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JPS5761036A - Film and multi-layer laminate excellent in dew condensation resistance - Google Patents

Film and multi-layer laminate excellent in dew condensation resistance

Info

Publication number
JPS5761036A
JPS5761036A JP13708880A JP13708880A JPS5761036A JP S5761036 A JPS5761036 A JP S5761036A JP 13708880 A JP13708880 A JP 13708880A JP 13708880 A JP13708880 A JP 13708880A JP S5761036 A JPS5761036 A JP S5761036A
Authority
JP
Japan
Prior art keywords
film
dew condensation
condensation resistance
evoh
nonionic surfactant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13708880A
Other languages
Japanese (ja)
Inventor
Yukio Ooseki
Kyoichiro Igari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Priority to JP13708880A priority Critical patent/JPS5761036A/en
Publication of JPS5761036A publication Critical patent/JPS5761036A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A beautiful, transparent film with excellent dew condensation resistance and gas barrier property, prepd. by compounding an ethylene-vinyl alcohol copolymer resin (EVOH) with a nonionic surfactant of specified HLB.
CONSTITUTION: EVOH of ethylene content 25W60mol% and saponificaton degree ≥90mol% is kneaded with 0.1W1.5wt% nonionic surfactant such as polyoxyethylene stearyl ether of HLB 7W16 by an extruder and pelletized. Then a film or sheet is formed from the resulting pellet. Said film is used for food packaging, etc. as such or as a multi-layer laminated film containing said film in the innermost layer. A resin used in the outermost layer of said laminated film is pref. cellophane for excluding moisture or polypropylene when exclusion of moisture is unnecessary.
COPYRIGHT: (C)1982,JPO&Japio
JP13708880A 1980-09-30 1980-09-30 Film and multi-layer laminate excellent in dew condensation resistance Pending JPS5761036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13708880A JPS5761036A (en) 1980-09-30 1980-09-30 Film and multi-layer laminate excellent in dew condensation resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13708880A JPS5761036A (en) 1980-09-30 1980-09-30 Film and multi-layer laminate excellent in dew condensation resistance

Publications (1)

Publication Number Publication Date
JPS5761036A true JPS5761036A (en) 1982-04-13

Family

ID=15190595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13708880A Pending JPS5761036A (en) 1980-09-30 1980-09-30 Film and multi-layer laminate excellent in dew condensation resistance

Country Status (1)

Country Link
JP (1) JPS5761036A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183917U (en) * 1984-11-07 1986-06-03
JPS6218253A (en) * 1985-07-16 1987-01-27 株式会社日本ポリテック Laminated film and laminated sheet using said film
JPH03116355U (en) * 1990-03-14 1991-12-02
JPH0429981A (en) * 1990-02-05 1992-01-31 Morishita Pharmaceut Co Ltd Piperazinylquinazoline derivative and fluorescent labeling reagent containing the same
JP2001502959A (en) * 1996-10-24 2001-03-06 コーニング インコーポレイテッド How to create a low binding surface
EP1145843A1 (en) * 2000-04-12 2001-10-17 Wolff Walsrode AG Heat sealable film containing antifog properties and oxygen barrier properties and use as packaging material
WO2018168903A1 (en) * 2017-03-15 2018-09-20 株式会社クラレ Resin composition, production method for resin composition, and molded body using resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586829A (en) * 1978-12-25 1980-07-01 Kuraray Co Ltd Resin composition for molding and laminate molding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586829A (en) * 1978-12-25 1980-07-01 Kuraray Co Ltd Resin composition for molding and laminate molding

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183917U (en) * 1984-11-07 1986-06-03
JPS6218253A (en) * 1985-07-16 1987-01-27 株式会社日本ポリテック Laminated film and laminated sheet using said film
JPH0429981A (en) * 1990-02-05 1992-01-31 Morishita Pharmaceut Co Ltd Piperazinylquinazoline derivative and fluorescent labeling reagent containing the same
JPH03116355U (en) * 1990-03-14 1991-12-02
JP2001502959A (en) * 1996-10-24 2001-03-06 コーニング インコーポレイテッド How to create a low binding surface
EP1145843A1 (en) * 2000-04-12 2001-10-17 Wolff Walsrode AG Heat sealable film containing antifog properties and oxygen barrier properties and use as packaging material
WO2018168903A1 (en) * 2017-03-15 2018-09-20 株式会社クラレ Resin composition, production method for resin composition, and molded body using resin composition
JP6411705B1 (en) * 2017-03-15 2018-10-24 株式会社クラレ Resin composition, method for producing the same, and molded article using the same
CN110603292A (en) * 2017-03-15 2019-12-20 株式会社可乐丽 Resin composition, method for producing same, and molded article using same
CN110603292B (en) * 2017-03-15 2022-04-19 株式会社可乐丽 Resin composition, method for producing same, and molded article using same
US11560464B2 (en) 2017-03-15 2023-01-24 Kuraray Co., Ltd. Resin composition, production method for resin composition, and molded body using resin composition

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