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JPS5732375A - Etching method for thin film - Google Patents

Etching method for thin film

Info

Publication number
JPS5732375A
JPS5732375A JP10437480A JP10437480A JPS5732375A JP S5732375 A JPS5732375 A JP S5732375A JP 10437480 A JP10437480 A JP 10437480A JP 10437480 A JP10437480 A JP 10437480A JP S5732375 A JPS5732375 A JP S5732375A
Authority
JP
Japan
Prior art keywords
layer
thin film
etching
substrate
margin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10437480A
Other languages
Japanese (ja)
Inventor
Masatoshi Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP10437480A priority Critical patent/JPS5732375A/en
Publication of JPS5732375A publication Critical patent/JPS5732375A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE: To surely recognize the state of progress during etching by forming a resist film having a prescribed pattern on a multilayer thin film laid on a substrate and leaving an etching margin made of thin film to be etched at a part except the pattern.
CONSTITUTION: A thin film consisting of the 1st layer 5 and the 2nd layer 6 is laid on a substrate 4, and a resist 7 having a prescribed pattern is formed on the layers. At an etching margin 8 the 2nd layer is directly formed on the substrate 4. By carrying out etching in this state, the part of the layer 6 not covered with the resist 7 is etched to form a pattern. At the same time, the layer 6 of the margin 8 is etched. Accordingly, even if the layer 5 is similar to the layer 6 in color tone, the state of etching can be judged by the difference between the margin 8 and the substrate 4 in color tone.
COPYRIGHT: (C)1982,JPO&Japio
JP10437480A 1980-07-31 1980-07-31 Etching method for thin film Pending JPS5732375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10437480A JPS5732375A (en) 1980-07-31 1980-07-31 Etching method for thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10437480A JPS5732375A (en) 1980-07-31 1980-07-31 Etching method for thin film

Publications (1)

Publication Number Publication Date
JPS5732375A true JPS5732375A (en) 1982-02-22

Family

ID=14379006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10437480A Pending JPS5732375A (en) 1980-07-31 1980-07-31 Etching method for thin film

Country Status (1)

Country Link
JP (1) JPS5732375A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038094A (en) * 2007-07-31 2009-02-19 Hitachi Aic Inc Manufacturing method of multilayer wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038094A (en) * 2007-07-31 2009-02-19 Hitachi Aic Inc Manufacturing method of multilayer wiring board

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