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JPS5728347A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5728347A
JPS5728347A JP10345780A JP10345780A JPS5728347A JP S5728347 A JPS5728347 A JP S5728347A JP 10345780 A JP10345780 A JP 10345780A JP 10345780 A JP10345780 A JP 10345780A JP S5728347 A JPS5728347 A JP S5728347A
Authority
JP
Japan
Prior art keywords
tie
frame
leads
regions
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10345780A
Other languages
Japanese (ja)
Other versions
JPH02859B2 (en
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10345780A priority Critical patent/JPS5728347A/en
Publication of JPS5728347A publication Critical patent/JPS5728347A/en
Publication of JPH02859B2 publication Critical patent/JPH02859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deformation of leads while they are being curved, simplify the process and improve yield, by a method wherein the tie-bar width at the four corner regions of a tie-bar frame for a flat-package lead and frame is made narrower than other regions. CONSTITUTION:The width of tie bars 7' at four corner regins 8 of a tie-bar frame 6' having a plurality of inward leads 5 extending from the inner edges of the frame 6' is determined one third or one fourth of a package base 1, the ends of the respective leads of said frame are soldered, and then the base 1 is inserted and fitted into a lower mold 11 so that the leads 5 are held by regions of a required length l, and they are pressed by an upper mold 12 to bend then into an L shape. The narrow regions of the tie-bars 7' absorb the strain due to the pressing process, so that they are not deformed during the bending process after soldering, and the yield is improved. In addition, simple manufacturing process is obtained.
JP10345780A 1980-07-28 1980-07-28 Lead frame Granted JPS5728347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10345780A JPS5728347A (en) 1980-07-28 1980-07-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10345780A JPS5728347A (en) 1980-07-28 1980-07-28 Lead frame

Publications (2)

Publication Number Publication Date
JPS5728347A true JPS5728347A (en) 1982-02-16
JPH02859B2 JPH02859B2 (en) 1990-01-09

Family

ID=14354548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10345780A Granted JPS5728347A (en) 1980-07-28 1980-07-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS5728347A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395664U (en) * 1990-01-11 1991-09-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395664U (en) * 1990-01-11 1991-09-30

Also Published As

Publication number Publication date
JPH02859B2 (en) 1990-01-09

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