellet is supported monolithically on the lead side by the lead 16, while the thickness of the tab 18 and a heat-radiating piece 22 is larger than those of the lead 16 for suspension, an inner lead 14 and an outer lead 10. The taper part of the tab 18 for preventing slip-off is crushed 24, 26 by a mold to improve its adhesiveness to resin, while a groove 28 is formed thereon to prevent the permeation of moisture from the side of the heat-radiating piece 22. Moreover, a thin-plate-shaped part 30 is formed at the end surface on the lead side of the tab 18 by machining when the lead frame is punched out, and by a step part thus formed the permeation of moisture from the side of the lead 16 is prevented. A device sealed 34 with resin, which is prepared by using the lead frame having such a constitution, shows excellent wetproof property.
JP16455380A 1980-11-25 1980-11-25 Lead frame and semiconductor device prepared by using the same Pending JPS5788753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16455380A JPS5788753A (en) 1980-11-25 1980-11-25 Lead frame and semiconductor device prepared by using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16455380A JPS5788753A (en) 1980-11-25 1980-11-25 Lead frame and semiconductor device prepared by using the same

Publications (1)

Publication Number Publication Date
JPS5788753A true JPS5788753A (en) 1982-06-02

Family

ID=15795340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16455380A Pending JPS5788753A (en) 1980-11-25 1980-11-25 Lead frame and semiconductor device prepared by using the same

Country Status (1)

Country Link
JP (1) JPS5788753A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102988A1 (en) * 1982-03-08 1984-03-21 Motorola Inc Integrated circuit lead frame.
JP2007526181A (en) * 2004-03-05 2007-09-13 セアクイスト―レッフラー クンストシュトフヴェルク ゲーエムベーハー Closure of container holding fluid
JP2018113359A (en) * 2017-01-12 2018-07-19 ローム株式会社 Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102988A1 (en) * 1982-03-08 1984-03-21 Motorola Inc Integrated circuit lead frame.
JP2007526181A (en) * 2004-03-05 2007-09-13 セアクイスト―レッフラー クンストシュトフヴェルク ゲーエムベーハー Closure of container holding fluid
JP2018113359A (en) * 2017-01-12 2018-07-19 ローム株式会社 Semiconductor device

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