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JPS572316A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS572316A
JPS572316A JP7591080A JP7591080A JPS572316A JP S572316 A JPS572316 A JP S572316A JP 7591080 A JP7591080 A JP 7591080A JP 7591080 A JP7591080 A JP 7591080A JP S572316 A JPS572316 A JP S572316A
Authority
JP
Japan
Prior art keywords
organic group
integer
formula
resin composition
functional organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7591080A
Other languages
Japanese (ja)
Other versions
JPH029050B2 (en
Inventor
Kazuyuki Tomonaga
Kiyoji Makino
Tsutomu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP7591080A priority Critical patent/JPS572316A/en
Publication of JPS572316A publication Critical patent/JPS572316A/en
Publication of JPH029050B2 publication Critical patent/JPH029050B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: The titled resin composition, containing an unsaturated polyamide-imide resin obtained by reacting three specific compounds and a polymaleimide, and having improved mechanical characteristics, processability and heat resistance.
CONSTITUTION: A resin composition prepared by incorporating (A) 100pts.wt. polymaleimide expressed by formula I (R1 is n-functional organic group; X1 and X2 are H, halogen or monofunctional organic group; n is an integer ≥2) with (B) preferably 25W300pts.wt. unsaturated polyamide-imide resin obtained by reacting (i) a polyisocyanate expreseed by formula II (R2 is m-functional organic group; m is an integer ≥2), e.g. hexamethylene diisocyanate, with (ii) a polycarboxylic acid expressed by formula III (R2 is p-functional organic group containing -C=C-; p is an integer ≥2), e.g. maleic acid, and (iii) a polycarboxylic acid anhydride expressed by formula IV (R4 is q-functional organic group; q is an integer ≥2), e.g. pyromellitic anhydride.
COPYRIGHT: (C)1982,JPO&Japio
JP7591080A 1980-06-05 1980-06-05 Thermosetting resin composition Granted JPS572316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7591080A JPS572316A (en) 1980-06-05 1980-06-05 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7591080A JPS572316A (en) 1980-06-05 1980-06-05 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS572316A true JPS572316A (en) 1982-01-07
JPH029050B2 JPH029050B2 (en) 1990-02-28

Family

ID=13589955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7591080A Granted JPS572316A (en) 1980-06-05 1980-06-05 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS572316A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62153313A (en) * 1985-12-27 1987-07-08 Japan Synthetic Rubber Co Ltd Organic solvent-soluble polyimide and its production
JPH02204029A (en) * 1985-04-18 1990-08-14 Hitachi Chem Co Ltd Manufacture of substrate for printed circuit panel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837246A (en) * 1971-09-16 1973-06-01
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS5489623A (en) * 1977-12-27 1979-07-16 Asahi Chemical Ind Heat resistant photoresist composition and production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837246A (en) * 1971-09-16 1973-06-01
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS5489623A (en) * 1977-12-27 1979-07-16 Asahi Chemical Ind Heat resistant photoresist composition and production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02204029A (en) * 1985-04-18 1990-08-14 Hitachi Chem Co Ltd Manufacture of substrate for printed circuit panel
JPS62153313A (en) * 1985-12-27 1987-07-08 Japan Synthetic Rubber Co Ltd Organic solvent-soluble polyimide and its production

Also Published As

Publication number Publication date
JPH029050B2 (en) 1990-02-28

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