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JPS5750446A - Laser scribing method - Google Patents

Laser scribing method

Info

Publication number
JPS5750446A
JPS5750446A JP12632680A JP12632680A JPS5750446A JP S5750446 A JPS5750446 A JP S5750446A JP 12632680 A JP12632680 A JP 12632680A JP 12632680 A JP12632680 A JP 12632680A JP S5750446 A JPS5750446 A JP S5750446A
Authority
JP
Japan
Prior art keywords
wafer
accordance
orientation flat
processing groove
micro cracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12632680A
Other languages
Japanese (ja)
Other versions
JPS5855666B2 (en
Inventor
Ken Ishikawa
Susumu Yahagi
Bunji Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55126326A priority Critical patent/JPS5855666B2/en
Publication of JPS5750446A publication Critical patent/JPS5750446A/en
Publication of JPS5855666B2 publication Critical patent/JPS5855666B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To form a processing groove for scribe without producing micro cracks by a method wherein the scanning is performed by limitting the scanning direction of a laser beam to a fixed direction decided in accordance with the crystal structure of a semiconductor wafer. CONSTITUTION:A wafer 2 is set on an XY table 1 so that the orientation flat 2a of the wafer 2 may be positioned at a predetermined forming position. A laser oscillator 4 and the XY table 1 are driven and laser beams 9 are made to scan with a fixed direction in accordance with the scribed lines run in parallel with the orientation flat 2a and a processing groove for cutting the wafer 2 is formed. This method prevents the occurrence of micro cracks and reduces the scribed lines and the forming density of a semiconductor element is increased to contrive the improvement of the yield.
JP55126326A 1980-09-11 1980-09-11 Laser scribing method Expired JPS5855666B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55126326A JPS5855666B2 (en) 1980-09-11 1980-09-11 Laser scribing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55126326A JPS5855666B2 (en) 1980-09-11 1980-09-11 Laser scribing method

Publications (2)

Publication Number Publication Date
JPS5750446A true JPS5750446A (en) 1982-03-24
JPS5855666B2 JPS5855666B2 (en) 1983-12-10

Family

ID=14932409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55126326A Expired JPS5855666B2 (en) 1980-09-11 1980-09-11 Laser scribing method

Country Status (1)

Country Link
JP (1) JPS5855666B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567964A (en) * 1993-06-29 1996-10-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415096Y2 (en) * 1987-07-20 1992-04-06

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567964A (en) * 1993-06-29 1996-10-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5693553A (en) * 1993-06-29 1997-12-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method of the same

Also Published As

Publication number Publication date
JPS5855666B2 (en) 1983-12-10

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