JPS5745959Y2 - - Google Patents

Info

Publication number: JPS5745959Y2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP1980057921U

Other languages

Other versions

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-04-25

Filing date

1980-04-25

Publication date

1982-10-09

1980-04-25 Application filed filed Critical

1980-04-25 Priority to JP1980057921U priority Critical patent/JPS5745959Y2/ja

1981-11-27 Publication of JPS56159037U publication Critical patent/JPS56159037U/ja

1982-10-09 Application granted granted Critical

1982-10-09 Publication of JPS5745959Y2 publication Critical patent/JPS5745959Y2/ja

Status Expired legal-status Critical Current

Links

JP1980057921U 1980-04-25 1980-04-25 Expired JPS5745959Y2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1980057921U JPS5745959Y2 (en)	1980-04-25	1980-04-25

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1980057921U JPS5745959Y2 (en)	1980-04-25	1980-04-25

Publications (2)

Publication Number	Publication Date
JPS56159037U JPS56159037U (en)	1981-11-27
JPS5745959Y2 true JPS5745959Y2 (en)	1982-10-09

Family

ID=29652404

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1980057921U Expired JPS5745959Y2 (en)	1980-04-25	1980-04-25

Country Status (1)

Country	Link
JP (1)	JPS5745959Y2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7102208B1 (en)	1999-10-15	2006-09-05	Amkor Technology, Inc.	Leadframe and semiconductor package with improved solder joint strength
US7192807B1 (en)	2002-11-08	2007-03-20	Amkor Technology, Inc.	Wafer level package and fabrication method
US7361533B1 (en)	2002-11-08	2008-04-22	Amkor Technology, Inc.	Stacked embedded leadframe
US7572681B1 (en)	2005-12-08	2009-08-11	Amkor Technology, Inc.	Embedded electronic component package
US8900995B1 (en)	2010-10-05	2014-12-02	Amkor Technology, Inc.	Semiconductor device and manufacturing method thereof
US8937381B1 (en)	2009-12-03	2015-01-20	Amkor Technology, Inc.	Thin stackable package and method
US8981572B1 (en)	2011-11-29	2015-03-17	Amkor Technology, Inc.	Conductive pad on protruding through electrode semiconductor device
US9159672B1 (en)	2010-08-02	2015-10-13	Amkor Technology, Inc.	Through via connected backside embedded circuit features structure and method
US9324614B1 (en)	2010-04-06	2016-04-26	Amkor Technology, Inc.	Through via nub reveal method and structure
US9362210B2 (en)	2000-04-27	2016-06-07	Amkor Technology, Inc.	Leadframe and semiconductor package made using the leadframe

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS579080Y2 (en) *	1979-08-29	1982-02-22

1980
- 1980-04-25 JP JP1980057921U patent/JPS5745959Y2/ja not_active Expired

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7102208B1 (en)	1999-10-15	2006-09-05	Amkor Technology, Inc.	Leadframe and semiconductor package with improved solder joint strength
US9362210B2 (en)	2000-04-27	2016-06-07	Amkor Technology, Inc.	Leadframe and semiconductor package made using the leadframe
US7192807B1 (en)	2002-11-08	2007-03-20	Amkor Technology, Inc.	Wafer level package and fabrication method
US7247523B1 (en)	2002-11-08	2007-07-24	Amkor Technology, Inc.	Two-sided wafer escape package
US7361533B1 (en)	2002-11-08	2008-04-22	Amkor Technology, Inc.	Stacked embedded leadframe
US7420272B1 (en)	2002-11-08	2008-09-02	Amkor Technology, Inc.	Two-sided wafer escape package
US8691632B1 (en)	2002-11-08	2014-04-08	Amkor Technology, Inc.	Wafer level package and fabrication method
US9406645B1 (en)	2002-11-08	2016-08-02	Amkor Technology, Inc.	Wafer level package and fabrication method
US8952522B1 (en)	2002-11-08	2015-02-10	Amkor Technology, Inc.	Wafer level package and fabrication method
US7572681B1 (en)	2005-12-08	2009-08-11	Amkor Technology, Inc.	Embedded electronic component package
US8937381B1 (en)	2009-12-03	2015-01-20	Amkor Technology, Inc.	Thin stackable package and method
US9324614B1 (en)	2010-04-06	2016-04-26	Amkor Technology, Inc.	Through via nub reveal method and structure
US9159672B1 (en)	2010-08-02	2015-10-13	Amkor Technology, Inc.	Through via connected backside embedded circuit features structure and method
US8900995B1 (en)	2010-10-05	2014-12-02	Amkor Technology, Inc.	Semiconductor device and manufacturing method thereof
US8981572B1 (en)	2011-11-29	2015-03-17	Amkor Technology, Inc.	Conductive pad on protruding through electrode semiconductor device
US9431323B1 (en)	2011-11-29	2016-08-30	Amkor Technology, Inc.	Conductive pad on protruding through electrode

Also Published As

Publication number	Publication date
JPS56159037U (en)	1981-11-27

Publication	Publication Date	Title
FR2473077B1 (en)	1983-05-06
FR2474044B1 (en)	1984-04-13
FR2473676B3 (en)	1982-10-22
DE3153241A1 (en)	1985-05-09
CH654535B (en)	1986-02-28
FR2474019B1 (en)	1984-12-28
FR2473281B1 (en)	1984-02-24
DE3050591T1 (en)	1982-10-07
FR2473422B1 (en)	1988-04-29
FR2473305B1 (en)	1984-07-13
FR2474004B3 (en)	1982-10-29
FR2473999B1 (en)	1984-01-06
FR2473513B1 (en)	1984-03-09
CH655603B (en)	1986-04-30
FR2474047B1 (en)	1985-03-08
FR2473291B1 (en)	1983-12-23
FR2473224B1 (en)	1984-04-27
FR2473388B1 (en)	1984-04-20
FR2473491B3 (en)	1983-10-14
CH653577B (en)	1986-01-15
FR2473558B1 (en)	1982-01-29
CH655460B (en)	1986-04-30
FR2473532B1 (en)	1984-04-27
DK29281A (en)	1981-07-24
FR2473608B1 (en)	1983-10-28