JPS5744439A - Dowel positioning method for cold forging - Google Patents
Dowel positioning method for cold forgingInfo
- Publication number
- JPS5744439A JPS5744439A JP12094280A JP12094280A JPS5744439A JP S5744439 A JPS5744439 A JP S5744439A JP 12094280 A JP12094280 A JP 12094280A JP 12094280 A JP12094280 A JP 12094280A JP S5744439 A JPS5744439 A JP S5744439A
- Authority
- JP
- Japan
- Prior art keywords
- die
- flow
- raw material
- punch
- dowel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010273 cold forging Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 6
- 239000002994 raw material Substances 0.000 abstract 5
- 230000000452 restraining effect Effects 0.000 abstract 1
Landscapes
- Forging (AREA)
Abstract
PURPOSE: To minimize any gap for dowel position and precisely finish the material around it, by constituting a pit corresponding to the dowel on a fixed die and restraining an external periphery of the raw material so as to flow out an excess material can be flowed out in the direction contrary to the dowel.
CONSTITUTION: A ring-shaped clearance 115 allowing smooth flow of material is constituted between an external side surface 116 at the top end of a punch 104 and an internal circumferential surface at major diametral part 113 of a die for allowing a relief for any excess material, so as to flow the material smoothly when a punch 104 is intruded into a die 101. When the punch 104 is intruded into the die 101 after the raw material 107a being inserted into the inside of major diametral part 113 of the die, the flow of excess raw material coming into the clearance 115 invites its fluidity. Therefore, the raw material is able to flow smoothly into a pit 105. By providing such clearance 115 allowing easy flow of the material, the pressure exerted on the surface of a die by intrusion of the punch 104 is minimized and the raw material is smoothly flown so that a life of the die is extremely lengthened.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12094280A JPS5744439A (en) | 1980-09-01 | 1980-09-01 | Dowel positioning method for cold forging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12094280A JPS5744439A (en) | 1980-09-01 | 1980-09-01 | Dowel positioning method for cold forging |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5306083A Division JPS591042A (en) | 1983-03-29 | 1983-03-29 | Dowel forming forging die |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5744439A true JPS5744439A (en) | 1982-03-12 |
JPS6342528B2 JPS6342528B2 (en) | 1988-08-24 |
Family
ID=14798776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12094280A Granted JPS5744439A (en) | 1980-09-01 | 1980-09-01 | Dowel positioning method for cold forging |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5744439A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982135A (en) * | 1982-11-02 | 1984-05-12 | Musashi Seimitsu Kogyo Kk | Forming method of dowel by closed cold forging |
JPH03207596A (en) * | 1990-01-10 | 1991-09-10 | Mitsubishi Materials Corp | Pb alloy solder material for assembling semiconductor device |
JP2021115592A (en) * | 2020-01-24 | 2021-08-10 | 愛知製鋼株式会社 | Forging device |
-
1980
- 1980-09-01 JP JP12094280A patent/JPS5744439A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982135A (en) * | 1982-11-02 | 1984-05-12 | Musashi Seimitsu Kogyo Kk | Forming method of dowel by closed cold forging |
JPH034288B2 (en) * | 1982-11-02 | 1991-01-22 | Musashi Seimitsu Kogyo Kk | |
JPH03207596A (en) * | 1990-01-10 | 1991-09-10 | Mitsubishi Materials Corp | Pb alloy solder material for assembling semiconductor device |
JP2021115592A (en) * | 2020-01-24 | 2021-08-10 | 愛知製鋼株式会社 | Forging device |
Also Published As
Publication number | Publication date |
---|---|
JPS6342528B2 (en) | 1988-08-24 |
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