JPS5729310Y2 - - Google Patents

Info

Publication number: JPS5729310Y2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP14643076U

Other languages

Other versions

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-10-30

Filing date

1976-10-30

Publication date

1982-06-26

1976-10-30 Application filed filed Critical

1976-10-30 Priority to JP14643076U priority Critical patent/JPS5729310Y2/ja

1978-06-03 Publication of JPS5366065U publication Critical patent/JPS5366065U/ja

1982-06-26 Application granted granted Critical

1982-06-26 Publication of JPS5729310Y2 publication Critical patent/JPS5729310Y2/ja

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

Wire Bonding (AREA)

JP14643076U 1976-10-30 1976-10-30 Expired JPS5729310Y2 (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP14643076U JPS5729310Y2 (fr)	1976-10-30	1976-10-30

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP14643076U JPS5729310Y2 (fr)	1976-10-30	1976-10-30

Publications (2)

Publication Number	Publication Date
JPS5366065U JPS5366065U (fr)	1978-06-03
JPS5729310Y2 true JPS5729310Y2 (fr)	1982-06-26

Family

ID=28754921

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP14643076U Expired JPS5729310Y2 (fr)	1976-10-30	1976-10-30

Country Status (1)

Country	Link
JP (1)	JPS5729310Y2 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5091263A (fr) *	1973-12-12	1975-07-21

1976
- 1976-10-30 JP JP14643076U patent/JPS5729310Y2/ja not_active Expired

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5091263A (fr) *	1973-12-12	1975-07-21

Also Published As

Publication number	Publication date
JPS5366065U (fr)	1978-06-03

Publication	Publication Date	Title
JPS5729310Y2 (fr)	1982-06-26
CS176344B1 (fr)	1977-06-30
BG23051A1 (fr)	1977-07-12
CH594316A5 (fr)	1978-01-13
CH597046A5 (fr)	1978-03-31
CH597507A5 (fr)	1978-04-14
CH598682A5 (fr)	1978-05-12
CH598888A5 (fr)	1978-05-12
CH599432A5 (fr)	1978-05-31
CH599781A5 (fr)	1978-05-31
CH600316A5 (fr)	1978-06-15
CH600358A5 (fr)	1978-06-15
CH600509A5 (fr)	1978-06-15
CH600682A5 (fr)	1978-06-30
CH600811A5 (fr)	1978-06-30
CH600862A5 (fr)	1978-06-30
CH601008A5 (fr)	1978-06-30
CH601322A5 (fr)	1978-07-14
CH601730A5 (fr)	1978-07-14
CH601904A5 (fr)	1978-07-14
CH602711A5 (fr)	1978-07-31
CH603932A5 (fr)	1978-08-31
CH607686A5 (fr)	1978-10-13
CH610433A5 (fr)	1979-04-12
CH610633A5 (fr)	1979-04-30