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JPS5770167A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS5770167A
JPS5770167A JP14738180A JP14738180A JPS5770167A JP S5770167 A JPS5770167 A JP S5770167A JP 14738180 A JP14738180 A JP 14738180A JP 14738180 A JP14738180 A JP 14738180A JP S5770167 A JPS5770167 A JP S5770167A
Authority
JP
Japan
Prior art keywords
epoxy resin
composition
adhesion
curing agent
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14738180A
Other languages
Japanese (ja)
Inventor
Tadahiko Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SURIIBONDO KK
ThreeBond Co Ltd
Original Assignee
SURIIBONDO KK
ThreeBond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SURIIBONDO KK, ThreeBond Co Ltd filed Critical SURIIBONDO KK
Priority to JP14738180A priority Critical patent/JPS5770167A/en
Publication of JPS5770167A publication Critical patent/JPS5770167A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: An adhesive with excellent shearing adhesion and peeling adhesion, obtd. by compounding a synthetic nitrile rubber, an epoxy resin and a curing agent for the epoxy resin in a specified proportion.
CONSTITUTION: 60W95wt% synthetic nitrile rubber, 5W40wt% epoxy resin and 0.1W20wt% curing agent for the epoxy resin are compounded. At 60wt% or lower of the synthetic nitrile rubber, the composition obtd. is not a rubber-like resilient body, which has not sufficient peeling adhesive. At 95wt% or more, the composition is excessively soft, so that desired peeling adhesion is not expectable. At 5wt% or less of the epoxy resin, the composition is too soft to obtain sufficient peeling adhesion. At 40wt% or more, the composition, not being a rubber-like resilient body, is inferior in peeling adhesion. As the curing agent for the epoxy resin, a thermosetting-type one is pref. to a cold curing-type one in view of shelf stability and heat sealability when necessary.
COPYRIGHT: (C)1982,JPO&Japio
JP14738180A 1980-10-21 1980-10-21 Adhesive composition Pending JPS5770167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14738180A JPS5770167A (en) 1980-10-21 1980-10-21 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14738180A JPS5770167A (en) 1980-10-21 1980-10-21 Adhesive composition

Publications (1)

Publication Number Publication Date
JPS5770167A true JPS5770167A (en) 1982-04-30

Family

ID=15428952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14738180A Pending JPS5770167A (en) 1980-10-21 1980-10-21 Adhesive composition

Country Status (1)

Country Link
JP (1) JPS5770167A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181870A (en) * 1985-02-05 1986-08-14 Yokohama Rubber Co Ltd:The Reactive hot melt

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014736A (en) * 1973-06-11 1975-02-17
JPS5028970A (en) * 1973-07-14 1975-03-24
JPS5230837A (en) * 1975-09-03 1977-03-08 Toshiba Chem Corp Thermostable compositions for use in adhesives and thermostable lamina ted boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014736A (en) * 1973-06-11 1975-02-17
JPS5028970A (en) * 1973-07-14 1975-03-24
JPS5230837A (en) * 1975-09-03 1977-03-08 Toshiba Chem Corp Thermostable compositions for use in adhesives and thermostable lamina ted boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181870A (en) * 1985-02-05 1986-08-14 Yokohama Rubber Co Ltd:The Reactive hot melt

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