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JPS5732673A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS5732673A
JPS5732673A JP10868880A JP10868880A JPS5732673A JP S5732673 A JPS5732673 A JP S5732673A JP 10868880 A JP10868880 A JP 10868880A JP 10868880 A JP10868880 A JP 10868880A JP S5732673 A JPS5732673 A JP S5732673A
Authority
JP
Japan
Prior art keywords
layer
oxidized film
film
electrically insulating
silicon substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10868880A
Other languages
Japanese (ja)
Inventor
Masayuki Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10868880A priority Critical patent/JPS5732673A/en
Publication of JPS5732673A publication Critical patent/JPS5732673A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]

Abstract

PURPOSE:To obtain an MIS transistor having less short channel effect and high performance by converting the depletion layer generating region of a semiconductor substrate directly under a gate oxidized film into an electrically insulating layer, thereby suppressing the extension of a drain side depletion layer. CONSTITUTION:Drain and source layers 2 and 3 of reversely conductive impurity conductive layer to the conductive type of a silicon substrate are formed in a silicon substrate 1, the intermediate part between the source layer 3 and the drain layer 2 of the oxidized film on the surface of the silicon substrate is partly removed, a gate oxidized film 4 is formed in the intermediate part, and the remaining thick oxidized film is retained on the other part as a field oxidized film 5. To form an electrically insulating layer 10 directly under the film 4, an element forming electrically insulating compound by reacting with the silicon is introduced by an ion implantation method through the film 4.
JP10868880A 1980-08-06 1980-08-06 Semiconductor device and manufacture thereof Pending JPS5732673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10868880A JPS5732673A (en) 1980-08-06 1980-08-06 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10868880A JPS5732673A (en) 1980-08-06 1980-08-06 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS5732673A true JPS5732673A (en) 1982-02-22

Family

ID=14491126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10868880A Pending JPS5732673A (en) 1980-08-06 1980-08-06 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5732673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791181A1 (en) * 1999-03-19 2000-09-22 France Telecom NOVEL METAL GRID TRANSISTOR AND UNDERGROUND CHANNEL, COUNTER-DOPING, AND MANUFACTURING METHOD

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52144979A (en) * 1976-05-28 1977-12-02 Hitachi Ltd Transistor
JPS538077A (en) * 1976-07-09 1978-01-25 Matsushita Electric Ind Co Ltd Field effect transistor and its production
JPS5492075A (en) * 1977-12-28 1979-07-20 Seiko Epson Corp Semiconductor device
JPS55148464A (en) * 1979-05-08 1980-11-19 Chiyou Lsi Gijutsu Kenkyu Kumiai Mos semiconductor device and its manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52144979A (en) * 1976-05-28 1977-12-02 Hitachi Ltd Transistor
JPS538077A (en) * 1976-07-09 1978-01-25 Matsushita Electric Ind Co Ltd Field effect transistor and its production
JPS5492075A (en) * 1977-12-28 1979-07-20 Seiko Epson Corp Semiconductor device
JPS55148464A (en) * 1979-05-08 1980-11-19 Chiyou Lsi Gijutsu Kenkyu Kumiai Mos semiconductor device and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791181A1 (en) * 1999-03-19 2000-09-22 France Telecom NOVEL METAL GRID TRANSISTOR AND UNDERGROUND CHANNEL, COUNTER-DOPING, AND MANUFACTURING METHOD
WO2000057482A1 (en) * 1999-03-19 2000-09-28 France Telecom Novel transistor with metal gate and buried counter-doped channel and method for making same

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